Method for correcting values detected by linear scales

    公开(公告)号:US11333535B2

    公开(公告)日:2022-05-17

    申请号:US17297613

    申请日:2019-12-13

    Abstract: Provided is a method for more accurately correcting position coordinates of a point on an object to be imaged, the coordinates being identified based on values detected by linear scales. A visual field is moved to a measurement point defined on a recessed portion formed on a calibration plate, and an image is captured (step S13-1), edges are detected from an image of sides of the recessed portion (step 313-2), an intersection of the edges is calculated (step S13-3), values of the intersection as actually measured by the linear scales are saved (step S13-4), and position coordinates of the point on the object to be imaged as detected by the linear scales are corrected by using a true value and a difference.

    Measurement method for amount of deviation, and measurement apparatus

    公开(公告)号:US12072180B2

    公开(公告)日:2024-08-27

    申请号:US18157345

    申请日:2023-01-20

    Abstract: Provided are a measurement method, and a measurement device that enable measuring a deviation amount in an arrangement angle of a camera, with respect to a reference direction of a shaft of the camera, and that enable correcting a deviation in the arrangement angle at low cost with high accuracy. The measurement method includes: an imaging step of imaging a target object, provided with a reference mark configured to identify a slope-known straight line, a plurality of times in different visual fields; an image processing step of obtaining the straight line identified based on the reference mark where a plurality of the straight lines corresponds to a plurality of the reference marks in images imaged in the different visual fields, respectively; and a calculating step of calculating a rotation angle, as the deviation amount in the arrangement angle, with which a distance between the straight lines becomes zero.

    Appearance inspection device and defect inspection method

    公开(公告)号:US11936985B2

    公开(公告)日:2024-03-19

    申请号:US17765396

    申请日:2020-03-10

    Abstract: Provided is a technique capable of more accurately determining a solder protruding defect in an appearance inspection device that acquires an image of an inspection region of an inspection target and measures a height of a predetermined place in the inspection region with a height measurement device. The appearance inspection device includes: an imaging unit (3); a height measurement unit (20); a moving mechanism (5) that moves the imaging unit (3) and the height measurement unit (20). When a restricted region (M) in the inspection target is irradiated with the measurement light emitted from the height measurement unit (20), the determination unit restricts defect determination based on the information on the height of the predetermined place measured by the height measurement unit (20).

    Position measurement method using a calibration plate to correct a detection value from the position detector

    公开(公告)号:US11709050B2

    公开(公告)日:2023-07-25

    申请号:US17771439

    申请日:2020-03-10

    Abstract: A position measurement method is used by a device including an imaging unit and a position detector that detects a position of the imaging unit to measure, using a detection value at imaging of a measurement point, position coordinates of the measurement point. The method for correcting the detection value from the position detector includes obtaining, with the device, position coordinates of predetermined indices (22) arranged two-dimensionally on a calibration plate (20) as an actual measurement value, obtaining, as a correction value, a difference between the actual measurement value and a true value resulting from transformation of position coordinates of the indices (22) with respect to a reference point on the calibration plate (20), and correcting the detection value from the position detector (8, 9, 10). The imaging unit (3) images measurement points (P) on the measurement target (3) to measure position coordinates of the measurement points (P).

    Visual inspection device and illumination condition setting method of visual inspection device

    公开(公告)号:US10805552B2

    公开(公告)日:2020-10-13

    申请号:US16219950

    申请日:2018-12-14

    Inventor: Shingo Hayashi

    Abstract: A visual inspection device and a method for setting illumination condition thereof are provided to include an illumination part irradiating illumination lights to an inspection object; an imaging part capturing an image of the inspection object; a defect detecting part analyzing the image of the inspection object captured by the imaging part and detecting a defect of the inspection object; an illumination condition setting part setting an illumination condition of the illumination lights irradiated to the inspection object; and an optimum illumination condition deriving part deriving an optimum illumination condition by scoring each of the illumination conditions based on the images captured under plural and different illumination conditions, where the optimum illumination condition is the most suitable illumination condition for detecting the defect of the inspection object by the defect detecting part.

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