Abstract:
An exposure apparatus and an exposure method that minimize the range over which exposing light becomes defocused even when a non-level portion is present within each shot are provided. One shot is selected from a plurality of shots (exposure unit areas) set on a wafer (S 50). 49 measurement points are set in the selected shot and the three-dimensional coordinates of each measurement point are determined (S 70). Next, an arithmetic operation is performed using the 49 sets of three-dimensional coordinate data to ascertain an “in-shot focus plane” (S 90). This arithmetic operation may be performed through, for instance, the method of least squares. The extents of positional deviation between the surface of the selected shot and the in-shot focus plane is ascertained and the extents of deviation are stored in memory as “adjustment values” (S 110). An exposure shot to undergo exposure processing is selected and the surface level variation manifesting at the exposure shot is measured. The adjustment values are subtracted from the results of the measurement and exposing light is irradiated on the exposure shot while moving the wafer along the vertical direction in conformance to the result of the subtraction (S 130).
Abstract:
Alignment marks used in different processes are arranged on scribing lines. The scribing lines are used for cutting off individual semiconductor devices formed on a wafer, and the alignment marks have widths which are larger than widths of the scribing lines. The width of areas corresponding to position where alignment marks are formed area enlarged so as to accommodate the alignment marks within the areas. A part of the area a used alignment mark is covered with a new film so that the area is permitted to have a scribing line having a desired width every time a used alignment is generated. A new alignment mark is arranged within other areas where an alignment mark is not formed. In such an arrangement of the alignment marks, the center line of the scribing line is made clear and the area where the semiconductor devices are formed can be made large.
Abstract:
A writing implement provided with a strong clip is simple in construction and is provided with a coil spring restrained from easily falling off. The writing implement (1, 11, 21) includes a tubular body (2), a clip (3), a pillar (7) formed on the outer surface of the tubular body, a Connecting Structure® connecting the clip and the pillar, a coil spring (4) extended between the inner surface of the clip and the tubular body and capable of loading the clip such that a front end part (3aa) of the inner surface of the clip is pressed elastically against the outer surface of the tubular body, and a projection (5) formed on the outer surface of the tubular body so as to project toward the clip and fitted in the coil spring. Preferably, the clip is provided with a back wall (10) projecting from a back part (3ab) of the inner surface (3a) of the clip and the coil spring is disposed on the front side of the back wall. the projection (5) has a height not smaller than half the length of th coil spring
Abstract:
A correction pen has a joining mechanism for joining together a front end portion (11) of a barrel (1), and a coupling portion (22) of a head member (2). The joining mechanism is constructed so that an inner cylindrical portion (22b) is pressed in a first coupling section (11a), an annular bead (2a) formed on an outer cylindrical portion (22a) squeezes a second coupling section (11b), and a bead (2c) formed on a step (22c) is pressed against the front end surface (1a) of the first coupling section when an annular ridge (1b) formed on the second coupling section (11b) is fitted in an annular groove (2b) formed in the outer cylindrical portion (22a). A ball holding tube (7) is provided with a ball housing bore (7b) and a connecting bore (7d) formed so that a low step is formed between the ball housing bore and the connecting bore. The edge of the tip of the ball holding tube is rounded. A head member is provided with a spring support portion (2f) for supporting a coil spring (8), provided with slots (2g). A cap releasing member (9) for releasing a cap (5) put on a head portion(222) of a barrel assembly (E) has operating portions disposed on the side surface of the cap so as to be in contact with an inclined portion (2h) of the head member.
Abstract:
A cap is fitted onto an engagement portion of a main body such as that of a writing implement, paint applicator, make-up applicator, or container. An inner wall of the cap is provided with a flexible operating member having a free end capable of bending inward. An oblique guide surface is formed on at least one of the main body and the cap such that the cap can be separated from the main body by pressing the operating member inward.
Abstract:
In order to mount a power transistor chip, a multilayered member formed by fixing a molybdenum plate to a copper base is flattened by eliminating its deformation in the member caused by heated fixing through elastic working, it is possible to prevent cracking in a power transistor chip or a solder layer caused by the deformation. Especially, it is possible to improve the reliability of an electronic distributing type ignition device mounted on an engine block formed in a unit of an ignition controller and an ignition coil.
Abstract:
An ignition system of electronic distribution type for an internal combustion engine with which merits of sharing circuits and elements can be expected with satisfactory result, in which wires of a GND line will not be disconnected by fusion even under a condition of abnormal power supply, and in which the engine will not be stalled even in a mode of simultaneously igniting two cylinders, thus enabling the limp-form traveling and made start-up with simultaneous ignition of two cylinders. To this end, power transistors 20 through 25 for power supply control and feedback control circuits 30 through 35 for limiting currents are respectively provided to control ignition coils 4 through 9 in one-to-one relation. A total of two systems of resistance devices 17a, 17b for detecting currents are provided with each resistance device operating a respective group of three cylinders. The feedback control circuits and the resistance devices for detecting currents are formed on a thick-film circuit board 60. Wires 50a, 50b used for connection between a GND portion on the thickfilm circuit board and an external GND terminal 50 are provided in the same number, i.e., two, as the number of resistance devices. The sequence of power distribution to the cylinders is determined, taking into account the fact that the resistance devices for detecting currents are each allocated to a respective group of three cylinders.
Abstract:
An alignment mark formed on a semiconductor wafer is disclosed. The mark comprises a mark member provided on a base region and a reflection changing portion provided on the mark member. The reflection changing portion has slightly inclined side walls.
Abstract:
An electric power steering drive system provided with a motor with its torque pulsation reduced, and a controller characterized by excellent manufacturability.The stator core of a motor is composed of an annular back core and a plurality of teeth created separately from the back core and secured on the inner periphery of the back core. An 8-pole/9-slot, 10-pole/9-slot or 10-pole/12-slot relationship is found between the number of the magnets of a rotor (number of poles) and the number of slots. The diameter of the stator coil is 1.0 mm or more. A motor controller comprises a power module, a conductor module and a control module. The terminal of the power module and the bus bar of the conductor module are connected by welding, whereas the terminal of the power module and terminal of the control module are connected by soldering.
Abstract:
Alignment marks used in different processes are arranged on scribing lines. The scribing lines are used for cutting off individual semiconductor devices formed on a wafer, and the alignment marks have widths which are larger than widths of the scribing lines. The width of areas corresponding to positions where alignment marks are formed are larger so as to accommodate the alignment marks within the areas. A part of the area of a used alignment mark is covered with a new film so that the area is permitted to have a scribing line having a desired width every time a used alignment is generated. A new alignment mark is arranged within other areas where an alignment mark is not formed. In such an arrangement of the alignment marks, the center line of the scribing line is made clear, and the area where the semiconductor devices are formed can be made large.