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公开(公告)号:US20230422529A1
公开(公告)日:2023-12-28
申请号:US18102612
申请日:2023-01-27
Inventor: Byoung Hun LEE , Yong Su LEE
IPC: H10K10/46
CPC classification number: H10K10/486 , H10K10/466
Abstract: Disclosed herein are a multi-level device which has a ternary characteristic and can reduce hysteresis, and a method of manufacturing the same. The multi-level device can have a plurality of turn-on voltages, that is, a plurality of threshold voltages, thereby providing multi-level conductivity as a ternary device characteristic. In addition, a double insulating layer made of a dielectric layer and an organic polymer layer is used as a separation layer for channel layer separation, and by removing the hysteresis due to a trap charge at an interface between a channel layer and an insulating layer, a uniform ternary characteristic can always be maintained, and by forming the channel layer on an organic polymer layer, the channel layer can be more stably formed on the insulating layer.
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2.
公开(公告)号:US20240099136A1
公开(公告)日:2024-03-21
申请号:US18470288
申请日:2023-09-19
Inventor: Byoung Hun LEE , Hyeon Jun HWANG
IPC: H10N10/01 , H10N10/855
CPC classification number: H10N10/01 , H10N10/855
Abstract: Disclosed herein are a method for manufacturing a graphene thermoelectric device and a graphene thermoelectric device manufactured thereby. The method for manufacturing a graphene thermoelectric device includes: forming a graphene channel layer on a substrate; forming a thermoelectric structure by depositing a first electrode and a second electrode on both ends of the graphene channel layer; and doping the graphene channel layer by dipping the thermoelectric structure into a doping solution.
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3.
公开(公告)号:US20240347643A1
公开(公告)日:2024-10-17
申请号:US18632104
申请日:2024-04-10
Inventor: Byoung Hun LEE , Yongsu LEE , Hae-Won LEE
IPC: H01L29/786 , H01L29/66
CPC classification number: H01L29/78642 , H01L29/66742
Abstract: An anti-ambipolar transistor in which a turn-on operation is performed at a specific gate voltage and a method of manufacturing the same are disclosed. A vertically stacked structure including a first semiconductor layer and a second semiconductor layer, which are disposed perpendicular to the surface of a substrate, is formed, and then a gate dielectric layer and a gate electrode, which completely surround the side of the vertically stacked structure, are formed. Through the vertical structure, an electric field is generated in a direction parallel to the substrate, and a drain-source current is applied in a direction perpendicular to the surface of the substrate. This ensures the integration of the transistor and efficient operation of the transistor.
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