Decoupled, multiple stage positioning system
    1.
    发明授权
    Decoupled, multiple stage positioning system 有权
    解耦,多级定位系统

    公开(公告)号:US07760331B2

    公开(公告)日:2010-07-20

    申请号:US11676937

    申请日:2007-02-20

    IPC分类号: G03B27/58

    摘要: A split axis stage architecture is implemented as a multiple stage positioning system that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. The substrate is precisely cut (“lapped”) such that its upper and lower stage surface portions are flat and parallel to each other.

    摘要翻译: 分裂轴台架构被实现为能够以高速和加速度的振动和热稳定材料输送的多级定位系统。 分裂轴设计使位于分离的平行平面中的两个垂直轴分离舞台运动。 用作花岗岩或其他石板或陶瓷材料或铸铁的形状的尺寸稳定的基材用作下层和上层的基材。 衬底被精确地切割(“研磨”),使得其上部和下部表面部分是平的并且彼此平行。

    DECOUPLED, MULTIPLE STAGE POSITIONING SYSTEM
    2.
    发明申请
    DECOUPLED, MULTIPLE STAGE POSITIONING SYSTEM 有权
    解码,多级定位系统

    公开(公告)号:US20080196631A1

    公开(公告)日:2008-08-21

    申请号:US11676937

    申请日:2007-02-20

    IPC分类号: A47B9/00 H01L21/00

    摘要: A split axis stage architecture is implemented as a multiple stage positioning system that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. The substrate is precisely cut (“lapped”) such that its upper and lower stage surface portions are flat and parallel to each other.

    摘要翻译: 分裂轴台架构被实现为能够以高速和加速度的振动和热稳定材料输送的多级定位系统。 分裂轴设计使位于分离的平行平面中的两个垂直轴分离舞台运动。 用作花岗岩或其他石板或陶瓷材料或铸铁的形状的尺寸稳定的基材用作下层和上层的基材。 衬底被精确地切割(“研磨”),使得其上部和下部表面部分是平的并且彼此平行。

    Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
    6.
    发明申请
    Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously 有权
    使用同轴间隔的多个激光束点的半导体结构处理

    公开(公告)号:US20050282407A1

    公开(公告)日:2005-12-22

    申请号:US11051500

    申请日:2005-02-04

    CPC分类号: B23K26/067 H01L21/76894

    摘要: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method simultaneously directs the first and second laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with one or more of the first and second laser beams simultaneously.

    摘要翻译: 方法和系统使用多个激光束选择性地照射半导体衬底上或内部的结构。 这些结构被布置成在大体上沿长度方向延伸的一排。 该方法产生沿着与半导体衬底相交的第一激光束轴传播的第一激光束和沿着与半导体衬底相交的第二激光束轴传播的第二激光束。 该方法同时将第一和第二激光束引导到行中不同的第一和第二结构。 该方法使第一激光束和第二激光束相对于半导体衬底在基本上平行于该行的长度方向的方向基本上一致地移动,以便用一个或多个第一和第二激光器选择性地照射该行中的结构 梁同时进行。

    Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
    7.
    发明申请
    Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling 有权
    半导体结构处理采用多个横向间隔的激光束点,具有接头速度分布

    公开(公告)号:US20050281102A1

    公开(公告)日:2005-12-22

    申请号:US11052014

    申请日:2005-02-04

    申请人: Kelly Bruland

    发明人: Kelly Bruland

    摘要: A method is used in processing structures on or within a semiconductor substrate using N series of laser pulses to obtain a throughput benefit, wherein N≧2. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected structures in N respective distinct rows. The method determines a joint velocity profile for simultaneously moving in the lengthwise direction the N laser beam axes substantially in unison relative to the semiconductor substrate so as to process structures in the N rows with the respective N series of laser pulses, whereby the joint velocity profile is such that the throughput benefit is achieved while ensuring that the joint velocity profile represents feasible velocities for each of the N series of laser pulses and for each of the respective N rows of structures processed with the N series of laser pulses. A semiconductor substrate is designed to have a structure layout that takes advantage of the N-fold processing parallelism provided by the N laser beams.

    摘要翻译: 使用N系列激光脉冲在半导体衬底上或半导体衬底内的处理结构中使用一种方法来获得生产效益,其中N≥2。 这些结构被布置成沿大致长度方向延伸的多个基本上平行的行。 N系列激光脉冲沿着N个相应的光束轴传播,直到在N个相应的不同行中的选定结构上入射。 该方法确定了相对于半导体衬底基本上一致地使N个激光束轴沿长度方向同时移动的关节速度分布图,以便利用相应的N系列激光脉冲处理N行中的结构,从而使关节速度分布 使得在确保联合速度分布表示对于N系列激光脉冲中的每一个以及用N系列激光脉冲处理的各个N行结构中的每一个的可行速度的同时,实现了吞吐量益处。 半导体衬底被设计成具有利用由N个激光束提供的N倍处理平行度的结构布局。

    Method for detecting particulate contamination under a workpiece
    8.
    发明授权
    Method for detecting particulate contamination under a workpiece 有权
    检测工件下颗粒污染的方法

    公开(公告)号:US08515701B2

    公开(公告)日:2013-08-20

    申请号:US12052475

    申请日:2008-03-20

    IPC分类号: G01D18/00

    CPC分类号: B23K26/04 B23K2101/40

    摘要: A method for detecting particulate contamination under a workpiece fixtured by a calibrated material handling system includes performing 3D measurements of a workpiece at multiple of positions to construct a 3D map of the workpiece, calibrating the 3D map by comparing a pre-computed calibration map to the 3D measurements, and detecting particulate contamination by processing the calibrated map.

    摘要翻译: 用于通过校准的材料处理系统检测在工件夹具下的颗粒污染物的方法包括在多个位置处执行工件的3D测量以构建工件的3D图,通过将预先计算的校准图与 3D测量,并通过处理校准的地图来检测微粒污染物。

    On-the fly laser beam path dithering for enhancing throughput
    9.
    发明授权
    On-the fly laser beam path dithering for enhancing throughput 有权
    用于增强吞吐量的飞行激光束路径抖动

    公开(公告)号:US08497450B2

    公开(公告)日:2013-07-30

    申请号:US11925562

    申请日:2007-10-26

    IPC分类号: B23K26/00 B23K26/06 B23K26/16

    CPC分类号: G02B26/101

    摘要: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

    摘要翻译: 基于激光的工件处理系统包括连接到传感器控制器的传感器,传感器控制器将传感器信号转换成聚焦点运动命令,用于致动诸如双轴转向镜的光束转向装置。 传感器可以包括用于校正在光路中检测到的误差的光束位置传感器,例如响应于激光或声光调制器指向稳定性的热感应波束漂移或光学安装动态。