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1.发明授权公开(公告)号：US07841079B2
公开(公告)日：2010-11-30
申请号：US12123950
申请日：2008-05-20
申请人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
发明人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
IPC分类号： H05R3/34
CPC分类号： H05K3/3484 , H01L23/544 , H01L24/81 , H01L24/83 , H01L2223/54426 , H01L2223/54473 , H01L2224/81121 , H01L2224/81801 , H01L2224/83121 , H01L2224/83801 , H01L2924/01068 , H05K1/0269 , H05K3/0097 , H05K3/1216 , H05K3/303 , H05K2201/09918 , H05K2203/0165 , H05K2203/0545 , H05K2203/166 , Y02P70/613 , Y10T29/49131 , Y10T29/49144 , Y10T29/49179 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , H01L2924/3512 , H01L2924/00
摘要： In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.
摘要翻译： 在用于保持在载体上的多个单独基板的电子部件安装中，基于焊料印刷后的载体上的标记位置识别结果，焊料位置识别结果和表示电极位置信息的电极位置信息，针对各个基板计算焊接位置偏差数据 基于所计算的焊接位置偏差数据，对每个单独的基板执行每个单独基板上的电极的位置，用于计算位置校正数据的操作，该位置校正数据用于校正将电子部件安装在适当位置的位置偏差， 计算出的位置校正数据被馈送到电子部件安装装置，并且基于标记位置识别结果和位置校正数据来控制部件安装机构的电子部件安装操作。
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2.发明申请公开(公告)号：US20080289175A1
公开(公告)日：2008-11-27
申请号：US12123950
申请日：2008-05-20
申请人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
发明人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
IPC分类号： H05K3/34
CPC分类号： H05K3/3484 , H01L23/544 , H01L24/81 , H01L24/83 , H01L2223/54426 , H01L2223/54473 , H01L2224/81121 , H01L2224/81801 , H01L2224/83121 , H01L2224/83801 , H01L2924/01068 , H05K1/0269 , H05K3/0097 , H05K3/1216 , H05K3/303 , H05K2201/09918 , H05K2203/0165 , H05K2203/0545 , H05K2203/166 , Y02P70/613 , Y10T29/49131 , Y10T29/49144 , Y10T29/49179 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , H01L2924/3512 , H01L2924/00
摘要： In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.
摘要翻译： 在用于保持在载体上的多个单独基板的电子部件安装中，基于焊料印刷后的载体上的标记位置识别结果，焊料位置识别结果和表示电极位置信息的电极位置信息，针对各个基板计算焊接位置偏差数据 基于所计算的焊接位置偏差数据，对每个单独的基板执行每个单独基板上的电极的位置，用于计算位置校正数据的操作，该位置校正数据用于校正将电子部件安装在适当位置的位置偏差， 计算出的位置校正数据被馈送到电子部件安装装置，并且基于标记位置识别结果和位置校正数据来控制部件安装机构的电子部件安装操作。
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公开(公告)号：US08166875B2
公开(公告)日：2012-05-01
申请号：US12123959
申请日：2008-05-20
申请人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
发明人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
CPC分类号： B41F15/26 , B41F15/0818 , B41F33/0036 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K3/3484 , H05K2203/163
摘要： In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.
摘要翻译： 在提供反馈数据以改善印刷在保持在载体上的各个基板上的焊膏的位置偏差量和偏移状态时，获得每个单独基板的单独位置偏差的多个平均值，然后，如果 指示个体位置偏差的多个平均值M的最大值Mmax与最小值Mmin之间的差的偏差值＆Dgr; M小于或等于公差值＆Dgr;（t）， 获得最大值Mmax和最小值Mmin，并且基于中间值（Mmax + Mmin）/ 2来校正掩模板和载体的定位参数。
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公开(公告)号：US20080289518A1
公开(公告)日：2008-11-27
申请号：US12123959
申请日：2008-05-20
申请人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
发明人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
CPC分类号： B41F15/26 , B41F15/0818 , B41F33/0036 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K3/3484 , H05K2203/163
摘要： In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.
摘要翻译： 在提供反馈数据以改善印刷在保持在载体上的各个基板上的焊膏的位置偏差量和偏移状态时，获得每个单独基板的单独位置偏差的多个平均值，然后，如果 指示各个位置偏差的多个平均值M的最大值Mmax与最小值Mmin之间的差的偏差值DeltaM小于或等于公差值Delta（t），最大值Mmax的中间值 并且获得最小值Mmin，并且基于中间值（Mmax + Mmin）/ 2来校正掩模板和载体的定位参数。
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