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    SYSTEM POWER BALANCING VIA ON-DIE TELEMETRY DATA
    1.
    发明申请
    SYSTEM POWER BALANCING VIA ON-DIE TELEMETRY DATA 有权

    公开(公告)号：US20250021149A1

    公开(公告)日：2025-01-16

    申请号：US18221619

    申请日：2023-07-13

    Applicant: NVIDIA Corporation

    Inventor： Tejvansh Singh Soni ,  Xutong Li ,  Sreedhar Narayanaswamy ,  Chad Plummer ,  Pratikkumar Dilipkumar Patel ,  Tao Li

    IPC: G06F1/28 ,  G06F1/3296

    Abstract: A system includes a processing unit coupled with one or more switches via one or more links. The processing unit is to determine a total threshold power value associated with the processing unit and the one or more links and estimate a power consumption value associated with a switch of the one or more switches. The processing unit can also determine the power consumption value of the switch and a second power consumption value of the processing unit fail to satisfy the total power threshold value and responsive to determining the power consumption value and the second power consumption value fail to satisfy the total power threshold value, increase an amount of power supplied to the processing unit to satisfy the total power threshold value.

    TECHNIQUES FOR ACCURATELY DETERMINING THE TEMPERATURE AT VARIOUS LOCATIONS OF AN OPERATING INTEGRATED CIRCUIT
    3.
    发明申请
    TECHNIQUES FOR ACCURATELY DETERMINING THE TEMPERATURE AT VARIOUS LOCATIONS OF AN OPERATING INTEGRATED CIRCUIT 有权

    公开(公告)号：US20220026967A1

    公开(公告)日：2022-01-27

    申请号：US16934395

    申请日：2020-07-21

    Applicant: NVIDIA Corporation

    Inventor： Jun Gu ,  Tao Li ,  Chad Plummer ,  Brian Lawrence Smith

    IPC: G06F1/20

    Abstract: Integrated circuits (ICs)—depending on a current workload—may exceed thermal cooling budgets. As a result, ICs often implement thermal sensors to measure temperatures at junctions or hot spots along the IC. Due to a distance between the thermal sensors and the various junctions, a thermal offset may be added to the temperature readings from the thermal sensors to more accurately estimate the temperature at the junctions. To account for different workload distributions—e.g., asymmetric or symmetric—the systems and methods described herein may dynamically adjust the thermal offsets. As a result, the efficiency of the IC may be increased as thermal settings for the IC may take into account the ability of the thermal cooling budget to effectively cool the IC under a current operating condition—thereby reducing premature throttling back or shutting down of power to the IC.

    AUDIO-DRIVEN FACIAL ANIMATION USING MACHINE LEARNING
    5.
    发明申请
    AUDIO-DRIVEN FACIAL ANIMATION USING MACHINE LEARNING 有权

    公开(公告)号：US20250061634A1

    公开(公告)日：2025-02-20

    申请号：US18457251

    申请日：2023-08-28

    Applicant: Nvidia Corporation

    Inventor： Zhengyu Huang ,  Rui Zhang ,  Tao Li ,  Yingying Zhong ,  Weihua Zhang ,  Junjie Lai ,  Yeongho Seol ,  Dmitry Korobchenko ,  Simon Yuen

    IPC: G06T13/20 ,  G06T13/40 ,  G10L15/16

    Abstract: Systems and methods of the present disclosure include animating virtual avatars or agents according to input audio and one or more selected or determined emotions and/or styles. For example, a deep neural network can be trained to output motion or deformation information for a character that is representative of the character uttering speech contained in audio input. The character can have different facial components or regions (e.g., head, skin, eyes, tongue) modeled separately, such that the network can output motion or deformation information for each of these different facial components. During training, the network can use a transformer-based audio encoder with locked parameters to train an associated decoder using a weighted feature vector. The network output can be provided to a renderer to generate audio-driven facial animation that is emotion-accurate.

    Techniques for accurately determining the temperature at various locations of an operating integrated circuit
    7.
    发明授权
    Techniques for accurately determining the temperature at various locations of an operating integrated circuit 有权

    公开(公告)号：US11231760B1

    公开(公告)日：2022-01-25

    申请号：US16934395

    申请日：2020-07-21

    Applicant: NVIDIA Corporation

    Inventor： Jun Gu ,  Tao Li ,  Chad Plummer ,  Brian Lawrence Smith

    IPC: G06F1/20

    Abstract: Integrated circuits (ICs)—depending on a current workload—may exceed thermal cooling budgets. As a result, ICs often implement thermal sensors to measure temperatures at junctions or hot spots along the IC. Due to a distance between the thermal sensors and the various junctions, a thermal offset may be added to the temperature readings from the thermal sensors to more accurately estimate the temperature at the junctions. To account for different workload distributions—e.g., asymmetric or symmetric—the systems and methods described herein may dynamically adjust the thermal offsets. As a result, the efficiency of the IC may be increased as thermal settings for the IC may take into account the ability of the thermal cooling budget to effectively cool the IC under a current operating condition—thereby reducing premature throttling back or shutting down of power to the IC.

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