公开(公告)号：US20180174808A1

公开(公告)日：2018-06-21

申请号：US15834036

申请日：2017-12-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： DAISUKE SUETSUGU ,  MASAAKI TANABE ,  AKIRA OKUDA ,  YOSIMASA TAKII

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/54 ,  C23C14/35 ,  C23C14/06 ,  H01J37/32 ,  C23C14/50

CPC classification number: H01J37/3476 ,  C23C14/0652 ,  C23C14/3485 ,  C23C14/35 ,  C23C14/50 ,  C23C14/54 ,  H01J37/32715 ,  H01J37/3402 ,  H01J37/3467 ,  H01L21/0217 ,  H01L21/02266

Abstract: A sputtering apparatus has a vacuum chamber capable of arranging a target material and a substrate therein so as to face each other, a DC power supply capable of electrically being connected to the target material, and a pulsing unit pulsing electric current flowing in the target material from the DC power supply, in which plasma is generated in the vacuum chamber to form a thin film on the substrate, including an ammeter measuring electric current flowing in the pulsing unit from the DC power supply, a power supply controller performing feedback control of the DC power supply so that a current value measured by the ammeter becomes a prescribed value and a pulse controller indicating a pulse cycle shifted from a control cycle of the DC power supply by the power supply controller to the pulsing unit.