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公开(公告)号：US10912203B2
公开(公告)日：2021-02-02
申请号：US16290251
申请日：2019-03-01
Inventor： Ryota Inoue , Naoki Azuma
Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
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2.发明授权公开(公告)号：US10821468B2
公开(公告)日：2020-11-03
申请号：US15898912
申请日：2018-02-19
Inventor： Yoshinori Isobata , Masayuki Mantani , Naoki Azuma , Seiji Mizuoka , Takahiro Endo
Abstract: A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.
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公开(公告)号：US12246869B2
公开(公告)日：2025-03-11
申请号：US18637720
申请日：2024-04-17
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US11991831B2
公开(公告)日：2024-05-21
申请号：US17755223
申请日：2020-08-04
Inventor： Hideaki Katou , Naoki Azuma , Koji Sakurai , Masanori Ikeda
CPC classification number: H05K13/0015 , H05K13/04
Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.
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公开(公告)号：US11584552B2
公开(公告)日：2023-02-21
申请号：US17647196
申请日：2022-01-06
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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Patent Agency Ranking
公开(公告)号：US11254456B2
公开(公告)日：2022-02-22
申请号：US16930458
申请日：2020-07-16
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US09693495B2
公开(公告)日：2017-06-27
申请号：US14982753
申请日：2015-12-29
Inventor： Ryota Inoue , Naoki Azuma
CPC classification number: H05K13/0417 , H05K13/0419
Abstract: A tape feeder is provided for pitch-feeding a carrier tape that holds a component in a pocket of the carrier tape and supplying the component to a pickup position for a mount head. The tape feeder includes a guide section that guides the carrier tape with an upper portion of the carrier tape covered, in a vicinity of the pickup position, and a lower receiving section that is positioned below the guide section and receives the pocket of the carrier tape from a lower surface side of the pocket. The lower receiving section includes a suction section that sucks the component from below and a leaf spring member that allows the suction section to contact a bottom of pocket from the lower surface side of the pocket. The component is sucked and held from below by the suction section through a hole section formed in the bottom of the pocket.
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公开(公告)号：US11266026B2
公开(公告)日：2022-03-01
申请号：US17131995
申请日：2020-12-23
Inventor： Ryota Inoue , Naoki Azuma
Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
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公开(公告)号：US11987408B2
公开(公告)日：2024-05-21
申请号：US18339403
申请日：2023-06-22
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
CPC classification number: B65B15/04 , B65G47/68 , H05K13/02 , H05K13/0417
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US11724842B2
公开(公告)日：2023-08-15
申请号：US18150874
申请日：2023-01-06
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
CPC classification number: B65B15/04 , B65G47/68 , H05K13/02 , H05K13/0417
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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