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公开(公告)号：US20240045418A1
公开(公告)日：2024-02-08
申请号：US17887642
申请日：2022-08-15
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Siddha Ganju , Elad Mentovich , Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Dimitrios Syrivelis , Nikolaos Argyris , Yoram Zer , Maoz Menachem Nagler , Holger Prüsse Orup , Finn Leif Kraemer
CPC classification number: G05B23/0283 , G01R31/088 , G05B23/0254 , G05B23/0216 , G05B2223/02
Abstract: Apparatuses, systems, and techniques to monitor health data from components and predict needs for maintenance. In at least one embodiment, monitoring health data of cables having one or more known characteristics ands analyzing the health data to determine the health metrics of the one or more cable to generate profiles of the cables used to predict future health metrics of the cables and related cables sharing known characteristics.
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公开(公告)号：US20240039627A1
公开(公告)日：2024-02-01
申请号：US17896877
申请日：2022-08-26
Applicant: Mellanox Technologies, Ltd.
Inventor： Paraskevas Bakopoulos , Konstantinos Tokas , Ioannis (Giannis) Patronas , Nikolaos Argyris , Dimitrios Syrivelis , Dimitrios Kalavrouziotis , Elad Mentovich , Eitan Zahavi , Louis Bennie Capps, JR. , Prethvi Ramesh Kashinkunti , Julie Irene Marcelle Bernauer
IPC: H04B10/073 , H04B10/077 , H04B10/079
CPC classification number: H04B10/073 , H04B10/0771 , H04B10/0773 , H04B10/0791
Abstract: Systems, computer program products, and methods are described herein for network discovery, port identification, and/or identifying fiber link failures in an optical network, in accordance with an embodiment of the invention. The present invention may be configured to sequentially connect each port of an optical switch to a network port of a server and generate, based on information associated with network devices connected to the ports, a network map. The network map may identify which network devices are connected to which ports of the optical switch and may permit dynamic port mapping for network installation, upgrades, repairs, and/or the like. The present invention may also be configured to determine a fiber link in which a failure occurred and reconfigure the optical switch to allow communication between an optical time-domain reflectometer and the fiber link to test the fiber link.
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公开(公告)号：US11765188B2
公开(公告)日：2023-09-19
申请号：US17145343
申请日：2021-01-10
Applicant: Mellanox Technologies, Ltd.
CPC classification number: H04L63/1425 , G06N3/04 , G06N5/04 , H04L63/1416 , H04L69/16
Abstract: An apparatus includes multiple ports, packet communication processing circuitry coupled to the ports, and a processor that is configured to receive, from the packet communication processing circuitry, metadata that is indicative of a temporal pattern of control messages communicated via one or more of the ports, and to identify a network attack by applying anomaly detection to the temporal pattern of the control messages.
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公开(公告)号：US20230208517A1
公开(公告)日：2023-06-29
申请号：US17568441
申请日：2022-01-04
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Paraskevas Bakopoulos , Elad Mentovich , Tali Septon , Dimitrios Syrivelis , Ioannis (Giannis) Patronas , Dimitrios Kalavrouziotis , Moshe Oron
IPC: H04B10/11
CPC classification number: H04B10/11
Abstract: An apparatus comprises a support structure and one or more first optical components on the support structure that communicatively couple with a first endpoint. The one or more first optical components are configured to output and receive optical signals that travel over a free space medium to establish a secure link between the first endpoint and a second endpoint.
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公开(公告)号：US11630274B2
公开(公告)日：2023-04-18
申请号：US17315312
申请日：2021-05-09
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Dimitrios Kalavrouziotis , Donald Becker , Boaz Atias , Paraskevas Bakopoulos , Elad Mentovich
Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect includes multiple fiber cores for routing the plurality of optical communication signals between the MCM and the panel. The MCF has a first end at which the multiple fiber cores are coupled to the MCM, and a second end at which the multiple fiber cores are connected to the optical-to-optical connector on the panel.
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Patent Agency Ranking
公开(公告)号：US20240187440A1
公开(公告)日：2024-06-06
申请号：US18083981
申请日：2022-12-19
Applicant: Mellanox Technologies, Ltd.
