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1.发明授权Image sensor having a first light receptor substrate and a substrate with electronics mounted against the first substrate 失效图像传感器具有第一光接收器基板和具有安装在第一基板上的电子器件的基板
公开(公告)号：US5495277A
公开(公告)日：1996-02-27
申请号：US942763
申请日：1992-09-09
申请人： Masaya Imamura , Kensuke Sawase , Seiji Koshikawa
发明人： Masaya Imamura , Kensuke Sawase , Seiji Koshikawa
摘要： In an image sensor having, in a frame equipped with a transparent cover engageable with an objective, a light emitter for radiating light over the objective, an optical system for condensing light reflected from the objective and for directing the light to a predetermined position, a light receptor for receiving the light directed by said optical system, electronic elements constituting the light receptor are mounted on a long substrate, and other electronic elements are mounted on a single short substrate, which is attached to the long substrate at a portion other than the portion where the light receptor is mounted. This image sensor can be assembled in a reduced number of steps, preventing soldering flux from flying to the light receptor.
摘要翻译： 在具有配备有可与物镜接合的透明盖的框架中的图像传感器中，用于在物体上照射光的光发射器，用于聚集从物镜反射并用于将光引导到预定位置的光学系统， 用于接收由所述光学系统引导的光的光接收器，构成光接收器的电子元件安装在长基板上，并且其它电子元件安装在单个短基板上，该单个短基板在除了 安装光接收器的部分。 该图像传感器可以以减少的步数组装，防止焊剂飞溅到光接收器。
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公开(公告)号：US5383034A
公开(公告)日：1995-01-17
申请号：US945212
申请日：1992-09-15
申请人： Masaya Imamura , Kensuke Sawase , Seiji Koshikawa
发明人： Masaya Imamura , Kensuke Sawase , Seiji Koshikawa
CPC分类号： H04N1/0312 , H04N1/0314 , H04N1/0315 , H04N1/0318 , H04N2201/02404 , H04N2201/02452 , H04N2201/02487 , H04N2201/03112 , H04N2201/03154 , H04N2201/0317
摘要： An image sensor has a frame including a reading window formed therein at the top of the frame. The reading window is closed by a glass covering which is adhered to the frame through an adhesive. First and second grooves are provided in the frame to extend along the reading window. After the adhesive has been charged into the first groove, the glass covering is placed and pressed against the frame top so that the glass covering will be adhered to the frame top through the adhesive. At this time, any excess adhesive may be received and held by the second groove.
摘要翻译： 图像传感器具有在框架的顶部形成有读取窗口的框架。 阅读窗被玻璃罩封闭，玻璃罩通过粘合剂粘附到框架上。 第一和第二凹槽设置在框架中以沿着阅读窗口延伸。 在将粘合剂装入第一凹槽中之后，将玻璃盖放置并压靠在框架顶部上，使得玻璃覆盖物将通过粘合剂粘附到框架顶部。 此时，任何多余的粘合剂可以被第二槽容纳并保持。
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3.发明授权Image sensor including resilient pressing means for pressing a light receiving sensor substrate against an image sensor frame 失效图像传感器包括用于将受光传感器基板压靠在图像传感器框架上的弹性按压装置
公开(公告)号：US5194725A
公开(公告)日：1993-03-16
申请号：US820796
申请日：1992-01-15
申请人： Kensuke Sawase , Masaya Imamura
发明人： Kensuke Sawase , Masaya Imamura
CPC分类号： H04N1/0312 , H04N1/0315 , H04N1/0318 , H04N2201/02452 , H04N2201/03112 , H04N2201/03154
摘要： An image sensor includes a frame 1, a light source unit 4 located in the frame 1 for irradiating light onto an original A to be read, a light receiving sensor 5 located in the frame 1 and including a plurality of light receiving portions arranged therein, and an optical system 6 located in the frame 1 for causing the light from the original A to be received by the light receiving portions in the light receiving sensor. The image sensor also includes at least one positioning portion formed in the frame 1 at an appropriate location and used to mount the light receiving sensor substrate 3 in the frame 1 and a stopper engaging and receiving portion 12 formed in the frame at an appropriate location. A leaf spring 2 has a stopper 21 formed thereon for detachably engaging the stopper engaging and receiving portion. The light receiving sensor substrate 3 properly positioned in the frame relative to the positioning portion 11 is resiliently biased against the frame. Thus, the light receiving sensor substrate can be detachably mounted and held in the frame.
