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公开(公告)号：US20170324937A1
公开(公告)日：2017-11-09
申请号：US15585620
申请日：2017-05-03
摘要： An optical bonding machine is provided, including a transparent datum located within the optical bonding machine, wherein the transparent datum supports a first substrate, a robotic placement head configured to pick up a second substrate and place the second substrate into contact with the first substrate, on the transparent datum, a camera disposed proximate the transparent datum, the camera capturing a video of a flow of an optically clear adhesive between the first substrate and the second substrate, and a curing source disposed proximate the transparent datum, the curing source emitting UV rays that pass through the transparent datum and the first substrate to cure an optically clear adhesive between a bonded substrate comprising the first substrate, the optically clear adhesive, and the second substrate. An associated method is also provided.
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公开(公告)号：US20170320310A1
公开(公告)日：2017-11-09
申请号：US15585684
申请日：2017-05-03
IPC分类号： B32B41/00 , B32B37/12 , G05B19/409
CPC分类号： B32B41/00 , B29C65/48 , B29C66/90 , B29D11/00 , B29D11/0073 , B29D11/00951 , B29L2011/00 , B32B17/10807 , B32B37/003 , B32B37/12 , B32B37/1284 , B32B2037/1253 , B32B2041/04 , B32B2041/06 , B32B2307/412 , B32B2309/70 , B32B2457/20 , G05B19/409 , G05B2219/49032 , G06T7/0008 , G06T2207/10016 , H04N7/183
摘要： An automated bonding sequence system and method for customizing a bonding sequence is provided. The method includes the steps of detecting that a first substrate is in close proximity with the a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate, stopping an automated process of optically bonding of the optical bonding operation, in response to the detecting, recording operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate, analyzing the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate, and resuming, by the processor, the automated process of the optical bonding operation.
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