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18 条记录 (耗时 0.017 秒)

    Compositions Containing Thermally Conductive Fillers
    4.
    发明申请
    Compositions Containing Thermally Conductive Fillers 有权

    公开(公告)号：US20210395483A1

    公开(公告)日：2021-12-23

    申请号：US17284645

    申请日：2019-10-14

    申请人： PPG Industries Ohio, Inc.

    发明人： Liang Ma ,  Allison G. Condie ,  Marvin M. Pollum, Jr. ,  Lorraine Hsu ,  Maria S. French ,  Calum H. Munro ,  Shuyu Fang ,  Masayuki Nakajima

    IPC分类号： C08K3/013 ,  C08L63/00 ,  C08K9/10

    摘要： Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

    COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS
    5.
    发明申请
    COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS 有权

    公开(公告)号：US20230019038A1

    公开(公告)日：2023-01-19

    申请号：US17757102

    申请日：2020-12-11

    申请人： PPG Industries Ohio, Inc.

    发明人： Liang Ma ,  Lorraine Hsu ,  Allison G. Condie ,  Marvin M. Pollum, Jr. ,  Maria S. French

    IPC分类号： C09D181/04 ,  H01M10/653 ,  H01M10/6551 ,  H01M10/6554 ,  H01M10/613 ,  H01M50/209

    摘要： Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

    COATING COMPOSITIONS
    6.
    发明申请
    COATING COMPOSITIONS 有权

    公开(公告)号：US20220275148A1

    公开(公告)日：2022-09-01

    申请号：US17753180

    申请日：2020-06-23

    申请人： PPG Industries Ohio, Inc.

    发明人： Joseph P. Kriley ,  Marvin M. Pollum, Jr. ,  David J. Fortman ,  Brian K. Rearick ,  Masayuki Nakajima ,  Maria S. French

    IPC分类号： C08G59/50 ,  C08G59/24 ,  C09D163/00 ,  C09D7/65 ,  C09J163/00 ,  C09J11/08 ,  C04B37/02

    摘要： Disclosed is an epoxide-functional adduct (E2) and an amine-functional adduct (A3) and coating compositions including these adducts. The epoxide-functional adduct (E2) comprises a reaction product of a reaction mixture comprising (a) an epoxy-containing compound (E1) and (b) a diamine comprising a cyclic ring and/or a polyamine comprising a cyclic ring (A1). The amine-functional adduct comprises a reaction product of a reaction mixture comprising the epoxy-functional adduct (E2) and a monoamine, diamine, and/or polyamine (A2), wherein the monoamine, diamine, and/or polyamine (A2) are different than the diamine comprising a cyclic ring and/or the polyamine comprising a cyclic ring (A1). The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.