公开(公告)号：US20190145667A1

公开(公告)日：2019-05-16

申请号：US16089994

申请日：2017-03-23

申请人： NEC CORPORATION

发明人： Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hisato SAKUMA ,  Masato YANO ,  Asuka MATSUBA ,  Takafumi NATSUMEDA

IPC分类号： F25B1/00 ,  F28D1/053 ,  F25B41/04

摘要： Since improving heat exchange between a gas-phase refrigerant and a liquid-phase refrigerant in a refrigeration system could instead result in a reduction in the efficiency of the whole refrigeration system, a heat exchange device (201) of the present invention includes: a refrigerant supply means (210) for supplying a first-temperature liquid-phase refrigerant (R11) and a second-temperature gas-phase refrigerant (R12) in one circulation system; a plurality of heat exchange means (220A, 220B) which are each configured so as to perform heat exchange between the liquid-phase refrigerant and the gas-phase refrigerant; and refrigerant circulation means (231, 232, 242) for circulating the gas-phase refrigerant (R12) in such a manner that the gas-phase refrigerant (R12) flows in parallel in the plurality of heat exchange means, and circulating the liquid-phase refrigerant (R11) in such a manner that the liquid-phase refrigerant (R11) flows in series in the plurality of heat exchange means.

公开(公告)号：US20180073764A1

公开(公告)日：2018-03-15

申请号：US15561633

申请日：2016-03-30

申请人： NEC Corporation ,  NEC Facilities, Ltd.

发明人： Minoru YOSHIKAWA ,  Kazuo WATANABE ,  Masanori SATO ,  Arihiro MATSUNAGA

IPC分类号： F24F11/053 ,  F28D15/06 ,  F24F3/044 ,  G06F1/20 ,  H05K7/20

CPC分类号： F24F11/76 ,  F24F3/044 ,  F24F5/0021 ,  F24F11/77 ,  F28D15/06 ,  G06F1/20 ,  H05K7/20145 ,  H05K7/20745 ,  H05K7/20827 ,  H05K7/20836 ,  Y02E60/147

摘要： A cooling system employing a phase-change cooling apparatus together with an air conditioner becomes complex and increases in cost if it is configured to maximize the efficiency of the entire cooling system; therefore, a phase-change cooling apparatus according to an exemplary aspect of the present invention includes a heat receiving means for vaporizing refrigerant liquid stored and producing refrigerant vapor by receiving heat exhausted from a heating section having breathed in cold air; a heat radiation means for liquefying the refrigerant vapor and producing refrigerant liquid by radiating heat of the refrigerant vapor to cooling air by a fan; a vapor tube connecting the heat receiving means to the heat radiation means, the refrigerant vapor mainly flowing through the vapor tube; a liquid tube connecting the heat receiving means to the heat radiation means, the refrigerant liquid mainly flowing through the liquid tube; and a control means for controlling a rotation rate of the fan, wherein the control means controls the rotation rate of the fan so that a vapor temperature that is a temperature of the refrigerant vapor may approach an intake-air temperature that is a temperature of the cold air.

公开(公告)号：US20160014928A1

公开(公告)日：2016-01-14

申请号：US14768917

申请日：2014-02-19

申请人： NEC CORPORATION

发明人： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC分类号： H05K7/20

CPC分类号： H05K7/20145 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/202 ,  H05K7/205

摘要： An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

摘要翻译： 电子板200具有安装在其上的发热部件220。 外壳300容纳电子板200.热传输单元400耦合到外壳300，并将由发热部件220产生的热量输送到外部。 在热传输单元400,400A中设置有热量接收单元510。 受热单元510接收由发热组件220产生的热量。散热单元530以散热单元530的一部分暴露于外部空气的方式设置在热传输单元400中，并且耦合 散热单元530将由热接收单元510接收的热量散发到外部。 导管单元340形成为将发热部件220和热接收单元510互连的管，以便将发热部件220的热量释放到热接收单元510.这使得电子板上的发热部件 以小而简单的结构被有效地冷却。

公开(公告)号：US20160295749A1

公开(公告)日：2016-10-06

申请号：US15037859

申请日：2014-11-14

申请人： NEC Corporation

发明人： Minoru YOSHIKAWA ,  Kenichi INABA ,  Masanori SATO ,  Akira SHOUJIGUCHI ,  Arihiro MATSUNAGA ,  Masaki CHIBA

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20818 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2015/0216 ,  F28F2250/06 ,  G06F1/20

