公开(公告)号：US09651498B2

公开(公告)日：2017-05-16

申请号：US14412479

申请日：2013-07-02

Applicant: NOVA MEASURING INSTRUMENTS LTD.

Inventor： Gilad Barak ,  Elad Dotan ,  Alon Belleli

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95 ,  H01L21/66 ,  G01N21/55

CPC classification number: G01N21/8806 ,  G01N21/55 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2201/12 ,  H01L22/12

Abstract: A method and system are presented for use in inspection of via containing structures. According to this technique, measured data indicative of a spectral response of a via-containing region of a structure under measurements is processed, and, upon identifying a change in at least one parameter of the spectral response with respect to a spectral signature of the via-containing region, output data is generated indicative of a possible defect at an inner surface of the via.

公开(公告)号：US20150192527A1

公开(公告)日：2015-07-09

申请号：US14412479

申请日：2013-07-02

Applicant: NOVA MEASURING INSTRUMENTS LTD.

Inventor： Gilad Barak ,  Elad Dotan ,  Alon Belleli

IPC: G01N21/88 ,  G01N21/55

CPC classification number: G01N21/8806 ,  G01N21/55 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2201/12 ,  H01L22/12

Abstract: A method and system are presented for use in inspection of via containing structures. According to this technique, measured data indicative of a spectral response of a via-containing region of a structure under measurements is processed, and, upon identifying a change in at least one parameter of the spectral response with respect to a spectral signature of the via-containing region, output data is generated indicative of a possible defect at an inner surface of the via.

Abstract translation: 提出了一种方法和系统，用于检查通孔容纳结构。 根据该技术，处理指示测量结构的通孔容纳区域的光谱响应的测量数据，并且在识别关于光通路的光谱特征的光谱响应的至少一个参数的变化时 产生指示通孔内表面可能存在缺陷的输出数据。

公开(公告)号：US10018574B2

公开(公告)日：2018-07-10

申请号：US15325877

申请日：2015-07-14

Applicant: NOVA MEASURING INSTRUMENTS LTD.

Inventor： Gilad Barak ,  Elad Dotan ,  Alon Belleli

IPC: G01N21/956 ,  G01N21/88 ,  G01N21/95 ,  G06T7/00

CPC classification number: G01N21/95692 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/8822 ,  G01N2021/8825 ,  G01N2021/8848 ,  G06T7/0004 ,  G06T7/0008 ,  G06T7/001 ,  G06T7/136 ,  G06T2207/10056 ,  G06T2207/30148

Abstract: An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.