摘要翻译： 图像传感器包括框架1，位于框架1中的光源单元4，用于将光照射到待读取的原稿A上;光接收传感器5，位于框架1中并且包括布置在其中的多个光接收部分， 以及位于框架1中的用于使来自原稿A的光被光接收传感器中的光接收部分接收的光学系统6。 图像传感器还包括在适当位置处形成在框架1中的至少一个定位部分，并且用于将光接收传感器基板3安装在框架1中，以及在适当位置处形成在框架中的止动器接合和接收部分12。 板簧2具有形成在其上的止动件21，用于可拆卸地接合止动器接合和接收部分。 相对于定位部分11适当地定位在框架中的光接收传感器基板3被弹性偏压在框架上。 因此，光接收传感器基板可以可拆卸地安装并保持在框架中。
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公开(公告)号：US5434682A
公开(公告)日：1995-07-18
申请号：US951392
申请日：1992-09-25
申请人： Masaya Imamura , Hiromi Ogata , Kensuke Sawase
发明人： Masaya Imamura , Hiromi Ogata , Kensuke Sawase
CPC分类号： H04N1/0312 , H04N1/0314 , H04N1/0318 , H04N2201/03112 , H04N2201/03154
摘要： There is provided an image sensor which can reduce loss in light emitted from a light emitting section toward an object to be sensed and also variability in the distribution of light and which can be produced with a small-sized structure with a reduced number of parts and with a decreased manufacturing cost. An optical path from the light emitting section to a transparent covering on which the object is to be placed is surrounded by a light reflecting portion. Light from the light emitting section can be irradiated onto the transparent covering without reduction in the amount of light while being repeatedly reflected by the light reflecting portion. The light reflected by the object is condensed by a condensing lens, the condensed light being then received by a light receiving section mounted on the same base plate as in the light emitting section. At the light receiving section, the light is converted into an electrical signal.
摘要翻译： 提供了一种图像传感器，其可以减少从发光部分朝向待感测物体发射的光的损失，并且还可以减少光的分布，并且可以用具有减少的部件数量的小尺寸结构来产生， 制造成本降低。 从光发射部到其上要放置物体的透明覆盖层的光路被光反射部分包围。 来自发光部的光能够在光反射部反复反射的同时减少光量而照射到透明覆盖物上。 被物体反射的光被会聚透镜会聚，聚光后由与发光部相同的基板安装的受光部接收。 在光接收部分，光被转换成电信号。
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公开(公告)号：US5434681A
公开(公告)日：1995-07-18
申请号：US53164
申请日：1993-04-27
申请人： Masaya Imamura , Kensuke Sawase
发明人： Masaya Imamura , Kensuke Sawase
CPC分类号： H04N1/031
摘要： A small-sized image sensor which does not exert the deleterious influence of soldering, especially, on the light receiving device when attaching a substrate for a light emitting device. A glass cover (11) is attached to the upper portion of a frame (10), and a substrate of a light projecting portion having a light emitting device (12) is fixed to the frame (10) in such a manner as to be inclined toward the glass cover (11). A rod lens array (14) for converging the light reflected from a copy on the glass cover (11) is fixed to the frame (10) in such a manner as to be perpendicular to the glass cover (11). A sensor substrate (16) having a light receiving device (15) is disposed directly under the rod lens array (14), and a hybrid substrate (21) with an electronic part (20) mounted thereon is disposed in a space within the frame (10). The substrates (16) and (21) are connected by a lead frame (22 ) soldered to the bottom surface of the sensor substrate (16). The lead frame also supports the substrate (21).
