Method for forming a thin film transistor using an electrostatic shield
    1.
    发明授权
    Method for forming a thin film transistor using an electrostatic shield 失效
    使用静电屏蔽形成薄膜晶体管的方法

    公开(公告)号:US5899708A

    公开(公告)日:1999-05-04

    申请号:US872781

    申请日:1997-06-10

    摘要: In manufacturing a semiconductor device on a glass substrate, a conductive thin-film (for instance, a conductivity-imparted silicon film) is formed on the bottom surface side of the glass substrate at the initial stage of a manufacturing process. Since the conductive thin film serves as an electrostatic shield, the glass substrate is prevented from being electrified directly, whereby electrostatic breakdown of device elements as would otherwise be caused by electrification of the glass substrate can be avoided.

    摘要翻译: 在制造玻璃基板上的半导体装置时,在制造工序的初始阶段,在玻璃基板的底面侧形成有导电性薄膜(例如导电性赋予硅膜)。 由于导电薄膜用作静电屏蔽,因此可以防止玻璃基板直接通电,从而可以避免玻璃基板带电导致器件元件的静电击穿。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
    半导体器件及其制造方法

    公开(公告)号:US20120068266A1

    公开(公告)日:2012-03-22

    申请号:US13282515

    申请日:2011-10-27

    IPC分类号: H01L27/12

    摘要: A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor having low leak current and high mobility are obtained in the same time in a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.

    摘要翻译: 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 在具有薄膜晶体管的动态电路中同时获得具有低漏电流和高迁移率的晶体管,在半导体层上选择性地形成覆盖膜,半导体层将成为晶体管的有源层,并且之后将其热结晶 。

    Semiconductor thin film and method of manufacturing the same and semiconductor device and method of manufacturing the same
    6.
    发明授权
    Semiconductor thin film and method of manufacturing the same and semiconductor device and method of manufacturing the same 有权
    半导体薄膜及其制造方法以及半导体装置及其制造方法

    公开(公告)号:US08008693B2

    公开(公告)日:2011-08-30

    申请号:US11670462

    申请日:2007-02-02

    摘要: A thin film semiconductor transistor structure has a substrate with a dielectric surface, and an active layer made of a semiconductor thin film exhibiting a crystallinity as equivalent to the single-crystalline. To fabricate the transistor, the semiconductor thin film is formed on the substrate, which film includes a mixture of a plurality of crystals which may be columnar crystals and/or capillary crystal substantially parallel to the substrate. The resultant structure is then subject to thermal oxidation in a chosen atmosphere containing halogen, thereby removing away any metallic element as contained in the film. This may enable formation of a mono-domain region in which the individual columnar or capillary crystal is in contact with any adjacent crystals and which is capable of being substantially deemed to be a single-crystalline region without presence or inclusion of any crystal grain boundaries therein. This region is for use in forming the active layer of the transistor.

    摘要翻译: 薄膜半导体晶体管结构具有具有电介质表面的基板和由半导体薄膜制成的有源层,其表现出与单晶相当的结晶度。 为了制造晶体管,在衬底上形成半导体薄膜,该薄膜包括可以是基本上平行于衬底的柱状晶体和/或毛细晶体的多个晶体的混合物。 然后在所选择的含有卤素的气氛中对所得结构进行热氧化,从而去除膜中所含的任何金属元素。 这可以形成单畴区域,其中单个柱状或毛细晶体晶体与任何相邻晶体接触,并且其能够基本上被认为是单晶区域,而不存在或包含任何晶粒边界 。 该区域用于形成晶体管的有源层。

    Light emitting device and manufacturing method thereof
    8.
    发明授权
    Light emitting device and manufacturing method thereof 有权
    发光元件及其制造方法

    公开(公告)号:US07820464B2

    公开(公告)日:2010-10-26

    申请号:US12408194

    申请日:2009-03-20

    IPC分类号: H01L21/00

    摘要: The light emitting device according to the present invention is characterized in that a gate electrode comprising a plurality of conductive films is formed, and concentrations of impurity regions in an active layer are adjusted with making use of selectivity of the conductive films in etching and using them as masks. The present invention reduces the number of photolithography steps in relation to manufacturing the TFT for improving yield of the light emitting device and shortening manufacturing term thereof, by which a light emitting device and an electronic appliance are inexpensively provided.

    摘要翻译: 根据本发明的发光器件的特征在于,形成包括多个导电膜的栅电极,并且利用蚀刻中的导电膜的选择性并使用它们来调节有源层中的杂质区域的浓度 作为面具。 本发明减少了相对于制造用于提高发光装置的产量的TFT并缩短其制造术语的光刻步骤的数量,通过该步骤,廉价地提供了发光装置和电子设备。

    Film Deposition Apparatus and a Method of Manufacturing a Light Emitting Device Using the Apparatus
    10.
    发明申请
    Film Deposition Apparatus and a Method of Manufacturing a Light Emitting Device Using the Apparatus 审中-公开
    薄膜沉积装置和使用该装置制造发光装置的方法

    公开(公告)号:US20100255184A1

    公开(公告)日:2010-10-07

    申请号:US12759776

    申请日:2010-04-14

    IPC分类号: B05D5/06

    摘要: To provide a film deposition apparatus capable of forming an EL element of high reliability. An oxidization cell (205) is placed in a liquid phase film deposition chamber (109) such as a spin coater. The oxidization cell is provided with an oxygen gettering agent (209) comprised of an element that belongs to Group 1 or 2 of the periodic table. The oxygen gettering agent (209) is oxidized consuming oxygen in the atmosphere of the chamber, to thereby reduce the oxygen concentration in the atmosphere to 1 ppb or less. This makes it possible to form an EL element in a substantially oxygen-less state, greatly improving the reliability of the EL element.

    摘要翻译: 提供能够形成高可靠性的EL元件的成膜装置。 将氧化池(205)放置在诸如旋转涂布机的液相成膜室(109)中。 氧化池配有由元素组成的吸气剂(209),该元素属于元素周期表第1族或第2族。 氧吸气剂(209)在室的气氛中氧化消耗氧,从而将大气中的氧浓度降低至1ppb以下。 这使得可以形成基本上无氧状态的EL元件,大大提高了EL元件的可靠性。