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    Power module cooling system
    1.
    发明授权
    Power module cooling system 有权
    电源模块冷却系统

    公开(公告)号：US09030822B2

    公开(公告)日：2015-05-12

    申请号：US13209552

    申请日：2011-08-15

    申请人： Nadir Sharaf ,  Yu Qin ,  Reshma Rathod ,  Richard J. Hampo

    发明人： Nadir Sharaf ,  Yu Qin ,  Reshma Rathod ,  Richard J. Hampo

    IPC分类号： H05K7/20 ,  H02M7/00 ,  F28F7/00 ,  H01L23/34 ,  H02M7/48

    CPC分类号： H02M1/44 ,  H01G4/228 ,  H02M7/003 ,  H02M7/493 ,  H02M2007/4822 ,  H05K7/20927

    摘要： A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic assembly where two power modules may be arranged in an opposing relationship relative to a coolant passageway. The opposing relationship may be suitable to minimizing a packaging size and footprint required to facilitate interacting both power modules with the coolant flow.

    摘要翻译： 冷却系统可操作以便于冷却功率模块或其它电子组件。 冷却系统可以被配置为便于冷却DC / AC逆变器或其它电子组件，其中两个功率模块可以相对于冷却剂通道以相对的关系布置。 相反的关系可能适合于最小化促进功率模块与冷却剂流动相互作用所需的封装尺寸和占地面积。

    POWER MODULE COOLING SYSTEM
    2.
    发明申请
    POWER MODULE COOLING SYSTEM 有权
    电源模块冷却系统

    公开(公告)号：US20130044434A1

    公开(公告)日：2013-02-21

    申请号：US13209552

    申请日：2011-08-15

    申请人： Nadir Sharaf ,  Yu Qin ,  Reshma Rathod ,  Richard J. Hampo

    发明人： Nadir Sharaf ,  Yu Qin ,  Reshma Rathod ,  Richard J. Hampo

    IPC分类号： H05K7/20

    CPC分类号： H02M1/44 ,  H01G4/228 ,  H02M7/003 ,  H02M7/493 ,  H02M2007/4822 ,  H05K7/20927

    摘要： A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic assembly where two power modules may be arranged in an opposing relationship relative to a coolant passageway. The opposing relationship may be suitable to minimizing a packaging size and footprint required to facilitate interacting both power modules with the coolant flow.

    摘要翻译： 冷却系统可操作以便于冷却功率模块或其它电子组件。 冷却系统可以被配置为便于冷却DC / AC逆变器或其它电子组件，其中两个功率模块可以相对于冷却剂通道以相对的关系布置。 相反的关系可能适合于最小化促进功率模块与冷却剂流动相互作用所需的封装尺寸和占地面积。

    PRINTED CIRCUIT BOARD CONNECTION ASSEMBLY
    5.
    发明申请
    PRINTED CIRCUIT BOARD CONNECTION ASSEMBLY 有权
    印刷电路板连接总成

    公开(公告)号：US20120129362A1

    公开(公告)日：2012-05-24

    申请号：US13209870

    申请日：2011-08-15

    申请人： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

    发明人： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

    IPC分类号： H01R12/71

    CPC分类号： H01R12/71 ,  H01R12/718 ,  H05K1/0262 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10303

    摘要： In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.

    摘要翻译： 在至少一个实施例中，车辆功率模块包括第一印刷电路板（PCB），其包括用于提供第一电压和第二电压的第一多个电气部件。 所述车辆动力模块还包括包括第二多个电气部件的第二PCB，所述第二PCB与所述第一印刷电路板间隔开;以及第一连接器组件，其耦合到所述第一PCB和所述第二PCB，以提供所述第一电压 到第二个PCB。 车辆动力模块还包括耦合到第一PCB和第二PCB的第二连接器组件，用于向第二PCB提供第二电压。 第一连接器组件提供高达14V的第一电压，并且第二连接器组件提供200V或更大的第二电压。

