公开(公告)号：US20240166874A1

公开(公告)日：2024-05-23

申请号：US18300383

申请日：2023-04-13

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Yu-Ting Liu ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Wei-Ru Huang

IPC分类号： C08L79/08 ,  C08K3/36 ,  C08K5/5415

CPC分类号： C08L79/08 ,  C08K3/36 ,  C08K5/5415 ,  C08L2205/025 ,  C08L2205/035

摘要： A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.

公开(公告)号：US20240166859A1

公开(公告)日：2024-05-23

申请号：US18087757

申请日：2022-12-22

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC分类号： C08L47/00 ,  C08K3/36 ,  C08K7/18 ,  C08K9/04 ,  C08L77/00

CPC分类号： C08L47/00 ,  C08K3/36 ,  C08K7/18 ,  C08K9/04 ,  C08L77/00 ,  C08K2201/003

摘要： A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture comprising styrene, divinylbenzene and ethylene, a second resin polymerized by modified dicyclopentadiene diamine and maleic anhydride, and a SBS resin. The resin composition of the disclosure may have a high glass transition temperature and a low dielectric constant and a low dissipation factor after curing.

公开(公告)号：US20240228779A1

公开(公告)日：2024-07-11

申请号：US18170529

申请日：2023-02-17

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC分类号： C08L79/04 ,  C08L71/12 ,  C08L79/08

CPC分类号： C08L79/04 ,  C08L71/12 ,  C08L79/08 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035

摘要： A resin composition includes CE resin, BMI resin, and a modified polyphenylene ether resin has a following general formula:






wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

公开(公告)号：US20240150568A1

公开(公告)日：2024-05-09

申请号：US18184696

申请日：2023-03-16

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Wei-Ru Huang

IPC分类号： C08L27/18

CPC分类号： C08L27/18 ,  C08L2201/08 ,  C08L2205/025

摘要： The invention provides a high thermal conductivity fluororesin composition and products thereof. The high thermal conductivity fluororesin composition includes a polytetrafluoroethylene resin, a fluorine-containing copolymer, spherical inorganic fillers and impregnation aids.

公开(公告)号：US20230279226A1

公开(公告)日：2023-09-07

申请号：US17740375

申请日：2022-05-10

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Chien Kai Wei

IPC分类号： C08L79/08 ,  C08G73/10

CPC分类号： C08L79/08 ,  C08G73/1032 ,  C08G73/105 ,  C08G73/1082 ,  C08G73/1042 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16

摘要： A polyimide resin is obtained by polymerizing a modified polyphenylene ether resin with terminal amine groups and tetracarboxylic dianhydride. The polyimide has the following characteristics: the dissipation factor under 10 GHz electromagnetic wave is less than 0.0040; the water absorption rate is less than 0.3%; or, the temperature of glass transition is greater than 250° C.

公开(公告)号：US20240174849A1

公开(公告)日：2024-05-30

申请号：US18071629

申请日：2022-11-30

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC分类号： C08L47/00 ,  C08J5/24

CPC分类号： C08L47/00 ,  C08J5/244 ,  C08J2347/00 ,  C08J2471/12

摘要： A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.

公开(公告)号：US20240174779A1

公开(公告)日：2024-05-30

申请号：US18149155

申请日：2023-01-03

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu ,  HungFan Lee

IPC分类号： C08F212/08 ,  C08F210/02 ,  C08F212/36 ,  C08F236/06 ,  C08G65/48 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5425 ,  C08K9/08

CPC分类号： C08F212/08 ,  C08F210/02 ,  C08F212/36 ,  C08F236/06 ,  C08G65/485 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5425 ,  C08K9/08 ,  C08G2650/04 ,  C08K2201/003

摘要： A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.

公开(公告)号：US20240158632A1

公开(公告)日：2024-05-16

申请号：US18074526

申请日：2022-12-05

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC分类号： C08L71/12

CPC分类号： C08L71/123 ,  C08L2205/03

摘要： A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.

公开(公告)号：US20240228767A1

公开(公告)日：2024-07-11

申请号：US18170561

申请日：2023-02-17

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC分类号： C08L63/00

CPC分类号： C08L63/00 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035

摘要： A resin composition includes an epoxy resin, a benzoxazine resin, a BMI resin, and a modified polyphenylene ether resin has a structure represented by the following formula:






wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups, and n is an integer ranging from 3 to 25.

公开(公告)号：US20240166866A1

公开(公告)日：2024-05-23

申请号：US18182399

申请日：2023-03-13

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Wei-Ru Huang

IPC分类号： C08L71/00

CPC分类号： C08L71/00 ,  C08L2201/08

摘要： A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 μm to 0.6 μm. An average particle size of the second inorganic filler is 20 μm to 50 μm.