摘要:
High flux semipermeable membranes which comprises the polymerized reaction product within and/or on a porous support backing material may be prepared by contacting the porous support such as a polysulfone with an aqueous solution of a polyamine which may, if so desired, contain a polar aprotic solvent not reactive with the amines, a polyhydric compound and an acid acceptor. The surface of the coated support is freed of excess solution and thereafter contacted with an organic solution of a polyacyl halide for a period of time sufficient to form a polymerized reaction product within and/or on the support material. The resulting composite is then treated with a hydroxy polycarboxylic acid, polyaminoalkylene polycarboxylic acid, suffonic acid, amine salts of acids, amino acid, amino acid salt, polymeric acid and inorganic acid, before drying of the membrane. This will enable the membrane to be stored in a dry manner prior to use thereof in a separation process. The resultant membrane composite may be used in separation processes such as desalination of brackish or sea water or the softening of domestic hard water.
摘要:
A semipermeable membrane suitable for reverse osmosis applications is prepared by interfacially reacting on a support an aromatic polyamine containing at least three and, preferably, four aromatic nuclei with a polyfunctional amine-reactive compound such as an aromatic polyacyl halide.
摘要:
A composition of matter contains as a principal component a material which acts as an ultraviolet light stabilizer. The ultraviolet light stabilizer is formed from the reaction of (a) a methylol or alkoxy alkyl-containing material, and (b) an alkyl substituted piperidine containing material which is represented by the following structural formula: ##STR1## R" is hydrogen or C.sub.1 to C.sub.6 alkyl, R.sub.10 is hydrogen or methyl,Y is a radical derived from a material selected from the group consisting of amino substituted triazines, ureas, glycolurils, phenols, and amides of the formula ##STR2## R' is hydrogen or C.sub.1 to C.sub.12 alkyl and R is an aliphatic, cycloaliphatic, or olefinic radical, or an acrylic polymer moiety having at least one group selected from hydroxyl, carboxyl, amido, and ureido, said reaction proceeding between a methylol or alkoxy alkyl group of (a) and the group selected from hydroxyl, carboxyl, amido and ureido of (b).
摘要翻译:物质成分含有作为紫外光稳定剂的材料作为主要成分。 紫外光稳定剂是由(a)含羟甲基或含烷氧基烷基的材料的反应形成的,(b)由以下结构式表示的含烷基取代的含哌啶的物质: C 1至C 6烷基,R 10为氢或甲基,Y为衍生自下列物质的基团:氨基取代的三嗪,脲,甘脲,酚和酰胺,其中R 1为氢或C 1至 C12烷基和R是脂族,脂环族或烯烃基团或具有至少一个选自羟基,羧基,酰胺基和脲基的基团的丙烯酸类聚合物部分,所述反应在(a)和(a)的羟甲基或烷氧基烷基和 该基团选自(b)的羟基,羧基,酰氨基和脲基。
摘要:
Disclosed herein is a poly(urethane-urea) which is prepared by reverse-addition of an isocyanate-terminated prepolymer to an organic medium containing an alcoholic solvent and a chain extender comprising at least two isocyanate-reactive active hydrogen groups consisting essentially of amino groups.
摘要:
A lightweight composite lid for a package containing a semiconductor device formed of a porous ceramic body filled with a material having a thermal conductivity greater than air.
摘要:
A plastisol based composition contains:(a) a copolymer of an aliphatic olefinically unsaturated material and an anhydride containing material; and(b) a polyvinyl chloride plastisol.The composition is particularly suitable for use as a sealant.
摘要:
Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
摘要:
A high solids, organic solvent based, sprayable coating composition which is capable of acid catalyzed crosslinking is composed of an active hydrogen-containing resin, a curing agent present externally and/or internally as a part of the active hydrogen-containing resin, and a catalytic amount of a non-ionic ester of a sulfonic acid. The sulfonic acid ester is represented by the following structural formula: ##STR1## wherein: Z is a radical selected from the group consisting of amino and an organic radical, said organic radical being connected to the sulfur atom by a carbon atom; ##STR2## C.sub.3 -C.sub.20 cycloalkyl; and R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 are independently hydrogen or an organic radical. These groups can be particularly described as follows:R.sub.1 is hydrogen, carboalkoxy, C.sub.3 -C.sub.20 alkyl, C.sub.6 -C.sub.18 aryl, or C.sub.3 -C.sub.20 cycloalkyl;R.sub.2 is hydrogen, carboalkoxy, C.sub.3 -C.sub.20 alkyl, C.sub.6 -C.sub.18 aryl, or C.sub.3 -C.sub.20 cycloalkyl;R.sub.3 is hydrogen, carboalkoxy, acyloxy, N-alkylcarbamyloxy, N-arylcarbamyloxy, C.sub.3 -C.sub.20 alkyl, C.sub.6 -C.sub.18 aryl, or C.sub.3 -C.sub.20 cycloalkyl;R.sub.4 is hydrogen, carboalkoxy, acyloxy, N-alkylcarbamyloxy, N-arylcarbamyloxy, C.sub.3 -C.sub.20 alkyl, C.sub.6 -C.sub.18 aryl, or C.sub.3 -C.sub.20 cycloalkyl, andR.sub.5 is hydrogen, carboalkoxy, acyloxy, N-alkylcarbamyloxy, N-arylcarbamyloxy, C.sub.3 -C.sub.20 alkyl, C.sub.6 -C.sub.18 aryl, or C.sub.3 -C.sub.20 cycloalkyl.
摘要:
A composition suitable for use as an underfill for an interconnection between a semiconductor device and a substrate, as a semiconductor device encapsulant, a dam, an adhesive for direct chip attachment, and as an electrical connection for semiconductor device and a substrate. The composition contains about 40 to 90 wt. % of an electrically conductive or non-conductive filler and a cyanate ester and epoxy resin component. The cyanate ester/epoxy resin component comprises about 10 to 70 wt. % cyanate ester material, about 30 to 90 wt. % of epoxy resin, about 0.1 to 1.5 wt. % metal chelate/amine solid curing catalyst and about 0.1 to 5 wt. % of a coupling agent.
摘要:
A polymeric reaction product, a process for its preparation and a coating composition containing the reaction product as a binder are described. The polymeric reaction product is prepared by the vinyl addition polymerization of a vinyl monomer component of which at least 50 percent by weight is an active hydrogen-containing vinyl monomer in the presence of a polymeric diluent. The rate of polymerization is controlled such that the amount of unreacted vinyl monomer, on the average, does not exceed 10 percent by weight of the total weight of the reaction mixture.