公开(公告)号：US20020108781A1

公开(公告)日：2002-08-15

申请号：US10119695

申请日：2002-04-11

申请人： NITTO DENKO CORPORATION

发明人： Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H05K003/10 ,  H05K001/11

CPC分类号： H01L21/486 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner insulator layer 23 having inner electrodes 27, the electrodes 31 and/or 27 having been formed by electroplating using, as a negative electrode, a metal plate 32 that has been provided on the outer insulator layer 22 and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.

摘要翻译： 一种印刷电路板，特别是用于芯片级封装的插入件20，包括具有外部电极31，导体层21和具有内部电极27，电极31和/或27的内部绝缘体层23的外部绝缘体层22 通过使用已经设置在外绝缘体层22上并在电镀之后去除的金属板32作为负极来进行电镀而形成。 没有电镀引线，印刷线路板具有以细间距和高密度有序排列的电极。

公开(公告)号：US20020132095A1

公开(公告)日：2002-09-19

申请号：US10041451

申请日：2002-01-10

申请人： NITTO DENKO CORPORATION

发明人： Hirofumi Fujii ,  Shunichi Hayashi

IPC分类号： B32B003/00

CPC分类号： H05K1/0346 ,  B32B15/08 ,  H05K3/285 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： The present invention provides a resin composition for a wiring circuit board; a substrate for a wiring circuit board in which a base insulating layer has been formed from the resin composition for a wiring circuit board; and a wiring circuit board having insulating layers including a cover insulating layer formed from the resin composition for a wiring circuit board. The resin composition for a wiring circuit board, the substrate for a wiring circuit board, and the wiring circuit board can prevent warpage and curling, increase adhesion between the insulating layer and the conductor layer, and enhance the durability and reliability of the wiring circuit board. The resin composition for a wiring circuit board contains a polyimide resin precursor, and a polyhydric phenol compound.

摘要翻译： 本发明提供了一种用于布线电路板的树脂组合物; 用于布线电路板的基板，其中已经由布线电路板用树脂组合物形成了基底绝缘层; 以及具有绝缘层的布线电路板，所述绝缘层包括由用于布线电路板的树脂组合物形成的覆盖绝缘层。 用于布线电路板的树脂组合物，布线电路板的基板和布线电路板可以防止翘曲和卷曲，增加绝缘层和导体层之间的粘附性，并且提高布线电路板的耐久性和可靠性 。 用于布线电路板的树脂组合物含有聚酰亚胺树脂前体和多元酚化合物。

公开(公告)号：US20030064147A1

公开(公告)日：2003-04-03

申请号：US10252431

申请日：2002-09-24

申请人： NITTO DENKO CORPORATION

发明人： Hirofumi Fujii ,  Koji Matsui ,  Hideaki Taki ,  Shunichi Hayashi ,  Makoto Saito

IPC分类号： B05D005/12 ,  B05D003/04 ,  B05D003/10

CPC分类号： H05K3/28 ,  H05K1/0393 ,  H05K2203/0143 ,  H05K2203/0759 ,  H05K2203/0783 ,  H05K2203/1545

摘要： A method for manufacturing a flexible printed circuit in which a resin solution is applied onto a circuit substrate having a wiring pattern on its surface so as to form a resin cover layer, having the steps of: wetting the surface of the circuit substrate with a solvent which is capable of dissolving the resin; applying the resin solution onto the surface wetted with the solvent; and drying the resin solution to thereby form the resin cover layer. A flexible printed circuit obtained in the manufacturing method.

摘要翻译： 一种制造柔性印刷电路的方法，其中将树脂溶液施加到其表面上具有布线图案的电路基板上以形成树脂覆盖层，其具有以下步骤：用溶剂润湿电路基板的表面 其能够溶解树脂; 将树脂溶液施加到用溶剂润湿的表面上; 并干燥树脂溶液从而形成树脂覆盖层。 在制造方法中获得的柔性印刷电路。

公开(公告)号：US20020055062A1

公开(公告)日：2002-05-09

申请号：US09983943

申请日：2001-10-26

申请人： NITTO DENKO CORPORATION

发明人： Shunichi Hayashi ,  Hirofumi Fujii

IPC分类号： G03F007/004

CPC分类号： G03F7/0387 ,  G03F7/0045 ,  H05K3/287 ,  Y10S430/106

摘要： A photosensitive resin composition which is excellent in both sensitivity and resolution, can be rapidly developed with an aqueous alkali solution alone, further has excellent adhesion to substrates, and can give through imidization a light-colored polyimide resin film; and a circuit board having an insulating layer obtained from the photosensitive resin composition. The photosensitive resin composition comprises a poly(amic acid) resin, a 1,4-dihydropyridine derivative and a polyethylene glycol, and may optionally further contain a polyhydric phenol compound. This photosensitive resin composition can be developed at a high rate with a developing solution consisting only of an aqueous alkali solution. As a result, a satisfactory negative-pattern film which is a light-colored film can be formed with high sensitivity, high resolution, and a reduced film loss while preventing film coloration.

摘要翻译： 敏感性和分辨率优异的感光性树脂组合物可以单独用碱性水溶液快速显影，进一步具有优异的与基材的粘合性，并且可以通过酰亚胺化得到浅色聚酰亚胺树脂膜; 以及具有由感光性树脂组合物得到的绝缘层的电路基板。 感光性树脂组合物包含聚（酰胺酸）树脂，1,4-二氢吡啶衍生物和聚乙二醇，还可以含有多元酚化合物。 该感光性树脂组合物可以用仅由碱性水溶液构成的显影液高速显影。 结果，在防止膜着色的同时，可以以高灵敏度，高分辨率和降低的膜损失形成作为浅色膜的令人满意的负图案膜。

公开(公告)号：US20040013953A1

公开(公告)日：2004-01-22

申请号：US10424772

申请日：2003-04-29

申请人： NITTO DENKO CORPORATION

发明人： Kazunori Mune ,  Amane Mochizuki ,  Shunichi Hayashi ,  Hirofumi Fujii ,  Takahiro Fukuoka ,  Ryusuke Naitou

IPC分类号： G03F007/038

CPC分类号： G03F7/0387 ,  C08K5/06 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0005 ,  G03F7/001 ,  G03F7/0045 ,  C08L2666/22

摘要： A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5-50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

摘要翻译： 能够提供基本不着色的聚酰亚胺树脂的光敏聚酰亚胺树脂前体组合物是透明的并且具有耐热性，由该组合物获得的光学聚酰亚胺树脂和使用该聚酰亚胺树脂的光波导。 感光性聚酰亚胺树脂前体组合物含有（a）100重量份由四羧酸二酐和二胺获得的聚酰胺酸，（b）0.01重量份以上且小于5重量份的1,4-二 二氢吡啶衍生物，（c）5-50重量份二醇（醚）。 通过用紫外光照射感光性树脂前体组合物，然后曝光，加热，显影，然后加热，得到光学聚酰亚胺树脂。 光波导包括包含光学聚酰亚胺树脂的芯层及其包覆层。