    Coldplate for Use in an Electric Vehicle (EV) or a Hybrid-Electric Vehicle (HEV)
    7.
    发明申请
    Coldplate for Use in an Electric Vehicle (EV) or a Hybrid-Electric Vehicle (HEV) 有权
    用于电动车辆（EV）或混合电动车辆（HEV）的冷板

    公开(公告)号：US20130312931A1

    公开(公告)日：2013-11-28

    申请号：US13477652

    申请日：2012-05-22

    申请人： Nadir Sharaf ,  Dilip Daftuar ,  George Kaminski ,  Venkat Yalamanchili ,  Richard J. Hampo

    发明人： Nadir Sharaf ,  Dilip Daftuar ,  George Kaminski ,  Venkat Yalamanchili ,  Richard J. Hampo

    IPC分类号： F28F9/007

    CPC分类号： H05K7/209 ,  H05K7/20927 ,  Y10T307/50

    摘要： A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

    摘要翻译： 一种用于电动车辆（EV）或混合电动车辆（HEV）中的电子部件的冷板。 冷板包括在其表面上具有多个凸起特征的主要部分。 凸起特征被构造用于将主要部分附接到具有附接到其上的多个电子部件的印刷电路板。 升高的特征还被构造成用于将印刷电路板相对于主要部分保持间隔开的关系，以促进印刷电路板和主要部分之间的空气流动，以便耗散由多个电子部件产生的热量。 冷板还包括从主要部分的表面延伸的突起。 所述突起构造成用于接触附接到所述印刷电路板的所述多个电子部件中的一个，以散发由所述电子部件产生的热量。

    Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)
    8.
    发明授权
    Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) 有权
    用于电动车辆（EV）或混合动力汽车（HEV）的冷板

    公开(公告)号：US08971038B2

    公开(公告)日：2015-03-03

    申请号：US13477652

    申请日：2012-05-22

    申请人： Nadir Sharaf ,  Dilip Daftuar ,  George Kaminski ,  Venkat Yalamanchili ,  Richard J. Hampo

    发明人： Nadir Sharaf ,  Dilip Daftuar ,  George Kaminski ,  Venkat Yalamanchili ,  Richard J. Hampo

    IPC分类号： F28F9/007 ,  H05K7/20 ,  G06F1/20 ,  H02M3/28

    CPC分类号： H05K7/209 ,  H05K7/20927 ,  Y10T307/50

    摘要： A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

    摘要翻译： 一种用于电动车辆（EV）或混合电动车辆（HEV）中的电子部件的冷板。 冷板包括在其表面上具有多个凸起特征的主要部分。 凸起特征被构造用于将主要部分附接到具有附接到其上的多个电子部件的印刷电路板。 升高的特征还被构造成用于将印刷电路板相对于主要部分保持间隔开的关系，以促进印刷电路板和主要部分之间的空气流动，以便耗散由多个电子部件产生的热量。 冷板还包括从主要部分的表面延伸的突起。 所述突起构造成用于接触附接到所述印刷电路板的所述多个电子部件中的一个，以散发由所述电子部件产生的热量。

    Printed circuit board connection assembly
    9.
    发明授权
    Printed circuit board connection assembly 有权
    印刷电路板连接组件

    公开(公告)号：US08446733B2

    公开(公告)日：2013-05-21

    申请号：US13209870

    申请日：2011-08-15

    申请人： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

    发明人： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

    IPC分类号： H01R9/00

    CPC分类号： H01R12/71 ,  H01R12/718 ,  H05K1/0262 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10303

    摘要： In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.

    摘要翻译： 在至少一个实施例中，车辆功率模块包括第一印刷电路板（PCB），其包括用于提供第一电压和第二电压的第一多个电气部件。 所述车辆动力模块还包括包括第二多个电气部件的第二PCB，所述第二PCB与所述第一印刷电路板间隔开;以及第一连接器组件，其耦合到所述第一PCB和所述第二PCB，以提供所述第一电压 到第二个PCB。 车辆动力模块还包括耦合到第一PCB和第二PCB的第二连接器组件，用于向第二PCB提供第二电压。 第一连接器组件提供高达14V的第一电压，并且第二连接器组件提供200V或更大的第二电压。