Multilayer ceramic substrate and manufacturing method therefor
    2.
    发明申请
    Multilayer ceramic substrate and manufacturing method therefor 审中-公开
    多层陶瓷基板及其制造方法

    公开(公告)号:US20020026978A1

    公开(公告)日:2002-03-07

    申请号:US09941180

    申请日:2001-08-27

    Abstract: A multilayer ceramic substrate three-dimensionally including functional elements is provided. The functional elements, for example, a capacitor element, an inductor element or a resistor element, are prepared using plate-like sintered plates produced by firing ceramic functional material beforehand. These functional elements are included in an unsintered composite laminate. The unsintered composite laminate is provided with green layers for the substrate, restriction layers including sintering-resistant materials, and wiring conductors, and when it is fired, the green layers for substrate are prevented from shrinking in the direction of primary faces due to the function of the restriction layers. Therefore, the unsintered composite laminate can be fired without problems while the functional elements are included, and mutual diffusion does not occur between the functional elements and the green layers for substrate, so that the characteristics of the functional elements can be maintained even after firing.

    Abstract translation: 提供三维地包括功能元件的多层陶瓷基板。 使用预先烧制陶瓷功能材料制成的板状烧结板来制备功能元件,例如电容器元件,电感元件或电阻元件。 这些功能元素包括在未烧结的复合层压材料中。 未烧结复合层叠体设置有用于基板的绿色层,包括耐烧蚀材料的限制层和布线导体,并且当其被烧制时,由于功能,防止基板的绿色层在主面的方向上收缩 的限制层。 因此,在包含功能元件的同时,可以无问题地烧结未烧结的复合层压体,并且功能元件与基板的生层之间不会发生相互扩散,从而即使在烧成后也能够维持功能元件的特性。

    Multilayered ceramic substrate and production method therefor
    3.
    发明申请
    Multilayered ceramic substrate and production method therefor 有权
    多层陶瓷基板及其制造方法

    公开(公告)号:US20020062552A1

    公开(公告)日:2002-05-30

    申请号:US10001316

    申请日:2001-11-01

    CPC classification number: H01L21/481 Y10T29/49124

    Abstract: In a ceramic green-sheet stack to be fired to form a multilayered ceramic substrate having a cavity, a shrinkage-reducing pad is formed along a boundary interface between first ceramic green sheets having an opening for defining a cavity, and second ceramic green sheets having no opening. The shrinkage-reducing pad is exposed on the entire periphery of the inner peripheral surface of the cavity at the bottom end of the inner peripheral surface. The shrinkage-reducing pad contains a glass component, and serves to reduce shrinkage stress produced at the boundary interface between the first and second ceramic green sheets during the firing process.

    Abstract translation: 在烧成陶瓷生片叠层以形成具有空腔的多层陶瓷基板的情况下,沿着具有用于形成空腔的开口的第一陶瓷生片之间的边界界面形成收缩减少垫,并且具有第 没有开放 收缩减少垫在内周面的底端的空腔的内周面的整个周边露出。 收缩减少垫包含玻璃成分,用于在烧制工序中减少在第一和第二陶瓷生片之间的边界界面产生的收缩应力。

    Manufacturing method for multilayer ceramic device
    4.
    发明申请
    Manufacturing method for multilayer ceramic device 审中-公开
    多层陶瓷器件的制造方法

    公开(公告)号:US20010022416A1

    公开(公告)日:2001-09-20

    申请号:US09750497

    申请日:2000-12-28

    CPC classification number: H01L21/4807 B32B3/26 B32B2309/02 B32B2315/02

    Abstract: A method of manufacturing a multilayer ceramic device includes forming first and second glass-ceramic green sheets from a ceramic material containing glass by laminating the material to form a green sheet laminate having a cavity with an open surface at one surface thereof. Then, shrinkage-suppressing layers which are formed with shrinkage-suppressing inorganic material having a higher sintering temperature than the ceramic material are applied over the surfaces of the green sheet laminate. Thus, a composite laminate is obtained. Then, the composite laminate is pressed in the laminating direction such that the bottom portion of the cavity receives the same amount of pressure as the surrounding region of the cavity via an opening. Then, the composite laminate is fired, and the shrinkage-suppressing layers are removed.

    Abstract translation: 一种制造多层陶瓷器件的方法包括通过层压材料从包含玻璃的陶瓷材料形成第一和第二玻璃陶瓷生片,以形成具有在其一个表面处具有开放表面的空腔的生片层压体。 然后,在生片层叠体的表面上涂布由具有比陶瓷材料更高的烧结温度的收缩抑制无机材料形成的收缩抑制层。 因此,得到复合层叠体。 然后,复合层叠体在层叠方向被压制,使得空腔的底部经由开口接收与空腔的周围区域相同的压力量。 然后,对复合层叠体进行烧成,除去收缩抑制层。

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