Inventor： Ioannis (Giannis) Patronas , Paraskevas Bakopoulos , Nikolaos Argyris , Dimitrios Kalavrouziotis , Dimitrios Syrivelis , Elad Mentovich , Prethvi Ramesh Kashinkunti , Louis Bennie Capps, JR. , Julie Irene Marcelle Bernauer , Eitan Zahavi
CPC classification number: H04L63/1433 , H04L45/28 , H04Q11/0005
Abstract: Systems and methods for providing resilience in network communications are provided that leverage novel switch device architectures. An example switch device for providing resilience in network communications includes a signal routing mechanism configured to selectively provide communication between at least one first network port and two of a plurality of second network ports. The signal routing mechanism receives an indication of a malfunction associated with one of the two of the plurality of second network ports and communicably connects the at least one first network port with the other of the two of the plurality of second network port. The first network ports may be positioned in a first array and each of the plurality of second network ports may be positioned in a second array.
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公开(公告)号：US11791903B2
公开(公告)日：2023-10-17
申请号：US17608170
申请日：2019-05-13
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Elad Mentovich , Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Eyal Waldman
IPC: H04B10/524 , G02F1/21 , G02F1/225
CPC classification number: H04B10/524 , G02F1/212 , G02F1/225
Abstract: A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto. The electronic chip is configured to generate the digitally modulated driving electrical signals on multiple different lanes (16) of the electronic chip, synchronize the driving electrical signals on the multiple lanes to a same clock, separately control respective phases of the driving electrical signals, fine-tune the voltages of the driving electrical signals on the multiple lanes, and drive the photonic modulator-segments on the photonic chips with the synchronized and phase-controlled driving electrical signals.
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公开(公告)号：US11791902B2
公开(公告)日：2023-10-17
申请号：US17147312
申请日：2021-01-12
Applicant: Mellanox Technologies, Ltd.
CPC classification number: H04B10/5051 , H01S5/0078 , H01S5/0085 , H01S5/0092 , H01S5/026 , H01S5/0265 , H01S5/0604 , H01S5/1028 , H01S5/1071 , H01S5/5054
Abstract: A photonics frequency comb generator includes two integrated dies: an indium phosphide die laser of a first wavelength is grown on from, and a silicon photonics die having a microring resonator connected to the laser and frequency modulators. The microring resonator converts the first wavelength into a number of second wavelengths. One type of the microring resonator is a hybrid non-linear optical wavelength generator, comprising non-silicon materials, such as SiC or SiGe built on silicon to yield a non-linear wavelength generation. The second wavelengths are generated by adjusting the ring's geometric size and a distance between the ring and the traverse waveguide. Another type of microring resonator splits the first wavelength into a plurality of second wavelengths and transmits the multiple second wavelengths to filters and modulators, and each selects and modulates one of the second wavelengths in a one-to-one relationship. This frequency comb generator has applications in WDM/CWDM and multi-chip modules in high speed transceivers.
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公开(公告)号：US20220329322A1
公开(公告)日：2022-10-13
申请号：US17326770
申请日：2021-05-21
Applicant: Mellanox Technologies LTD.
Inventor： Nikolaos (Nikos) Argyris , Yoav Rosenberg , Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Elad Mentovich
IPC: H04B10/40 , H04B10/50 , H04B10/112 , H04B10/61
Abstract: A transceiver comprises a transmitter including a light source, a modulator coupled to the light source, a driver that drives the modulator according to a set of driving conditions to cause the modulator to output optical signals based on light from the light source, and an output that passes first portions of the optical signals output by the modulator. The transceiver further comprises a first detector that detects second portions of the optical signals output from the modulator, and a receiver including a second detector that detects optical signals from an external transmitter.
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公开(公告)号：US20220236619A1
公开(公告)日：2022-07-28
申请号：US17617603
申请日：2019-06-10
Inventor： Claudia Hoessbacher , Juerg Leuthold , Elad Mentovich , Paraskevas Bakopoulos , Dimitrios Kalavrouziotis , Dimitrios Tsiokos
Abstract: An optoelectronic device (20) includes thin film structures (56) disposed on a semiconductor substrate (54) and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack (42) of alternating metal layers (44, 46) and dielectric layers (50) is disposed over the thin film structures. The metal layers include a modulator layer (48), which contains a plasmonic waveguide (36, 99, 105) and a plurality of electrodes (30, 32, 34, 96, 98, 106), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes. An optical input coupler (38, 82) is configured to couple light into the modulator layer, whereby the light is modulated by the modulation of the SPPs, and an optical output coupler (38, 82) is configured to couple the modulated light out of the modulator layer.
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