公开(公告)号：US11765824B2

公开(公告)日：2023-09-19

申请号：US17357159

申请日：2021-06-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Norimichi Noguchi ,  Masateru Mikami ,  Kenji Toyoshima ,  Hiroki Oda ,  Daisuke Suetsugu ,  Tatsuya Urakawa

IPC: H05K1/03 ,  H01C1/14 ,  H01C7/18 ,  H01C17/00 ,  H05K1/16 ,  C04B35/624 ,  C04B35/44 ,  B32B18/00 ,  C04B35/08 ,  C04B35/584 ,  C04B35/581 ,  C04B35/04

CPC classification number: H05K1/0306 ,  B32B18/00 ,  C04B35/44 ,  C04B35/624 ,  H01C1/14 ,  H01C7/18 ,  H01C17/006 ,  H05K1/167 ,  C04B35/04 ,  C04B35/08 ,  C04B35/581 ,  C04B35/584

Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.