公开(公告)号：US10290997B2

公开(公告)日：2019-05-14

申请号：US15550888

申请日：2016-02-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jens Mueller ,  Christoph Stephan ,  Robert Walter ,  Stefan Hartauer ,  Christian Rumbolz

IPC: H01S5/20 ,  H01S5/22 ,  H01S5/028 ,  H01S5/042

Abstract: A method of producing an electronic component includes providing a surface comprising a first region and a second region adjoining the first region, arranging a sacrificial layer above the first region of the surface, arranging a passivation layer above the sacrificial layer and the second region of the surface, creating an opening in the passivation layer above the first region of the surface, wherein the opening in the passivation layer is created with an opening area that is smaller than the first region, and removing the sacrificial layer and the portions of the passivation layer that are arranged above the first region.

公开(公告)号：US20180048122A1

公开(公告)日：2018-02-15

申请号：US15550888

申请日：2016-02-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jens Mueller ,  Christoph Stephan ,  Robert Walter ,  Stefan Hartauer ,  Christian Rumbolz

IPC: H01S5/20 ,  H01S5/028

CPC classification number: H01S5/2086 ,  H01S5/0282 ,  H01S5/0422 ,  H01S5/0425 ,  H01S5/22 ,  H01S2301/176

Abstract: A method of producing an electronic component includes providing a surface comprising a first region and a second region adjoining the first region, arranging a sacrificial layer above the first region of the surface, arranging a passivation layer above the sacrificial layer and the second region of the surface, creating an opening in the passivation layer above the first region of the surface, wherein the opening in the passivation layer is created with an opening area that is smaller than the first region, and removing the sacrificial layer and the portions of the passivation layer that are arranged above the first region.