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Patent Agency Ranking
公开(公告)号：US20200332078A1
公开(公告)日：2020-10-22
申请号：US16757677
申请日：2018-10-12
Inventor： Ryuji TAKAHASHI , Shimpei OBATA , Yasunori AMBE , Tomo MUGURUMA
Abstract: A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.
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公开(公告)号：US20190181081A1
公开(公告)日：2019-06-13
申请号：US16275957
申请日：2019-02-14
Inventor： Hiroki TAMIYA , Koji KISHINO , Ryuji TAKAHASHI , Yasunori HOSHINO , Takahiro YAMADA , Shimpei OBATA , Hiroyuki SHIRAKI , Shinya ARAKAWA , Shigetoshi FUJITA
IPC: H01L23/498 , C08L63/00 , H01L23/14 , C08K9/04
Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.
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公开(公告)号：US20250129245A1
公开(公告)日：2025-04-24
申请号：US18832582
申请日：2023-01-12
Inventor： Masafumi HONMA , Ryuji TAKAHASHI , Teppei WASHIO , Yuichi ISHIKAWA , Hirofumi MIDORIKAWA
Abstract: A resin composition contains: a curable resin (A); an acrylic-monomer copolymer (B) having a structure expressed by formulae (1) to (3) and having a weight average molecular weight equal to or greater than 10,000 and equal to or less than 900,000; an inorganic filler (C) where a molybdenum compound is present on at least a part of a surface thereof; and another inorganic filler (D) different from the inorganic filler (C). R1 is either a hydrogen atom or a methyl group. R2 includes at least one of a glycidyl group or an epoxidized alkyl group which is selected from the group consisting of a hydrogen atom, an alkyl group, the glycidyl group, and the epoxidized alkyl group. R3 is either a hydrogen atom or a methyl group. R4 is Ph (phenyl group), —COOCH2Ph, or —COO(CH2)2Ph.
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公开(公告)号：US20220356349A1
公开(公告)日：2022-11-10
申请号：US17762544
申请日：2020-09-14
Inventor： Hiroaki UMEHARA , Masaaki MATSUMOTO , Ryuji TAKAHASHI
Abstract: One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.
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公开(公告)号：US20220025171A1
公开(公告)日：2022-01-27
申请号：US17311542
申请日：2019-11-15
Inventor： Tomo MUGURUMA , Ryuji TAKAHASHI , Shimpei OBATA , Yasunori AMBE
Abstract: A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.
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