公开(公告)号：US20220025171A1

公开(公告)日：2022-01-27

申请号：US17311542

申请日：2019-11-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomo MUGURUMA ,  Ryuji TAKAHASHI ,  Shimpei OBATA ,  Yasunori AMBE

IPC: C08L63/00 ,  C08J5/24 ,  C08J5/18 ,  H05K1/03

Abstract: A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.

公开(公告)号：US20200332078A1

公开(公告)日：2020-10-22

申请号：US16757677

申请日：2018-10-12

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Ryuji TAKAHASHI ,  Shimpei OBATA ,  Yasunori AMBE ,  Tomo MUGURUMA

IPC: C08J5/24 ,  C08L61/06 ,  C08G8/08 ,  H05K1/03 ,  B32B15/08 ,  B32B15/20 ,  B32B5/02

Abstract: A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.

公开(公告)号：US20190181081A1

公开(公告)日：2019-06-13

申请号：US16275957

申请日：2019-02-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroki TAMIYA ,  Koji KISHINO ,  Ryuji TAKAHASHI ,  Yasunori HOSHINO ,  Takahiro YAMADA ,  Shimpei OBATA ,  Hiroyuki SHIRAKI ,  Shinya ARAKAWA ,  Shigetoshi FUJITA

IPC: H01L23/498 ,  C08L63/00 ,  H01L23/14 ,  C08K9/04

Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.

公开(公告)号：US20190150279A1

公开(公告)日：2019-05-16

申请号：US16095120

申请日：2017-04-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shimpei OBATA ,  Ryuuji TAKAHASHI ,  Yasunori HOSHINO ,  Shigetoshi FUJITA

IPC: H05K1/03 ,  B32B15/08 ,  H05K1/02 ,  H01L23/498 ,  C08J5/24

Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.