摘要翻译： 特别是在附着发光装置用基板时，不会发生焊接的有害影响的小尺寸图像传感器。 将玻璃罩（11）安装在框架（10）的上部，并且具有发光装置（12）的光投射部分的基板以如下方式固定在框架（10）上： 朝向玻璃罩（11）倾斜。 用于会聚从玻璃罩（11）上的副本反射的光的棒状透镜阵列（14）以垂直于玻璃盖（11）的方式固定到框架（10）。 具有光接收装置（15）的传感器基板（16）直接设置在杆状透镜阵列（14）的正下方，安装有电子部件（20）的混合基板（21）设置在框架 （10）。 基板（16）和（21）通过焊接到传感器基板（16）的底表面的引线框架（22）连接。 引线框架还支撑基板（21）。
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公开(公告)号：US5570122A
公开(公告)日：1996-10-29
申请号：US182726
申请日：1994-01-14
申请人： Masaya Imamura , Hiromi Ogata , Kensuke Sawase
发明人： Masaya Imamura , Hiromi Ogata , Kensuke Sawase
CPC分类号： H04N1/02427 , B41J2/315 , H04N1/024 , H04N1/02463
摘要： A glass cover is mounted on the top portion of a frame and, in the frame, a light source substrate with a light emitting element packaged therein is fixed and a rod lens array is fixed, a substrate with a light receiving element packaged therein is disposed in the lower portion of the frame, a substrate including a heating resistor is mounted in the lower portion of the frame, a drive element for driving the heating resistor is packaged on the back side of the substrate, and the drive element is electrically connected with the substrate.
摘要翻译： 玻璃盖安装在框架的顶部，并且在框架中固定具有封装在其中的发光元件的光源基板，并且固定杆透镜阵列，设置其中封装有光接收元件的基板 在框架的下部，包括加热电阻器的基板安装在框架的下部，用于驱动加热电阻器的驱动元件封装在基板的背面，驱动元件与 底物。
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公开(公告)号：US5283425A
公开(公告)日：1994-02-01
申请号：US10761
申请日：1993-01-29
申请人： Masaya Imamura
发明人： Masaya Imamura
CPC分类号： H05B33/0821 , H01L25/0753 , H05B33/0803 , G09F13/22 , H01L2924/0002
摘要： A light emitting element array substrate includes a plurality of light emitting elements arranged in line on the substrate with less dispersion in irradiation to a surface to be irradiated and can be manufactured with a reduction of cost. The light emitting element array substrate also includes light reflecting members formed on the light emitting element array substrate about light emitting elements having less irradiation. The light reflecting members re-reflect the light emitted from the light emitting elements and also reflected by surrounding parts so that the quantity of light at portions of the light emitting element array substrate having less irradiation is complemented by the re-reflected light to level the entire irradiation in the light emitting element array substrate.
摘要翻译： 发光元件阵列基板包括在基板上成行排列的多个发光元件，照射到被照射的表面上的分散度较小，并且能够以成本降低制造。 发光元件阵列基板还包括形成在发光元件阵列基板上的光反射部件，该发光元件阵列基板具有较少照射的发光元件。 光反射构件重新反射从发光元件发射的光并且也被周围部分反射，使得具有较少照射的发光元件阵列基板的部分处的光量被反射的光补足以使 在发光元件阵列基板中的全部照射。
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公开(公告)号：US06553155B1
公开(公告)日：2003-04-22
申请号：US08227992
申请日：1994-04-15
申请人： Masaya Imamura , Hiromi Ogata
发明人： Masaya Imamura , Hiromi Ogata
IPC分类号： G06K710
CPC分类号： G06K7/10722 , G06K7/10811
摘要： An image sensor can easily adjust the focus by the use of an inexpensive focus adjusting means even if the dimensional accuracy in the image sensor frame is very low. In the image sensor or an optical character reader incorporating such an image sensor, an original document W, which is being conveyed onto a transparent covering by a platen roller, is irradiated by light from a light emitting element. The light reflected by the original document W is received and condensed by a rod lens array which is positioned perpendicular to the surface of the transparent covering. The condensed light is received by a light receiving element which is located directly below the rod lens array. At the light receiving element, the light is converted into an electrical signal. The image sensor includes a frame having an opened top which includes inner tapered sidewalls opposed to each other. When a transparent covering having the conventional configuration is to be mounted in the opened top of the frame, the focal length H can be easily adjusted by changing the inclination of the transparent covering relative to the opened top of the frame.
