公开(公告)号：US20210159177A1

公开(公告)日：2021-05-27

申请号：US17098659

申请日：2020-11-16

Applicant: MEDIATEK INC.

Inventor： Yi-Lin TSAI ,  Yi-Jou LIN ,  I-Hsuan PENG ,  Wen-Sung HSU

IPC: H01L23/538 ,  H01L23/00

Abstract: A semiconductor package structure includes a substrate, a bridge structure, a redistribution layer, a first semiconductor component, and a second semiconductor component. The substrate has a wiring structure. The bridge structure is over the substrate. The redistribution layer is over the bridge structure. The first semiconductor component and the second semiconductor component are over the redistribution layer, wherein the first semiconductor component is electrically coupled to the second semiconductor component through the redistribution layer and the bridge structure.

公开(公告)号：US20240297120A1

公开(公告)日：2024-09-05

申请号：US18407783

申请日：2024-01-09

Applicant: MEDIATEK INC.

Inventor： Wei-Yu CHEN ,  Yi-Lin TSAI ,  Nai-Wei LIU ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L25/16

CPC classification number: H01L23/5381 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19011 ,  H01L2924/19106

Abstract: A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second semiconductor die, a bridge structure, and a plurality of conductive bumps. The first semiconductor die and the second semiconductor die are disposed over the first redistribution layer. The bridge structure is disposed under the first redistribution layer. The first semiconductor die is electrically coupled to the second semiconductor die through the first redistribution layer and the bridge structure. The conductive bumps are disposed under the first redistribution layer and are coupled to the first redistribution layer. The bridge structure is disposed between at least two of the conductive bumps.

公开(公告)号：US20240038614A1

公开(公告)日：2024-02-01

申请号：US18342149

申请日：2023-06-27

Applicant: MEDIATEK INC.

Inventor： Yi-Lin TSAI ,  Nai-Wei LIU ,  Wen-Sung HSU

IPC: H01L23/31 ,  H01L25/16 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3157 ,  H01L25/16 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/182

Abstract: A semiconductor package structure includes a substrate, a dummy conductive mesh structure, an interposer, an underfill material, and a semiconductor die. The substrate includes a wiring structure in dielectric layers. The dummy conductive mesh structure is embedded in the substrate and is spaced apart from the wiring structure by the dielectric layers. The interposer is disposed over the substrate. The underfill material extends between the substrate and the interposer and over the dummy conductive mesh structure. The semiconductor die is disposed over the interposer and is electrically coupled to the wiring structure through the interposer.

公开(公告)号：US20220157732A1

公开(公告)日：2022-05-19

申请号：US17515864

申请日：2021-11-01

Applicant: MEDIATEK INC.

Inventor： Yi-Lin TSAI ,  Nai-Wei LIU ,  Wen-Sung HSU

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor package includes a first die structure, a first redistribution structure that is disposed on the first die structure, a second die structure that is disposed on the first redistribution structure, and a second redistribution structure that is disposed on the second die structure. The first die structure includes an interposer, and the interposer includes a semiconductor substrate and through-vias that penetrate through the semiconductor substrate. A first integrated circuit die is disposed in the semiconductor substrate of the interposer. The second die structure includes a second integrated circuit die that is encapsulated in an encapsulant and several conductive pillars that penetrate through the encapsulant. The first integrated circuit die is electrically connected to the second integrated circuit die through the first redistribution structure, the conductive pillars, and the second redistribution structure.

公开(公告)号：US20240014143A1

公开(公告)日：2024-01-11

申请号：US18331394

申请日：2023-06-08

Applicant: MEDIATEK INC.

Inventor： Yi-Lin TSAI ,  Kun-Ting HUNG ,  Yin-Fa CHEN ,  Chi-Yuan CHEN ,  Wen-Sung HSU

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L23/3128 ,  H01L25/0657 ,  H01L24/32 ,  H01L24/16 ,  H01L23/49811 ,  H01L24/73 ,  H01L25/105 ,  H01L2225/06568 ,  H01L2224/32145 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/1058

Abstract: A semiconductor package structure includes a first redistribution layer, a second redistribution layer, a first semiconductor die, a second semiconductor die, an adhesive layer, and a molding material. The second redistribution layer is disposed over the first redistribution layer. The first semiconductor die and the second semiconductor die are stacked vertically between the first redistribution layer and the second redistribution layer. The first semiconductor die is electrically coupled to the first redistribution layer, and the second semiconductor die is electrically coupled to the second redistribution layer. The adhesive layer extends between the first semiconductor die and the second semiconductor die. The molding material surrounds the first semiconductor die, the adhesive layer, and the second semiconductor die.

公开(公告)号：US20230387075A1

公开(公告)日：2023-11-30

申请号：US18303693

申请日：2023-04-20

Applicant: MEDIATEK INC.

Inventor： Yi-Lin TSAI ,  Wen-Sung HSU ,  Nai-Wei LIU

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L23/5385 ,  H01L23/5383 ,  H01L23/3185 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package includes an interposer over a substrate that includes interconnect traces, a redistribution structure on the interposer, a first semiconductor structure, a second semiconductor structure and a third semiconductor structure on the redistribution structure. The first semiconductor structure includes a first semiconductor die and a first encapsulant that encapsulates the first semiconductor die. The second semiconductor structure includes a second semiconductor die and a second encapsulant that encapsulates the second semiconductor die. The third semiconductor structure is disposed adjacent to a corner or an edge of the substrate in a top plan view of the substrate. The third semiconductor structure includes a third semiconductor die and a third encapsulant that encapsulates the third semiconductor die. The third semiconductor structure is electrically insulated from the substrate, the first semiconductor structure and the second semiconductor structure.

公开(公告)号：US20210313299A1

公开(公告)日：2021-10-07

申请号：US17208198

申请日：2021-03-22

Applicant: MEDIATEK INC.

Inventor： Yi-Lin TSAI ,  Wen-Sung HSU ,  I-Hsuan PENG ,  Yi-Jou LIN

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00

Abstract: A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor component, a conductive pillar, and a second semiconductor component. The redistribution layer is over the substrate. The first semiconductor component is over the redistribution layer. The conductive pillar is adjacent to the first semiconductor component, wherein the first semiconductor component and the conductive pillar are surrounded by a molding material. The second semiconductor component is over the molding material, wherein the second semiconductor component is electrically coupled to the redistribution layer through the conductive pillar.