IV-VI AND III-V QUANTUM DOT STRUCTURES IN A V-VI MATRIX
    1.
    发明申请
    IV-VI AND III-V QUANTUM DOT STRUCTURES IN A V-VI MATRIX 审中-公开
    V-VI矩阵中的IV-VI和III-V量子点结构

    公开(公告)号:US20150107640A1

    公开(公告)日:2015-04-23

    申请号:US14517345

    申请日:2014-10-17

    IPC分类号: H01L35/16 H01L35/34 H01L35/18

    CPC分类号: H01L35/16 H01L35/26 H01L35/34

    摘要: A thermoelectric material and methods of manufacturing thereof are disclosed. In general, the thermoelectric material comprises a Group V-VI host, or matrix, material and Group III-V or Group IV-VI nanoinclusions within the Group V-VI host material. By incorporating the Group III-V or Group IV-VI nanoinclusions into the Group V-VI host material, the performance of the thermoelectric material can be improved.

    摘要翻译: 公开了一种热电材料及其制造方法。 通常,该热电材料包含V-VI族主体材料中的V-VI族主体或基体材料以及III-V族或IV-VI族纳米结构。 通过将III-V族或IV-VI族纳米级纳入V-VI族主体材料中,可以提高热电材料的性能。

    LOW RESISTIVITY OHMIC CONTACT
    3.
    发明申请
    LOW RESISTIVITY OHMIC CONTACT 有权
    低电阻OHMIC联系

    公开(公告)号:US20150200098A1

    公开(公告)日:2015-07-16

    申请号:US14599123

    申请日:2015-01-16

    摘要: Embodiments of a low resistivity ohmic contact are disclosed. In some embodiments, a method of fabricating a low resistivity ohmic contact includes providing a semiconductor material layer and intentionally roughening the semiconductor material layer to create a characteristic surface roughness. The method also includes providing an ohmic contact metal layer on a surface of the semiconductor material layer and providing a diffusion barrier metal layer on a surface of the ohmic contact metal layer opposite the semiconductor material layer. In this way, the adhesive force between the semiconductor material layer and the ohmic contact metal layer may be increased.

    摘要翻译: 公开了低电阻率欧姆接触的实施例。 在一些实施例中,制造低电阻率欧姆接触的方法包括提供半导体材料层并有意地使半导体材料层变粗糙以产生特征表面粗糙度。 该方法还包括在半导体材料层的表面上提供欧姆接触金属层,并在与半导体材料层相对的欧姆接触金属层的表面上提供扩散阻挡金属层。 以这种方式,可以增加半导体材料层和欧姆接触金属层之间的粘合力。

    THERMOREFLECTANCE-BASED CHARACTERIZATION OF THERMOELECTRIC MATERIAL PROPERTIES
    4.
    发明申请
    THERMOREFLECTANCE-BASED CHARACTERIZATION OF THERMOELECTRIC MATERIAL PROPERTIES 审中-公开
    热电材料特性的基于热变换的特征

    公开(公告)号:US20150110156A1

    公开(公告)日:2015-04-23

    申请号:US14517416

    申请日:2014-10-17

    IPC分类号: G01K11/12 G01K7/08 G01N21/17

    摘要: Systems and methods for characterizing one or more properties of a material are disclosed. In some embodiments, the one or more properties include one or more thermal properties of the material, one or more thermoelectric properties of the material, and/or one or more thermomagnetic properties of the material. In some embodiments, a method of characterizing one or more properties of a sample material comprises heating the sample material and, while heating the sample material, obtaining one or more temperature measurements for at least one surface of the sample material via one or more thermoreflectance probes and obtaining one or more electric measurements for the sample material that correspond in time to the one or more temperature measurements. The method further comprises computing one or more parameters that characterize one or more properties of the sample material based on the measurements.

    摘要翻译: 公开了用于表征材料的一种或多种性质的系统和方法。 在一些实施方案中,一个或多个性质包括材料的一种或多种热性质,材料的一种或多种热电性质和/或材料的一种或多种热磁性质。 在一些实施例中,表征样品材料的一个或多个性质的方法包括加热样品材料,并且在加热样品材料的同时,通过一个或多个热反射探针获得样品材料的至少一个表面的一个或多个温度测量值 以及获得对于与所述一个或多个温度测量值在时间上对应的样品材料的一个或多个电测量。 该方法还包括基于测量来计算表征样品材料的一个或多个特性的一个或多个参数。