公开(公告)号：US08994194B2

公开(公告)日：2015-03-31

申请号：US14171975

申请日：2014-02-04

Applicant: NXP B.V.

Inventor： David van Steenwinckel ,  Thomas Merelle ,  Franciscus Petrus Widdershoven ,  Viet Hoang Nguyen ,  Dimitri Soccol ,  Jan Leo Dominique Fransaer

IPC: H01L21/02 ,  H01L29/66 ,  H01L29/40 ,  G01N27/414 ,  G01N27/327

CPC classification number: G01N27/4145 ,  G01N27/3275 ,  H01L29/66

Abstract: A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed.

Abstract translation: 一种制造生物传感器半导体器件的方法，其中在器件的主表面上的铜电极被改性以形成Au-Cu合金电极。 通过在器件上沉积金层，然后对该器件进行热处理以促进金和电极铜之间的相互扩散来实现这种修改。 从器件的表面去除合金金铜，留下暴露的电极。 与常规铜电极的情况相比，电极与生物传感器装置的进一步处理更好地兼容，并且处理窗口比金盖铜电极宽。 还公开了具有Au-Cu合金电极的生物传感器半导体器件。

公开(公告)号：US20140159173A1

公开(公告)日：2014-06-12

申请号：US14171975

申请日：2014-02-04

Applicant: NXP B.V.

Inventor： David van Steenwinckel ,  Thomas Merelle ,  Franciscus Petrus Widdershoven ,  Viet Hoang Nguyen ,  Dimitri Soccoi ,  Jan Leo Dominique Fransaer

IPC: G01N27/414

CPC classification number: G01N27/4145 ,  G01N27/3275 ,  H01L29/66

Abstract: A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed.

Abstract translation: 一种制造生物传感器半导体器件的方法，其中在器件的主表面上的铜电极被改性以形成Au-Cu合金电极。 通过在器件上沉积金层，然后对该器件进行热处理以促进金和电极铜之间的相互扩散来实现这种修改。 从器件的表面去除合金金铜，留下暴露的电极。 与常规铜电极的情况相比，电极与生物传感器装置的进一步处理更好地兼容，并且处理窗口比金盖铜电极宽。 还公开了具有Au-Cu合金电极的生物传感器半导体器件。