公开(公告)号：US20150370754A1

公开(公告)日：2015-12-24

申请号：US14800979

申请日：2015-07-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi MORIMOTO ,  Kouji KAI

IPC: G06F15/78 ,  G06F1/20

CPC classification number: G06F15/7864 ,  G05F5/00 ,  G06F1/20 ,  G06F12/0893 ,  G06F15/80 ,  G06F2212/601 ,  H01L23/34 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/18 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/1116 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311

Abstract: The present invention provides a three-dimensional integrated circuit wherein generation of hot spot which makes a high temperature part as a result of intensively generated heat can be suppressed in. The integrated circuit apparatus comprises: a first circuit made of a memory circuit, a second circuit made of an arithmetic circuit, and a control circuit. The first circuit is partitioned into a plurality of circuit blocks according to the distance from the arranged position of the second circuit, and the control circuit controls the partitioned respective circuit blocks separately.

Abstract translation: 本发明提供了一种三维集成电路，其中可以抑制由于集中产生的热而产生作为高温部分的热点的三维集成电路。集成电路装置包括：第一电路，由存储电路，第二 由运算电路构成的电路，以及控制电路。 根据与第二电路的布置位置的距离，第一电路被划分为多个电路块，并且控制电路分别控制分隔的各个电路块。