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公开(公告)号：US11848135B2
公开(公告)日：2023-12-19
申请号：US17935448
申请日：2022-09-26
发明人： Yasuhiro Itani , Takashi Sukegawa , Takanori Suzuki , Yuuki Kitadai , Yoshifumi Maki , Reiichi Matsuba
CPC分类号： H01F17/045 , H01F27/027 , H01F27/2823 , H01F27/292 , H01F27/306 , H01F41/0246 , H01F41/06
摘要： A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.
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公开(公告)号：US11495385B2
公开(公告)日：2022-11-08
申请号：US16850949
申请日：2020-04-16
发明人： Yasuhiro Itani , Takashi Sukegawa , Takanori Suzuki , Yuuki Kitadai , Yoshifumi Maki , Reiichi Matsuba
摘要： A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.
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公开(公告)号：US11170935B2
公开(公告)日：2021-11-09
申请号：US15661739
申请日：2017-07-27
IPC分类号： H01F41/12 , H01G4/224 , H01G2/20 , H01G4/252 , H01F41/04 , H01G4/232 , H01F41/00 , H01F17/00 , H01F27/02 , H01F41/10 , H01F27/28 , H01F27/29 , H01F27/32 , H01G4/30 , H01G4/12 , H01F17/04
摘要： A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.
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公开(公告)号：US12131856B2
公开(公告)日：2024-10-29
申请号：US18529883
申请日：2023-12-05
发明人： Takashi Sukegawa , Yasuhiro Itani , Takanori Suzuki , Yuuki Kitadai , Yoshifumi Maki , Reiichi Matsuba
CPC分类号： H01F17/045 , H01F27/027 , H01F27/2823 , H01F27/292 , H01F27/306 , H01F41/0246 , H01F41/06
摘要： A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).
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公开(公告)号：US10998117B2
公开(公告)日：2021-05-04
申请号：US15802581
申请日：2017-11-03
发明人： Kohei Kobayashi , Yoshifumi Maki , Takuya Ishida , Shinya Hirai
摘要： A wire-wound coil component includes a core having a spool and a flange, a wire wound around the spool, and an outer electrode to which an end portion of the wire is electrically coupled. The flange has a lateral surface and a bottom surface. The outer electrode has a metal thin-film section in contact with the lateral surface and a thick-film electrode section which is a metal composite film in contact with the bottom surface.
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公开(公告)号：US12014861B2
公开(公告)日：2024-06-18
申请号：US18170419
申请日：2023-02-16
发明人： Yoshifumi Maki , Takuya Ishida , Shinya Hirai
IPC分类号： H01F27/28 , C04B35/26 , C04B41/00 , C04B41/45 , C04B41/88 , H01F17/00 , H01F27/29 , H01F41/04 , H01F41/10 , H01G4/232 , H01G4/30
CPC分类号： H01F27/2804 , C04B35/26 , C04B41/009 , C04B41/4564 , C04B41/88 , H01F17/0013 , H01F27/292 , H01F41/041 , H01F41/046 , H01F41/10 , H01G4/232 , H01G4/30 , Y10T29/4902 , C04B41/009 , C04B35/26 , C04B41/4564 , C04B41/5127
摘要： A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.
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公开(公告)号：US11676754B2
公开(公告)日：2023-06-13
申请号：US16848771
申请日：2020-04-14
发明人： Takashi Sukegawa , Yasuhiro Itani , Takanori Suzuki , Yuuki Kitadai , Yoshifumi Maki , Reiichi Matsuba
IPC分类号： H01F27/28 , H01F27/29 , H01F27/24 , H01F41/02 , H01F41/064
CPC分类号： H01F27/2823 , H01F27/24 , H01F27/29 , H01F41/0246 , H01F41/064
摘要： A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a plate member that is mounted on the first flange portion and the second flange portion. A distance in a height direction between the plate member and the first flange portion, or a distance in the height direction between the plate member and the second flange portion, or both vary in a length direction, or in a width direction, or both.
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公开(公告)号：US11462346B2
公开(公告)日：2022-10-04
申请号：US16850996
申请日：2020-04-16
发明人： Takashi Sukegawa , Yasuhiro Itani , Yoshifumi Maki , Takanori Suzuki , Yuuki Kitadai , Reiichi Matsuba
摘要： A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion, a first terminal electrode and a second terminal electrode that are disposed on the first flange portion, and a third terminal electrode and a fourth terminal electrode that are disposed on the second flange portion. A length of the winding portion along a bottom surface of the winding core portion is shorter than a length of the winding portion along an upper surface of the winding core portion.
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公开(公告)号：US10242789B2
公开(公告)日：2019-03-26
申请号：US15175655
申请日：2016-06-07
摘要： A manufacturing method that is capable of forming an electrode on any part of a surface of a sintered ceramic body in accordance with a simple approach, and a ceramic electronic component manufactured by the method. The method for manufacturing a ceramic electronic component includes steps of preparing a sintered ceramic body containing a metal oxide, irradiating an electrode formation region on a surface of the ceramic body with a laser to partially lower resistance of the ceramic body, thereby forming a low-resistance portion, and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and growing the plated metal to extend over the entire electrode formation region.
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公开(公告)号：US11875927B2
公开(公告)日：2024-01-16
申请号：US16850977
申请日：2020-04-16
发明人： Takashi Sukegawa , Yasuhiro Itani , Takanori Suzuki , Yuuki Kitadai , Yoshifumi Maki , Reiichi Matsuba
CPC分类号： H01F17/045 , H01F27/027 , H01F27/2823 , H01F27/292 , H01F27/306 , H01F41/0246 , H01F41/06
摘要： A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).
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