公开(公告)号：US20030116347A1

公开(公告)日：2003-06-26

申请号：US10246666

申请日：2002-09-19

申请人： NITTO DENKO CORPORATION ,  NEC CORPORATION

发明人： Masahiro Kubo ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi

IPC分类号： H05K001/16

CPC分类号： H01L23/293 ,  C08G59/5033 ,  C08G59/504 ,  C08K5/18 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01087 ,  H01L2924/10253 ,  C08L63/00 ,  H01L2924/00

摘要： An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between the circuit board and the semiconductor chip being filled with a sealing resin layer, wherein the sealing resin layer is formed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,Nnull,Nnull-tetrasubstituted fluorine-containing aromatic diamine derivative.

摘要翻译： 描述了一种电子部件，其包含具有用于连接的电极的印刷电路板和具有连接用电极的半导体芯片，该半导体芯片安装在所述电路板上，其电极与电路板的电极相对，电路板和半导体之间的间隙 其中所述密封树脂层由液态环氧树脂组合物形成，所述液体环氧树脂组合物含有（A）液体环氧树脂，（B）固化剂，（C）无机填料和（D） N，N，N'，N'-四取代的含氟芳族二胺衍生物。

公开(公告)号：US20030064147A1

公开(公告)日：2003-04-03

申请号：US10252431

申请日：2002-09-24

申请人： NITTO DENKO CORPORATION

发明人： Hirofumi Fujii ,  Koji Matsui ,  Hideaki Taki ,  Shunichi Hayashi ,  Makoto Saito

IPC分类号： B05D005/12 ,  B05D003/04 ,  B05D003/10

CPC分类号： H05K3/28 ,  H05K1/0393 ,  H05K2203/0143 ,  H05K2203/0759 ,  H05K2203/0783 ,  H05K2203/1545

摘要： A method for manufacturing a flexible printed circuit in which a resin solution is applied onto a circuit substrate having a wiring pattern on its surface so as to form a resin cover layer, having the steps of: wetting the surface of the circuit substrate with a solvent which is capable of dissolving the resin; applying the resin solution onto the surface wetted with the solvent; and drying the resin solution to thereby form the resin cover layer. A flexible printed circuit obtained in the manufacturing method.

摘要翻译： 一种制造柔性印刷电路的方法，其中将树脂溶液施加到其表面上具有布线图案的电路基板上以形成树脂覆盖层，其具有以下步骤：用溶剂润湿电路基板的表面 其能够溶解树脂; 将树脂溶液施加到用溶剂润湿的表面上; 并干燥树脂溶液从而形成树脂覆盖层。 在制造方法中获得的柔性印刷电路。