-
公开(公告)号：US11676936B2
公开(公告)日：2023-06-13
申请号：US17050113
申请日：2019-03-27
发明人： Ryota Mita , Tomoaki Ichikawa
IPC分类号： H01L23/00 , H01L21/48 , H01L21/56 , H01L21/683 , H01L21/78
CPC分类号： H01L24/83 , H01L21/4853 , H01L21/565 , H01L21/6836 , H01L21/78 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2221/68336 , H01L2224/29239 , H01L2224/29247 , H01L2224/29286 , H01L2224/32225 , H01L2224/48225 , H01L2224/73265 , H01L2224/8384 , H01L2924/01029 , H01L2924/01047 , H01L2924/0541 , H01L2924/1033 , H01L2924/10272
摘要： A manufacturing method includes the step of forming a diced semiconductor wafer (10) including semiconductor chips (11) from a semiconductor wafer (W) typically on a dicing tape (T1). The diced semiconductor wafer (10) on the dicing tape (T1) is laminated with a sinter-bonding sheet (20). The semiconductor chips (11) each with a sinter-bonding material layer (21) derived from the sinter-bonding sheet (20) are picked up typically from the dicing tape (T1). The semiconductor chips (11) each with the sinter-bonding material layer are temporarily secured through the sinter-bonding material layer (21) to a substrate. Through a heating process, sintered layers are formed from the sinter-bonding material layers (21) lying between the temporarily secured semiconductor chips (11) and the substrate, to bond the semiconductor chips (11) to the substrate. The semiconductor device manufacturing method is suitable for efficiently supplying a sinter-bonding material to individual semiconductor chips while reducing loss of the sinter-bonding material.
-
公开(公告)号：US10796941B2
公开(公告)日：2020-10-06
申请号：US16069923
申请日：2017-01-10
发明人： Shotaro Masuda , Tomoaki Ichikawa , Yohei Maeno
IPC分类号： C01B32/158 , H01L21/687 , B82Y30/00 , H01L21/677 , H01L21/683 , C01B32/152 , C01B32/16
摘要： Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.
-
公开(公告)号：US11948907B2
公开(公告)日：2024-04-02
申请号：US17360144
申请日：2021-06-28
发明人： Ryota Mita , Tomoaki Ichikawa
IPC分类号： H01L23/00
CPC分类号： H01L24/29 , H01L24/32 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29386 , H01L2224/32245 , H01L2224/83986
摘要： The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23° C., which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.
-
公开(公告)号：US11420832B2
公开(公告)日：2022-08-23
申请号：US16084628
申请日：2017-03-14
IPC分类号： B32B9/04 , B65G49/07 , H01L21/673 , H01L21/687 , B32B5/02 , B32B7/12 , H01L21/677 , H01L21/683
摘要： Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.
-
公开(公告)号：US11839936B2
公开(公告)日：2023-12-12
申请号：US16818088
申请日：2020-03-13
发明人： Ryota Mita , Tomoaki Ichikawa
CPC分类号： B23K35/24 , B23K26/702 , B32B5/16 , B32B2260/025 , B32B2260/046 , B32B2264/105 , B32B2307/536 , H01L21/4814
摘要： To provide a sheet for sintering bonding and the same with a base material suited for lamination and integration and also suited for realizing satisfactory operational efficiency in a sintering process in a process of producing semiconductor devices that go through sintering bonding of semiconductor chips. A sheet for sintering bonding 10 of the present invention comprises an electrically conductive metal containing sinterable particle and a binder component. In this sheet, the minimum load, reached during an unloading process in load-displacement measurement according to a nanoindentation method, is −100 to −30 μN. Alternatively, the ratio of the minimum load to a maximum load, reached during a load applying process in the above measurement, is −0.2 to −0.06. A sheet body X, a sheet for sintering bonding with a base material of the present invention, has a laminated structure comprising a base material B and the sheet 10.
-
公开(公告)号：US11697567B2
公开(公告)日：2023-07-11
申请号：US16818398
申请日：2020-03-13
发明人： Ryota Mita , Tomoaki Ichikawa
CPC分类号： B65H18/02 , B23K35/0233 , H01L24/26 , B65H2511/13 , B65H2511/14 , B65H2701/361 , H01L2224/04026
摘要： To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.
-
公开(公告)号：US20220230989A1
公开(公告)日：2022-07-21
申请号：US17576084
申请日：2022-01-14
发明人： Mayu Sato , Tomoaki Ichikawa , Ryota Mita
IPC分类号： H01L23/00 , H01L23/495
摘要： The present invention provides a method for producing a semiconductor device, including: a semiconductor chip-mounting step of subsequently pressing a plurality of semiconductor chips by a first pressing member to respectively bond the plurality of semiconductor chips to a plurality of mounting areas provided on a substrate, wherein the bonding is performed in a state where adhesive sheets are respectively interposed between the plurality of semiconductor chips and the plurality of mounting areas, each of the adhesive sheets includes sinterable metal particles that can be sintered by heating at a temperature of 400° C. or less, and the first pressing member is heated to a temperature, at which the sinterable metal particles can be sintered.
-
公开(公告)号：US20220130790A1
公开(公告)日：2022-04-28
申请号：US17509378
申请日：2021-10-25
发明人： Rena Kojima , Tomoaki Ichikawa
IPC分类号： H01L23/00 , C08J5/18 , C08L33/04 , C09K5/14 , C08J5/12 , H01L23/495 , H01L21/683
摘要： Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less that is measured in a state before being cured.
-
公开(公告)号：US20210403784A1
公开(公告)日：2021-12-30
申请号：US17350235
申请日：2021-06-17
发明人： Rena Kojima , Tomoaki Ichikawa
IPC分类号： C09K5/14 , C08L63/00 , C08J5/18 , H01L21/683
摘要： A thermosetting sheet according to the present invention includes: a thermosetting resin; a thermoplastic resin; and conductive particles. The conductive particles includes silver particles having an average particle size D50 of 0.01 μm or more and 10 μm or less, and having a circularity in cross section of 0.7 or more. The thermosetting sheet has a viscosity at 100° C. of 20 kPa·s or more and 3000 kPa·s or less.
-
公开(公告)号：US20200290833A1
公开(公告)日：2020-09-17
申请号：US16818398
申请日：2020-03-13
发明人： Ryota MITA , Tomoaki Ichikawa
IPC分类号： B65H18/02
摘要： To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.
-
-
-
-
-
-
-
-
-
搜索结果
21 条记录 (耗时 0.018 秒)
