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公开(公告)号：US20230335690A1
公开(公告)日：2023-10-19
申请号：US18326801
申请日：2023-05-31
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Siegfried HERRMANN , Hubert Halbritter , Peter Brick , Thomas Schwarz , Laura Kreiner , Petrus Sundgren , Jean-Jacques Drolet , Michael Brandl , Xue Wang , Andreas Biebersdorf , Christoph Klemp , Ines Pietzonka , Julia Stolz , Simon Schwalenberg , Andreas Leber , Christine Rafael , Eva-Maria Rummel , Nicole Heitzer , Marie Assmann , Erwin Lang , Andreas Rausch , Marc Philippens , Karsten Diekmann , Stefan Illek , Christian Berger , Felix Feix , Ana Kanevce , Georg Bogner , Karl Engl
IPC: H01L33/52 , H01L33/50 , H01L33/60 , H01L33/04 , H01L25/075
CPC classification number: H01L33/52 , H01L33/502 , H01L33/60 , H01L33/04 , H01L25/0753 , B60K2370/1523 , B60K35/00
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US12211826B2
公开(公告)日：2025-01-28
申请号：US17769407
申请日：2020-12-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Laura Kreiner , Jens Mueller
IPC: H01L25/075 , H01L21/66 , H01L33/00
Abstract: In an embodiment a method for producing a lighting device includes providing a wafer assemblage having a semiconductor layer sequence arranged on a carrier substrate, separating the wafer assemblage into a plurality of first optoelectronic semiconductor chips, each comprising a section of the semiconductor layer sequence and of the carrier substrate, transferring at least some of the first optoelectronic semiconductor chips to a first auxiliary carrier, wherein the first auxiliary carrier has contact pads on a main surface, wherein the contact pads are surrounded and delimited in each case by a contour, and wherein each of the first optoelectronic semiconductor chips is arranged on a contact pad, cutting, on the first auxiliary carrier, to size the first optoelectronic semiconductor chips in order to adapt the first optoelectronic semiconductor chips to a predefined shape such that the each first optoelectronic semiconductor chip lies completely within the contour of an assigned contact pad, and transferring the first optoelectronic semiconductor chips from the first auxiliary carrier to a carrier.
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公开(公告)号：US20220180805A1
公开(公告)日：2022-06-09
申请号：US17677804
申请日：2022-02-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thorsten BAUMHEINRICH , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Jens Richter , Thomas Schwarz , Paul Ta , Kilian Regau , Christopher Soell , Hoa Vu , Christopher Wiesmann , Patrick Hoerner , Jong Park , Kanishk Chand
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US20220123182A1
公开(公告)日：2022-04-21
申请号：US17645644
申请日：2021-12-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Biebersdorf , Michael Brandl , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Erwin Lang , Andreas Leber , Marc Philippens , Thomas Schwarz , Julia Stolz , Xue Wang , Karsten Diekmann , Karl Engl , Siegfried Herrmann , Stefan Illek , Ines Pietzonka , Andreas Rausch , Simon Schwalenberg , Petrus Sundgren , Georg Bogner , Christoph Klemp , Christine Rafael , Felix Feix , Eva-Maria Rummel , Nicole Heitzer , Marie Assmann , Christian Berger , Ana Kanevce
IPC: H01L33/52 , H01L33/50 , H01L33/60 , H01L33/04 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μ.
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公开(公告)号：US20220059737A1
公开(公告)日：2022-02-24
申请号：US17515138
申请日：2021-10-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Biebersdorf , Michael Brandl , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Erwin Lang , Andreas Leber , Marc Philippens , Thomas Schwarz , Julia Stolz , Xue Wang , Karsten Diekmann , Karl Engl , Siegfried Herrmann , Stefan Illek , Ines Pietzonka , Andreas Rausch , Simon Schwalenberg , Petrus Sundgren , Georg Bogner , Christoph Klemp , Christine Rafael , Felix Feix , Eva-Maria Rummel , Nicole Heitzer , Marie Assmann , Christian Berger , Ana Kanevce
IPC: H01L33/52 , H01L33/50 , H01L33/60 , H01L33/04 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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Patent Agency Ranking
公开(公告)号：US12176469B2
公开(公告)日：2024-12-24
申请号：US17645644
申请日：2021-12-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Biebersdorf , Laura Kreiner , Stefan Illek , Ines Pietzonka , Petrus Sundgren , Christoph Klemp , Felix Feix , Christian Berger , Ana Kanevce
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US11610868B2
公开(公告)日：2023-03-21
申请号：US17039097
申请日：2020-09-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Thomas Schwarz , Julia Stolz
IPC: H01L25/075 , H01L33/60 , H01L33/50 , H01L33/24 , H01L33/32
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US11538852B2
公开(公告)日：2022-12-27
申请号：US17039283
申请日：2020-09-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tansen Varghese , Bruno Jentzsch , Laura Kreiner
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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9.发明申请公开(公告)号：US20220093826A1
公开(公告)日：2022-03-24
申请号：US17421394
申请日：2019-12-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Laura Kreiner , Martin Rudolf Behringer
IPC: H01L33/22 , H01L31/036 , H01L31/18 , H01L33/16 , H01L33/44 , H01L31/0216 , H01L33/00 , G03B21/20 , F21S41/14
Abstract: An optoelectronic semiconductor device may include a semiconductor body having a first main surface, a first dielectric layer over the first main surface, and a second dielectric layer on a side of the first dielectric layer facing away from the first main surface. The second dielectric layer is patterned to form an ordered photonic structure. The semiconductor body is suitable for emitting or receiving electromagnetic radiation through the first main surface. The first main surface is roughened, and the first dielectric layer is suitable for leveling a roughening of the first main surface.
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公开(公告)号：US12205522B2
公开(公告)日：2025-01-21
申请号：US17677857
申请日：2022-02-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thorsten Baumheinrich , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Jens Richter , Thomas Schwarz , Paul Ta , Kilian Regau , Christopher Soell , Hoa Vu , Christopher Wiesmann , Patrick Hoerner , Jong Park , Kanishk Chand
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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