公开(公告)号：US20240388214A1

公开(公告)日：2024-11-21

申请号：US18692178

申请日：2022-09-14

Applicant: Mitsubishi Electric Corporation

Inventor： Yukiko MORI ,  Kenta FUJII ,  Yoshikazu TSUNODA ,  Takashi KUMAGAI ,  Yuji SHIRAKATA ,  Norikazu HATTORI ,  Yoshimichi SAITO

IPC: H02M7/00 ,  H01G2/08 ,  H01G2/10 ,  H01G4/32 ,  H02M7/48

Abstract: A power conversion device includes a housing, a plurality of circuit components accommodated in the housing, at least one heat dissipation plate accommodated in the housing, and a substrate. Each of the plurality of circuit components includes an element body and a current-carrying terminal electrically connected to an electrode surface of the element body. The substrate is electrically connected to the current-carrying terminal. The at least one heat dissipation plate is disposed between two adjacent circuit components of the plurality of circuit components and thermally connected to the housing.

公开(公告)号：US20220200236A1

公开(公告)日：2022-06-23

申请号：US17604766

申请日：2020-05-25

Applicant: Mitsubishi Electric Corporation

Inventor： Yoshimichi SAITO ,  Shuji WAKAIKI ,  Hiroshi IKARASHI ,  Shingo TSUDA ,  Hideyasu MACHII ,  Masato MATSUBARA

IPC: H01S5/068 ,  H01S5/40 ,  H01S5/042

Abstract: A laser beam generation device includes power supply units, LD modules, a combiner, and a control device. The LD modules receive currents from the power supply units, and output laser beams. The combiner collects the laser beams and outputs one laser beam. The control device generates control signals such that power of the laser beam becomes a laser output setting value and such that the currents become current command values. Phases of pulses of the control signals are shifted from each other by 60 degrees.

公开(公告)号：US20240244754A1

公开(公告)日：2024-07-18

申请号：US18559943

申请日：2022-06-14

Applicant: Mitsubishi Electric Corporation

Inventor： Yoshimichi SAITO ,  Yoshikazu TSUNODA ,  Kenta FUJII ,  Takashi KUMAGAI ,  Tomohito FUKUDA ,  Yuji SHIRAKATA

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H05K1/184 ,  H05K3/0085 ,  H05K2201/066 ,  H05K2201/095 ,  H05K2201/10015 ,  H05K2201/10409 ,  H05K2203/1147

Abstract: A circuit device includes: a heat sink having an upper surface orthogonal to a first direction; a plurality of first partition plates attached to the upper surface and extending in a second direction orthogonal to the first direction; a plurality of second partition plates attached to the upper surface and extending in a third direction orthogonal to the first direction and the second direction; a circuit component; a substrate electrically connected to the circuit component; and a first heat transfer member. The circuit component is housed in a space surrounded by two adjacent first partition plates, two adjacent second partition plates, and the upper surface. The first heat transfer member is disposed between the first partition plate and the circuit component.