摘要： A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

摘要翻译： 蒸气管103将散热部200与多个受热部102中的每一个连接。液体管104将散热部200与多个受热部102连接。旁通管105将蒸气 管道103和液体管道104.阀门106打开和关闭旁通管道105的流路。第一连接部分107连接蒸汽管道103和旁路管道105.第二连接部分108将液体管道103和 旁通管105.第一连接部107设置在比第二连接部108高的位置。结果，可以在短时间内有效地输送制冷剂。

公开(公告)号：US20160014933A1

公开(公告)日：2016-01-14

申请号：US14769935

申请日：2014-02-19

申请人： NEC CORPORATION

发明人： Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Masaki CHIBA ,  Akira SHOUJIGUCHI ,  Kenichi INABA

IPC分类号： H05K7/20 ,  B23P19/00

CPC分类号： H05K7/20818 ,  B23P19/00 ,  F28D15/0266 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20827

摘要： [Problem]To provide an electronic apparatus cooling system having superior cooling characteristics and portability.[Solution] A rack 2 is installed within a container 1. A heat receiving apparatus 3 is disposed on a lateral face of the rack 2, and receives heat emitted within the rack 2 by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube 6 is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus 3. A heat radiating apparatus 4 is disposed above the rack 2 outside the container 1, and radiates the heat which the heat receiving apparatus 3 has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube 6, making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube 7 transports the liquid-phase cooling medium from the heat radiating apparatus 4 to the heat receiving apparatus 3. The gaseous-phase tube 6 further comprises a gaseous-phase tube bend part 6c whereat cooling medium droplets, which arise from the condensation of the gaseous phase cooling medium as a result of the gaseous-phase tube 6 being exposed to the environment external to the container 1, are collected.

摘要翻译： 提供具有优异的冷却特性和便携性的电子设备冷却系统。 [解决方案]机架2安装在容器1内。热接收装置3设置在齿条2的侧面上，并且通过液相冷却介质接收气体发生的气体发生的热量， 相冷却介质。 气相管6设置在铅垂方向延伸，并从热接收装置3输送气相冷却介质。散热装置4设置在容器1外部的齿条2的上方，并辐射热量 通过冷却从气相管6流出的气相冷却介质，接收热量接收装置3，使气相冷却介质进入液相冷却介质。 液相管7将液相冷却介质从散热装置4输送到热接收装置3.气相管6还包括气相管弯曲部6c，其中冷却介质液滴由 收集由于气相管6暴露于容器1外部的环境导致的气相冷却介质的冷凝。

公开(公告)号：US20150351286A1

公开(公告)日：2015-12-03

申请号：US14649172

申请日：2013-12-03

申请人： NEC CORPORATION

发明人： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC分类号： H05K7/20

CPC分类号： H05K7/20663 ,  F25B1/00 ,  F25B21/02 ,  F25B2339/047 ,  F25B2400/24 ,  H05K7/20818

摘要： The present invention includes: a heat receiving portion that receives heat generated by an electronic apparatus and causes a phase of a first heating medium to change from a liquid phase to a gas; a heat radiating portion that causes a phase of the first heating medium to change from the gas to the liquid and supplies the first heating medium to the heat receiving portion; and a compressor that raises a temperature of the first heating medium supplied from the heat receiving portion and supplies the first heating medium to the heat radiating portion.

摘要翻译： 本发明包括：受热部，其接收由电子设备产生的热量，并使第一加热介质的相位从液相变为气体; 散热部，其使所述第一加热介质的相位从所述气体向所述液体变化，并将所述第一加热介质供给到所述受热部; 以及压缩机，其升高从所述受热部供给的所述第一加热介质的温度，并将所述第一加热介质供给到所述散热部。

公开(公告)号：US20170311485A1

公开(公告)日：2017-10-26

申请号：US15514081

申请日：2015-09-15

申请人： NEC Corporation

发明人： Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Arihiro MATSUNAGA ,  Masanori SATO

IPC分类号： H05K7/20 ,  B23P15/26

CPC分类号： H05K7/20663 ,  B23P15/26 ,  F28D15/0241 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20809

摘要： It is impossible to avoid the increase in device cost and maintenance cost in order to cool a heat source efficiently using a natural-circulation type phase-change cooling device; therefore, a cooling device according to an exemplary aspect of the present invention includes a heat receiving unit for receiving heat; a condensing unit for releasing heat; and a refrigerant intermediary unit for connecting the heat receiving unit with the condensing unit, and transporting refrigerant circulating between the heat receiving unit and the condensing unit, wherein the refrigerant intermediary unit includes a refrigerant retaining unit for retaining the refrigerant, a primary tube connecting the refrigerant retaining unit with the condensing unit, and a secondary tube connecting the refrigerant retaining unit with the heat receiving unit and including a bendable tube.

