公开(公告)号：US20170104273A1

公开(公告)日：2017-04-13

申请号：US15384828

申请日：2016-12-20

Applicant: MediaTek Inc.

Inventor： Kuo-Fong HUNG ,  Chia-Wei CHI

IPC: H01Q9/42 ,  H01Q1/38 ,  H01Q5/357 ,  H01Q1/24

CPC classification number: H01Q9/42 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q5/357 ,  Y10T29/49016

Abstract: A hybrid antenna (and related method for manufacturing the antenna) includes a dielectric substrate and a stamping element. The stamping element includes a main radiator, a first holder, a second holder, a feeding element, an extension branch, a first trace, and a first via. The main radiator is substantially disposed above the dielectric substrate. The first holder is coupled to a first end of the main radiator. The second holder is coupled to a second end of the main radiator. The feeding element is coupled to a signal source. The extension branch is substantially disposed below the dielectric substrate, and is coupled between the second holder and the feeding element. The first trace is disposed on a second surface of the dielectric substrate, and the first via is formed through the dielectric substrate, and coupled between an end of the first trace and the first holder.

公开(公告)号：US20160343929A1

公开(公告)日：2016-11-24

申请号：US14717159

申请日：2015-05-20

Applicant: MediaTek Inc.

Inventor： Long-Kun YU ,  Chin-Chiang CHANG ,  Chia-Wei CHI ,  Chia-Feng YEH ,  Tai-Yu CHEN

IPC: H01L35/32 ,  H01L21/66 ,  H01L25/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/00 ,  H02J7/00 ,  H01L23/04

CPC classification number: H01L35/32 ,  H01L22/34 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/38 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L25/04 ,  H01L35/28 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/18161 ,  H02J7/0052 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

Abstract translation: 本发明提供一种便携式电子系统。 便携式电子系统包括半导体封装。 半导体封装包括衬底。 半导体管芯耦合到衬底。 热电器件芯片靠近半导体管芯设置，耦合到衬底。 热电元件芯片被配置为检测从半导体管芯产生的热能并将热能转换成再循环的电能。 电力系统耦合到半导体封装，被配置为存储再循环的电能。

公开(公告)号：US20160268690A1

公开(公告)日：2016-09-15

申请号：US15162850

申请日：2016-05-24

Applicant: MediaTek Inc.

Inventor： Kuo-Fong HUNG ,  Chia-Wei CHI

IPC: H01Q9/42 ,  H01Q1/38

CPC classification number: H01Q9/42 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q5/357 ,  Y10T29/49016

Abstract: A hybrid antenna includes a dielectric substrate and a stamping element. The stamping element includes a main radiator, a first holder, a second holder, a feeding element, and an extension branch. The main radiator is substantially disposed above the dielectric substrate. The first holder is coupled to a first end of the main radiator. The second holder is coupled to a second end of the main radiator. The feeding element is coupled to a signal source. The extension branch is substantially disposed below the dielectric substrate, and is coupled between the second holder and the feeding element.

Abstract translation: 混合天线包括电介质基板和冲压元件。 冲压元件包括主散热器，第一保持器，第二保持器，馈送元件和延伸支路。 主散热器基本上设置在电介质基板上。 第一保持器联接到主辐射器的第一端。 第二保持器联接到主辐射器的第二端。 馈电元件耦合到信号源。 延伸分支基本上设置在电介质基底的下方，并且耦合在第二保持器和馈送元件之间。