公开(公告)号：US20240038726A1

公开(公告)日：2024-02-01

申请号：US18264194

申请日：2021-12-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji OBATA ,  Masaru SASAGO ,  Masamichi NAKAGAWA ,  Tatsuya KABE ,  Hiroyuki GOMYO ,  Masatomo MITSUHASHI ,  Yutaka SONODA

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L27/02 ,  H10B80/00

CPC classification number: H01L25/0657 ,  H01L23/481 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/16 ,  H01L27/0207 ,  H01L24/08 ,  H10B80/00 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06544 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2224/16146 ,  H01L2224/48225 ,  H01L2224/32225 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/08145

Abstract: An AI module includes a first semiconductor chip. The first semiconductor chip includes a plurality of operation blocks each of which performs a predetermined operation and a plurality of memory blocks each including memory. The plurality of operation blocks and the plurality of memory blocks are arranged in a checkered pattern or in a striped pattern in plan view.