公开(公告)号：US20170303432A1

公开(公告)日：2017-10-19

申请号：US15514067

申请日：2015-09-15

申请人： NEC Corporation

发明人： Arihiro MATSUNAGA ,  Masanori SATO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Minoru YOSHIKAWA

IPC分类号： H05K7/20 ,  B01D19/00

CPC分类号： H05K7/20327 ,  B01D19/00 ,  F25B41/00 ,  F25B43/00 ,  F28D15/0258 ,  F28D15/0266 ,  F28D15/043 ,  H01L23/427 ,  H05K7/20 ,  H05K7/20309 ,  H05K7/20318

摘要： If a gas-liquid separation structure is introduced into a phase-change cooling device to prevent the cooling performance from decreasing, manufacturing costs increase; therefore, a refrigerant intermediary device according to an exemplary aspect of the present invention includes a refrigerant container configured to contain refrigerant; a first inlet, provided for an outer periphery of the refrigerant container, through which a vapor-phase refrigerant and a first liquid-phase refrigerant flowing in; a first outlet, provided for the outer periphery of the refrigerant container, through which the vapor-phase refrigerant flowing out; a second inlet, provided for the outer periphery of the refrigerant container, through which a second liquid-phase refrigerant flowing in; and a second outlet, provided for the outer periphery of the refrigerant container, through which the first liquid-phase refrigerant and the second liquid-phase refrigerant flowing.

公开(公告)号：US20170280590A1

公开(公告)日：2017-09-28

申请号：US15506513

申请日：2015-08-19

申请人： NEC Corporation

发明人： Masaki CHIBA ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Arihiro MATSUNAGA ,  Masanori SATO

IPC分类号： H05K7/20 ,  F28D15/02

CPC分类号： H05K7/20327 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/20318 ,  H05K7/20827

摘要： In a natural-circulation type phase-change cooling device, the cooling performance is degraded if the number of heat sources to be cooled increases; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units for respectively holding refrigerant receiving heat from a plurality of heat sources; a condensing unit for generating refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure configured to connect the heat receiving units to the condensing unit and transport the refrigerant vapor; a refrigerant liquid transport structure configured to connect the heat receiving units to the condensing unit and transport the refrigerant liquid; wherein the refrigerant vapor transport structure includes a plurality of sub-vapor-pipes respectively connected to the plurality of heat receiving units, a vapor joining portion connected to the plurality of sub-vapor-pipes, with the refrigerant vapor meeting, and a main-vapor-pipe connecting the vapor joining portion to the condensing unit.

公开(公告)号：US20160174417A1

公开(公告)日：2016-06-16

申请号：US14903205

申请日：2014-07-10

申请人： NEC CORPORATION

发明人： Mahiro HACHIYA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  F28D15/0266 ,  F28D15/06 ,  H05K7/20736 ,  H05K7/208

摘要： A control mechanism becomes complex when an optimum volume of refrigerant is stably supplied to a plurality of objects to be cooled that have differing heat generation values. The present invention is a cooling system which comprises a first refrigerant tank that stores a liquid-phase refrigerant, a plurality of evaporators that gasify the liquid-phase refrigerant supplied from the first refrigerant tank, a condenser that liquefies the gas-phase refrigerant that was gasified by the evaporators, a vapor pipe that connects the evaporators and the condenser and in which the gas-phase refrigerant flows, and a liquid pipe that connects the condenser and the first refrigerant tank and connects the first refrigerant tank and the plurality of evaporators and in which the liquid-phase refrigerant flows, wherein the condenser is located higher than the plurality of evaporators, and the first refrigerant tank is located lower than the condenser.

摘要翻译： 当将制冷剂的最佳体积稳定地供给到具有不同发热量的待冷却对象物时，控制机构变得复杂。 本发明是一种冷却系统，其包括储存液相制冷剂的第一制冷剂罐，使从第一制冷剂罐供给的液相制冷剂气化的多个蒸发器，将液化制冷剂液化的冷凝器， 由蒸发器气化，将蒸发器和冷凝器连接并且其中气相制冷剂流动的蒸汽管和连接冷凝器和第一制冷剂罐并连接第一制冷剂罐和多个蒸发器的液体管和 其中液相制冷剂流动，其中冷凝器位于比多个蒸发器高的位置，并且第一制冷剂罐位于比冷凝器低的位置。