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    Solder preform wrappable around a printed circuit card edge
    2.
    发明授权
    Solder preform wrappable around a printed circuit card edge 失效
    焊接预制件围绕印刷电路卡边缘封装

    公开(公告)号：US5600102A

    公开(公告)日：1997-02-04

    申请号：US607795

    申请日：1996-02-27

    Applicant: Paul A. Socha

    Inventor： Paul A. Socha

    IPC: H01R43/02 ,  H05K1/11 ,  H05K3/34 ,  H05K1/02

    CPC classification number: H01R12/721 ,  H01R43/0235 ,  H05K3/3405 ,  H01R12/57 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2203/0415 ,  H05K3/3478 ,  Y10T29/49149 ,  Y10T29/49151

    Abstract: An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined conductive pad arrangements. The integral solder preform has first and second pluralites of solder pads having respective first and second solder pad arrangements which are maintained in position by a plurality of bridging solder bands. The first and second solder pad arrangements correspond to the first and second predetermined conductive pad arrangements and are spaced apart by a predetermined distance by spacing solder bands. The printed circuit card is aligned over the spacing solder bands and the first and second solder pad arrangements are wrapped around the first edge such that the first and second solder pad pluralities of solder pads overlay respective first and second pluralities of conductive pads on the printed circuit card. A fixture which may be employed to facilitate the alignment of the solder preform for use with the solder preform is also disclosed.

    Abstract translation: 公开了用于应用于具有第一和第二侧的印刷电路卡的整体焊料预制件，第一边缘以及布置在印刷电路卡的相应第一和第二侧上的第一和第二多个导电焊盘，分别在第一和第二预定导电 垫安排。 整体焊料预制件具有第一和第二多个焊盘，其具有相应的第一和第二焊料焊盘布置，其通过多个桥接焊料带保持在适当的位置。 第一和第二焊盘布置对应于第一和第二预定导电焊盘布置，并且通过间隔焊料带间隔预定距离。 印刷电路卡在间隔焊料带上对准，并且第一和第二焊料焊盘装置围绕第一边缘缠绕，使得第一和第二焊料焊盘多个焊盘覆盖印刷电路上相应的第一和第二多个导电焊盘 卡。 还公开了可用于促进焊料预制件与焊料预制件一起使用的夹具。

    Integrated solder preform array having a tin outer coating
    4.
    发明授权
    Integrated solder preform array having a tin outer coating 失效
    具有锡外涂层的集成焊料预制件阵列

    公开(公告)号：US5957364A

    公开(公告)日：1999-09-28

    申请号：US661179

    申请日：1996-06-10

    Applicant: Paul A. Socha

    Inventor： Paul A. Socha

    IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  B23K35/22

    CPC classification number: H05K3/3478 ,  B23K35/0222 ,  H05K2201/0305 ,  H05K2201/10424 ,  H05K2203/0415 ,  H05K2203/0435 ,  H05K3/3447

    Abstract: An integrated solder preform array is composed of a metal or metal alloy suitable for use in a soldering or bonding process. The preform includes a series of discrete solder islands disposed in a desired matrix. Each island contains a hole for receiving a pin, and bridging strands for joining each of said islands in a matrix. The bridging strands are formed of the same solder material as the islands, with the solder preform containing a substantially uniform coating of tin over its entire outer surface for the purpose of improving solder wetting and therefore elimination of unwanted shorting of circuits and other electrical components being soldered.

    Abstract translation: 集成的焊料预制件阵列由适用于焊接或焊接工艺的金属或金属合金构成。 预型件包括设置在所需矩阵中的一系列离散焊料岛。 每个岛包含用于接收销的孔和用于将每个所述岛连接成矩阵的桥接线。 桥接线由与岛状物相同的焊料材料形成，其中焊料预制件在其整个外表面上含有基本上均匀的锡涂层，以改善焊料润湿并因此消除电路和其它电气部件的不需要的短路 焊接。

    Integrated preforms
    5.
    发明授权
    Integrated preforms 失效
    集成预制件

    公开(公告)号：US5242097A

    公开(公告)日：1993-09-07

    申请号：US904828

    申请日：1992-06-26

    Applicant: Paul A. Socha

    Inventor： Paul A. Socha

    IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34

    CPC classification number: B23K35/0222 ,  H05K3/3447 ,  H05K3/3478 ,  H05K2201/0305 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2203/0415

    Abstract: A solder preform containing a series of islands that are joined together in a matrix by bridging bands. Each band has a reduced cross-sectional area in its midregion. In one form of this invention, at least some of the islands contain pin receiving holes formed therein and solder tabs that are arranged to frictionally engage a pin that is passed into the hole to prevent the preform from being misaligned or dislodged from the pins and which at the time of bonding, prewets the pins to promote flowing of solder to the pins from the islands to form a superior solder joint.

    Abstract translation: 包含一系列岛的焊料预制件，其通过桥接带在矩阵中连接在一起。 每个带在其中区具有减小的横截面积。 在本发明的一种形式中，至少一些岛包含形成在其中的销接收孔和被布置成摩擦地接合穿过孔的销的焊接片，以防止预成型件从销偏移或脱离，并且哪个 在接合时，预先润湿引脚以促进焊料从岛上引导到管脚上以形成优异的焊点。

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