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公开(公告)号：US11991831B2
公开(公告)日：2024-05-21
申请号：US17755223
申请日：2020-08-04
发明人： Hideaki Katou , Naoki Azuma , Koji Sakurai , Masanori Ikeda
CPC分类号： H05K13/0015 , H05K13/04
摘要： A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.
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2.发明申请PASTE TRANSFER UNIT, ELECTRONIC COMPONENT MOUNTING DEVICE, AND TRANSFERRED FILM THICKNESS MEASURING METHOD 有权糊料转移单元，电子元件安装装置和转印薄膜厚度测量方法公开(公告)号：US20150345930A1
公开(公告)日：2015-12-03
申请号：US14655593
申请日：2013-12-19
IPC分类号： G01B7/06
CPC分类号： G01B7/06 , B23K1/0016 , B23K3/0638 , G01B11/0616 , H01L24/13 , H01L24/75 , H01L24/81 , H01L2224/11822 , H01L2224/13101 , H01L2224/7515 , H01L2224/759 , H01L2224/81011 , H05K1/0269 , H05K3/3484 , H05K13/0465 , H01L2924/014 , H01L2924/00014
摘要： To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.
摘要翻译： 为了测量作为形成在糊剂转印单元（7）的转印台（24）上的粘合剂的焊剂（25）的涂膜（25a）的膜厚度，涂膜（25a）的膜厚度 通过光干涉法的光透射部件（51）和布置在转印台（24）的下方的光学型膜厚测量传感器（53）测量转印区域（26）。 因此，可以在传送区域（26）中自动且精确地测量焊剂（25）的膜厚度，而不需要任何复杂的测量工作。
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公开(公告)号：US11289349B2
公开(公告)日：2022-03-29
申请号：US16388005
申请日：2019-04-18
摘要： A component mounting line includes a plurality of component mounting apparatuses, each of which mounts solder and a component other than the solder on a substrate. The component mounting line includes: a time limit management unit configured to manage an elapsed time period of a member; and a usability determiner that determines whether the member is usable based on the elapsed time period of the member. The elapsed time period is a time period that has elapsed after the member is exposed to the air, and the member comprises at least one of a substrate, solder, and a component other than the solder.
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公开(公告)号：US11293626B2
公开(公告)日：2022-04-05
申请号：US16247748
申请日：2019-01-15
发明人： Hideaki Katou , Koji Sakurai , Masanori Ikeda , Naoki Azuma
IPC分类号： F21V19/00 , H05K13/04 , H05K13/08 , F21V14/02 , G01D5/26 , H01L25/075 , H01L27/15 , H01L33/00 , H05K13/00
摘要： A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.
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公开(公告)号：US10149419B2
公开(公告)日：2018-12-04
申请号：US14868885
申请日：2015-09-29
发明人： Katsuhiko Itoh , Masanori Ikeda , Kenji Okamoto
摘要： A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.
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公开(公告)号：US10076070B2
公开(公告)日：2018-09-11
申请号：US14867241
申请日：2015-09-28
发明人： Katsuhiko Itoh , Masanori Ikeda , Kenji Okamoto
CPC分类号： H05K13/0465 , H05K3/3421 , H05K3/3478 , H05K13/0817 , H05K2203/041
摘要： A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.
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7.发明授权Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method 有权粘贴转印单元，电子元件安装装置和转印膜厚度测量方法公开(公告)号：US09285204B2
公开(公告)日：2016-03-15
申请号：US14655593
申请日：2013-12-19
CPC分类号： G01B7/06 , B23K1/0016 , B23K3/0638 , G01B11/0616 , H01L24/13 , H01L24/75 , H01L24/81 , H01L2224/11822 , H01L2224/13101 , H01L2224/7515 , H01L2224/759 , H01L2224/81011 , H05K1/0269 , H05K3/3484 , H05K13/0465 , H01L2924/014 , H01L2924/00014
摘要： To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.
摘要翻译： 为了测量作为形成在糊剂转印单元（7）的转印台（24）上的粘合剂的焊剂（25）的涂膜（25a）的膜厚度，涂膜（25a）的膜厚度 通过光干涉法的光透射部件（51）和布置在转印台（24）的下方的光学型膜厚测量传感器（53）测量转印区域（26）。 因此，可以在传送区域（26）中自动且精确地测量焊剂（25）的膜厚度，而不需要任何复杂的测量工作。
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