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1.发明授权公开(公告)号：US11554434B2
公开(公告)日：2023-01-17
申请号：US16094599
申请日：2018-02-14
发明人： Ghassem Azdasht
摘要： The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.
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公开(公告)号：US11224928B2
公开(公告)日：2022-01-18
申请号：US15102357
申请日：2014-10-23
发明人： Ghassem Azdasht
摘要： The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70) that detects reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.
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公开(公告)号：US20170165772A1
公开(公告)日：2017-06-15
申请号：US15323797
申请日：2015-07-15
发明人： Ghassem Azdasht
IPC分类号： B23K3/06
摘要： The invention relates to a solder ball feeding device (40), comprising a solder ball reservoir (20) for receiving an amount of solder balls and a metering device (31) for dispensing a metered feeding amount of solder balls (16) to a discharge device (11), wherein the metering device comprises an ultrasound device (32) and a dispensing nozzle (21) with a dispensing cannula (43), the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection (23) which serves to introduce a pressurized gas into the solder ball feeding device.
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公开(公告)号：US20160354853A1
公开(公告)日：2016-12-08
申请号：US15102357
申请日：2014-10-23
发明人： Ghassem Azdasht
CPC分类号： B23K1/0056 , B23K3/0623 , B23K26/034
摘要： The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70) that detects reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.
摘要翻译： 本发明涉及一种用于分别施加焊料材料沉积物（11）的装置（10），特别是焊球，其包括用于将焊料材料沉积物从焊料储存器（12）分别输送到输送装置（19）的输送装置（19） 所述输送装置具有形成为通孔的运输保持器，并且每个所述输送装置可以从其中从所述焊料储存器接收到焊料材料沉积物的接收位置移动到转移位置P2中， 其中焊料材料沉积物暴露于压力气体，并且焊料材料沉积物从该材料沉积物转移到施加装置的施加喷嘴（36）的施加开口到施加位置P3，其中检测器装置（69）为 条件是用于通过激光装置发射的激光辐射来触发布置在施加位置P3中的焊料材料沉积物的处理，其中检测器装置 e具有反射传感器（70），其检测被布置在施加位置P3中的焊料材料沉积物反射的反射辐射（72）。
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公开(公告)号：US10286470B2
公开(公告)日：2019-05-14
申请号：US15027611
申请日：2014-07-03
发明人： Ghassem Azdasht
摘要： The invention relates to a device (10) for the separate application of solder material deposits, in particular solder balls, comprising a conveying device for separately conveying the solder material deposits from a solder material reservoir toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position P1, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to the application device into an application position P3, wherein a removal device (46) for removing a solder material deposit from a transport holder arranged in a removal position P4 is arranged downstream of the transfer position in the conveying direction, the removal device being connected to a detector device for triggering the removal function, said detector device checking the condition of the transport holder in the transfer position.
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公开(公告)号：US10118240B2
公开(公告)日：2018-11-06
申请号：US15658084
申请日：2017-07-24
发明人： Ghassem Azdasht
摘要： A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.
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公开(公告)号：US20170165773A1
公开(公告)日：2017-06-15
申请号：US15323808
申请日：2015-07-15
发明人： Ghassem Azdasht , Thorsten Krause
摘要： The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device for separately conveying solder material deposits from a solder material reservoir (12) arranged at an upper housing part (14) of the device toward an application device (33) arranged at a lower housing part (20) of the device, the conveying device being formed as a conveying disk (19) which is conveyed about a rotation axis (28), is arranged in an accommodating space (21) between the lower housing part and the upper housing part and has transport holders (18) which are formed as passage holes and each can be moved from a receiving position P1, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas via a pressure bore (42) formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle (36) of the application device into an application position P3, the application device having an application duct (35) which is formed in the lower housing part and simultaneously forms a lower section (63) of a transmission duct (64) which serves for the transmission of laser radiation to the solder material deposit arranged in the application nozzle, the transmission duct extending with an upper section (65) through the upper housing part, the application duct being inclined at an application angle a with respect to the rotation axis.
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8.发明申请公开(公告)号：US20210220934A1
公开(公告)日：2021-07-22
申请号：US16094599
申请日：2018-02-14
发明人： Ghassem Azdasht
摘要： The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.
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公开(公告)号：US10354971B2
公开(公告)日：2019-07-16
申请号：US15106605
申请日：2014-11-25
IPC分类号： H01L23/31 , H01L23/00 , H01L21/48 , H01L23/538 , H01L23/495 , H01L23/498
摘要： The invention concerns a method for producing a chip module having a carrier substrate and at least one chip arranged on the carrier substrate, as well as a contact conductor arrangement for connecting chip pads to contacts arranged on a contact face of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer of the carrier substrate.
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公开(公告)号：US10081068B2
公开(公告)日：2018-09-25
申请号：US15035428
申请日：2014-10-23
发明人： Ghassem Azdasht
IPC分类号： B23K1/005 , B23K3/06 , B23K26/354
CPC分类号： B23K1/0056 , B23K3/0623 , B23K26/354
摘要： The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening (37) of an application nozzle (36) of the application device into an application position P3, wherein a first detector device (69) for triggering a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device and a second detector device (80) for locating the solder material deposit are provided.
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