摘要翻译： 即使图像传感器框架中的尺寸精度非常低，图像传感器也可以通过使用便宜的焦点调节装置来容易地调节焦点。 在图像传感器或包含这种图像传感器的光学字符读取器中，通过压纸辊被传送到透明覆盖物上的原稿W被来自发光元件的光照射。 由原稿W反射的光被垂直于透明罩的表面定位的杆状透镜阵列接收和聚光。 聚光由位于棒状透镜阵列正下方的光接收元件接收。 在光接收元件处，光被转换为电信号。 图像传感器包括具有开口顶部的框架，该开口顶部包括彼此相对的内锥形侧壁。 当将具有常规构造的透明覆盖物安装在框架的开口顶部时，可以通过改变透明覆盖物相对于框架的开口顶部的倾斜度来容易地调节焦距H.
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公开(公告)号：US5477329A
公开(公告)日：1995-12-19
申请号：US6631
申请日：1993-01-21
申请人： Masaya Imamura , Hiromi Ogata
发明人： Masaya Imamura , Hiromi Ogata
CPC分类号： H04N1/024
摘要： To provide an image sensor which enables internally mounted electronic parts such as a light receiving element to be protected against adverse affection at assembly of the image sensor, electronic parts in a control block to be easily adjusted after assembly, and the control block to be replaced easily and at low cost conforming to various electrical characteristic requirements, a part of a board containing a light emitting element and/or a light receiving element disposed within a frame is projected from the frame, having a glass cover on the top and side boards on both sides and terminals on one side of a connection terminal block are soldered to the projection of the board and terminals on the other side are soldered to a hybrid unit used as a control block for controlling electric signals of internally mounted electronic parts such as the light emitting and receiving elements. The hybrid unit consists of an electronic parts package and a board to which the package is soldered.
摘要翻译： 为了提供图像传感器，其能够在诸如光接收元件的内部安装的电子部件被保护以防止图像传感器的组装时的不利影响，控制块中的电子部件在组装之后容易地调整，以及待更换的控制块 容易且以低成本符合各种电气特性要求，包含发光元件和/或设置在框架内的光接收元件的板的一部分从框架突出，在顶部和侧板上具有玻璃盖 连接端子块的一侧的两侧和端子焊接到板的突起，另一侧的端子焊接到用作控制内部安装的电子部件如光的电信号的控制块的混合单元 发射和接收元件。 混合单元由电子零件封装和封装焊接的电路板组成。
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公开(公告)号：US5475417A
公开(公告)日：1995-12-12
申请号：US959652
申请日：1992-10-13
申请人： Hiromi Ogata , Norimichi Teshiba , Masaya Imamura
发明人： Hiromi Ogata , Norimichi Teshiba , Masaya Imamura
CPC分类号： B41J2/45 , H01L2224/48137 , H01L2224/48484 , H01L2224/8592 , H01L2924/01068 , H01L2924/12041 , H01L2924/1815 , H01L33/54
摘要： An LED array printhead comprises a head substrate which carries an array of semiconductor LED chips and an array of drive IC's in corresponding relation to the LED chips. Each of the LED chips has a plurality of light emitting portions. The printhead further comprises a transparent resin coating for covering at least the LED chip array. The resin coating is provided with at least one convex lens portion at a position corresponding to a selected light emitting portion of the LED whose luminance is lower than a predetermined level.
摘要翻译： LED阵列打印头包括：头基板，其承载半导体LED芯片的阵列和与LED芯片对应关系的驱动IC阵列。 每个LED芯片具有多个发光部分。 该打印头还包括用于至少覆盖LED芯片阵列的透明树脂涂层。 在与LED的亮度低于预定水平的所选发光部分对应的位置上设置有至少一个凸透镜部分的树脂涂层。
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