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    MINIATURE WAFER-LEVEL CAMERA MODULES
    5.
    发明申请
    MINIATURE WAFER-LEVEL CAMERA MODULES 审中-公开
    微型水平摄像机模块

    公开(公告)号：US20160099284A1

    公开(公告)日：2016-04-07

    申请号：US14969317

    申请日：2015-12-15

    Applicant: OmniVision Technologies, Inc.

    Inventor： Kenneth Kubala ,  Paulo E. X. Silveira ,  Satoru Tachihara

    IPC: H01L27/146 ,  H04N5/225

    CPC classification number: H01L27/14685 ,  B26F1/38 ,  B29D11/00298 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14698 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N2005/2255 ,  Y10T29/53 ,  Y10T83/04 ,  Y10T156/1052

    Abstract: In one aspect, a method includes providing a lens substrate having an array of lenses. The lens substrate includes an overflow region next to each lens of the array. Each overflow region includes an overflow lens material. The method also includes separating the lens substrate into a plurality of smaller lens substrates. Each of the smaller lens substrates has one of the single lens and the plurality of stacked lenses. Separating the lens substrate into the smaller lens substrates may include removing or substantially removing the overflow regions. In one aspect, the method may be performed as a method of making a miniature camera module. Other methods are also described, as are miniature camera modules.

    Abstract translation: 一方面，一种方法包括提供具有透镜阵列的透镜基板。 透镜基板包括在阵列的每个透镜旁边的溢出区域。 每个溢流区域包括溢流透镜材料。 该方法还包括将透镜基板分离成多个较小的透镜基板。 每个较小的透镜基板具有单个透镜和多个层叠透镜中的一个。 将透镜基板分离成较小的透镜基板可以包括去除或基本上去除溢流区域。 在一个方面，该方法可以作为制造微型相机模块的方法来执行。 还描述了其他方法，微型相机模块也是如此。

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