公开(公告)号：US10602613B2

公开(公告)日：2020-03-24

申请号：US15560264

申请日：2016-03-08

Applicant: OMRON Corporation

Inventor： Seiki Shimoda ,  Masaaki Abe

IPC: H01H9/02 ,  H05K1/18 ,  H01H50/02 ,  H01H50/14 ,  H01H50/04 ,  H01H1/58 ,  H01H51/22

Abstract: An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

公开(公告)号：US20200020496A1

公开(公告)日：2020-01-16

申请号：US16490113

申请日：2017-12-14

Applicant: Omron Corporation

Inventor： Tetsuro Tsurusu ,  Masaaki Abe ,  Tsuyoshi Okubo ,  Yuki Honda

IPC: H01H50/04 ,  H01H50/10 ,  H01H50/14

Abstract: A high frequency relay is provided with an insulating outer housing, a relay body including an electromagnet unit and a contact mechanism unit, and a shield member. The relay body has a plate-like relay terminal, and the relay terminal is disposed such that the plate surfaces of the relay terminal extend along second surfaces of the relay body and one of the plate surfaces is exposed from at least one of the second surfaces. On the second surface, an insulator capable of insulating the relay terminal and the shield member is provided between the plate surface of the relay terminal and the shield member.

公开(公告)号：US11170958B2

公开(公告)日：2021-11-09

申请号：US16490113

申请日：2017-12-14

Applicant: Omron Corporation

Inventor： Tetsuro Tsurusu ,  Masaaki Abe ,  Tsuyoshi Okubo ,  Yuki Honda

IPC: H01H13/04 ,  H01H50/04 ,  H01H50/10 ,  H01H50/14

Abstract: A high frequency relay is provided with an insulating outer housing, a relay body including an electromagnet unit and a contact mechanism unit, and a shield member. The relay body has a plate-like relay terminal, and the relay terminal is disposed such that the plate surfaces of the relay terminal extend along second surfaces of the relay body and one of the plate surfaces is exposed from at least one of the second surfaces. On the second surface, an insulator capable of insulating the relay terminal and the shield member is provided between the plate surface of the relay terminal and the shield member.

公开(公告)号：US20180075993A1

公开(公告)日：2018-03-15

申请号：US15560282

申请日：2016-03-08

Applicant: OMRON Corporation

Inventor： Seiki Shimoda ,  Masaaki Abe

IPC: H01H50/02 ,  H01R13/03 ,  H01R31/06 ,  H01H50/44 ,  H05K1/11

CPC classification number: H01H50/02 ,  H01H50/021 ,  H01H50/14 ,  H01H50/443 ,  H01R12/57 ,  H01R12/732 ,  H01R13/03 ,  H01R31/06 ,  H05K1/119 ,  H05K2201/09145 ,  H05K2203/107

Abstract: A terminal connection structure with a good material yield and high productivity, free of mounting failure. The terminal connection structure is provided with: a base including a terminal hole, a fixed contact terminal portion, a through hole passing through the fixed contact terminal portion along its shaft center and communicating with the terminal hole, and a conductive film formed in a continuous manner on an inner circumferential surface of the terminal hole, an inner circumferential surface of the through hole, and an exposed surface of the fixed contact terminal portion; and a touch piece press-fitted into the terminal hole and electrically connected to the fixed contact terminal portion via the conductive film.

公开(公告)号：US20180070449A1

公开(公告)日：2018-03-08

申请号：US15560264

申请日：2016-03-08

Applicant: OMRON Corporation

Inventor： Seiki Shimoda ,  Masaaki Abe

IPC: H05K1/18 ,  H01H50/02 ,  H01H50/14

CPC classification number: H05K1/181 ,  H01H50/023 ,  H01H50/043 ,  H01H50/047 ,  H01H50/14 ,  H01H51/229 ,  H01H2001/5888 ,  H05K2201/10053 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10931

Abstract: An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

公开(公告)号：US20180144892A1

公开(公告)日：2018-05-24

申请号：US15876069

申请日：2018-01-19

Applicant: OMRON Corporation

Inventor： Seiki Shimoda ,  Masaaki Abe

IPC: H01H45/10 ,  H01H45/02 ,  H05K9/00

Abstract: A magnetic shield structure includes a housing made of a dielectric material, and a magnetic shield body formed by metal plating. The magnetic shield body is partially provided on at least one of an outer surface and an inner surface that form a surface of the housing made of the dielectric material.