公开(公告)号：US20250155134A1

公开(公告)日：2025-05-15

申请号：US18986017

申请日：2024-12-18

Applicant: PixArt Imaging Inc.

Inventor： CHIH-MING SUN ,  Ming-Han Tsai ,  Chiung-Wen Lin ,  Po-wei Yu ,  Wei-Ming Wang ,  Sen-Huang Huang

IPC: F24C15/20 ,  A61F13/42 ,  B66B5/00 ,  G01J5/00 ,  G01J5/10

Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.

公开(公告)号：US12222246B2

公开(公告)日：2025-02-11

申请号：US18330371

申请日：2023-06-07

Applicant: PIXART IMAGING INC.

Inventor： Chih-Ming Sun ,  Ming-Han Tsai ,  Cheng-Nan Tsai

IPC: G01J5/02 ,  B81B7/00 ,  G01J5/04 ,  G01J5/06 ,  H04N5/33 ,  H04N23/57

Abstract: A wearable device includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the wearable device. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.

公开(公告)号：US20190308872A1

公开(公告)日：2019-10-10

申请号：US16448612

申请日：2019-06-21

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming Sun ,  Ming-Han Tsai ,  Yu-Tao Lee

IPC: B81B3/00 ,  H01L23/00 ,  B81C1/00 ,  H01L27/146

Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

公开(公告)号：US10384928B1

公开(公告)日：2019-08-20

申请号：US15891975

申请日：2018-02-08

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming Sun ,  Ming-Han Tsai ,  Yu-Tao Lee

IPC: B81B3/00 ,  B81C1/00 ,  H01L23/00 ,  H01L27/146

Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

公开(公告)号：US10113912B2

公开(公告)日：2018-10-30

申请号：US14972563

申请日：2015-12-17

Applicant: PIXART IMAGING INC.

Inventor： Ming-Han Tsai ,  Chih-Ming Sun ,  Jian-Cheng Liao

IPC: G01J5/12 ,  G01J5/04 ,  G01J5/08 ,  G01J5/00

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

公开(公告)号：US11643325B2

公开(公告)日：2023-05-09

申请号：US17939205

申请日：2022-09-07

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming Sun ,  Ming-Han Tsai ,  Yu-Tao Lee

IPC: B81B3/00 ,  H01L27/146 ,  H01L23/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/00142 ,  H01L24/16 ,  H01L27/14618 ,  H01L27/14636 ,  B81B2201/033 ,  B81B2203/0109 ,  B81B2203/0172 ,  B81B2203/04 ,  B81B2203/051 ,  B81B2203/055 ,  B81B2207/07 ,  H01L2224/16245 ,  H01L2924/1461

Abstract: A MEMS package including a fixed frame, a moveable platform and elastic restoring members is provided. The moveable platform is moved with respect to the fixed frame. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position.

公开(公告)号：US10732049B2

公开(公告)日：2020-08-04

申请号：US16144249

申请日：2018-09-27

Applicant: PIXART IMAGING INC.

Inventor： Ming-Han Tsai ,  Chih-Ming Sun ,  Jian-Cheng Liao

IPC: G01J5/04 ,  G01J5/12 ,  G01J5/08 ,  G01J5/00

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

公开(公告)号：US10670465B2

公开(公告)日：2020-06-02

申请号：US16194212

申请日：2018-11-16

Applicant: PIXART IMAGING INC.

Inventor： Chih-Ming Sun ,  Ming-Han Tsai ,  Cheng-Nan Tsai

IPC: G01J5/02 ,  G01J5/04 ,  H04N5/33 ,  G01J5/06 ,  H04N5/225 ,  B81B7/00

Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.

公开(公告)号：US10589982B2

公开(公告)日：2020-03-17

申请号：US16448612

申请日：2019-06-21

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming Sun ,  Ming-Han Tsai ,  Yu-Tao Lee

IPC: B81B3/00 ,  H01L27/146 ,  H01L23/00 ,  B81C1/00

Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

公开(公告)号：US12158375B2

公开(公告)日：2024-12-03

申请号：US18143565

申请日：2023-05-04

Applicant: PIXART IMAGING INC.

Inventor： Ming-Han Tsai ,  Chih-Ming Sun ,  Jian-Cheng Liao

IPC: G01J5/04 ,  G01J5/00 ,  G01J5/05 ,  G01J5/0802 ,  G01J5/0875 ,  G01J5/12

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.