公开(公告)号：US20150041827A1

公开(公告)日：2015-02-12

申请号：US14247272

申请日：2014-04-08

Applicant: Mitsubishi Electric Corporation

Inventor： Aya IWATA ,  Yasunari HINO

IPC: H01L23/00 ,  H01L29/16 ,  H01L23/482

CPC classification number: H01L24/05 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4827 ,  H01L24/03 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L29/1608 ,  H01L2224/0383 ,  H01L2224/04026 ,  H01L2224/05023 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2251/5369 ,  H01L2924/00014 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A bonding structure including metal nano particles includes a first member having a metal surface on at least one side, a second member having a metal surface on at least one side, the second member being disposed such that the metal surface of the second member faces the metal surface of the first member, and a bonding material bonding the first member and the second member by sinter-bonding the metal nano particles. At least one of the metal surfaces of the first member and the second member is formed to be a rough surface having a surface roughness within the range from 0.5 μm to 2.0 μm.

Abstract translation: 包括金属纳米颗粒的粘合结构包括在至少一侧具有金属表面的第一构件，在至少一个侧面上具有金属表面的第二构件，第二构件设置成使得第二构件的金属表面面向 第一构件的金属表面和通过烧结金属纳米颗粒来接合第一构件和第二构件的接合材料。 第一构件和第二构件的金属表面中的至少一个形成为表面粗糙度在0.5μm至2.0μm的粗糙表面。