公开(公告)号：US20240178112A1

公开(公告)日：2024-05-30

申请号：US18388275

申请日：2023-11-09

Applicant: MEDIATEK INC.

Inventor： Yu-Tung CHEN ,  Kuo-Lung FAN ,  Yen-Yao CHI ,  Nai-Wei LIU ,  Pei-Haw TSAO

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/532

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/53238 ,  H01L23/53266

Abstract: A semiconductor package structure includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a passivation layer on the semiconductor substrate and the conductive pad. The passivation layer exposes a portion of the top surface of the conductive pad. The semiconductor package structure also includes a conductive adhesive layer on the conductive pad, and a dielectric layer on the passivation layer and the conductive adhesive layer. The dielectric layer exposes a portion of the conductive adhesive layer. The semiconductor package structure also includes a redistribution layer (RDL) structure on the dielectric layer and electrically connected to the conductive pad through the conductive adhesive layer. The semiconductor package structure also includes a bump structure over the RDL structure.

公开(公告)号：US20210035930A1

公开(公告)日：2021-02-04

申请号：US16910354

申请日：2020-06-24

Applicant: MEDIATEK INC.

Inventor： Yen-Yao CHI ,  Nai-Wei LIU ,  Tzu-Hung LIN

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/38 ,  H01Q1/22

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an antenna device and semiconductor package. The antenna device includes a conductive pattern layer including a first antenna element, formed in an insulating substrate and adjacent to a first surface of the insulating substrate. The antenna device also includes a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The semiconductor package includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer. The semiconductor package also includes a first semiconductor die electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first semiconductor die.

公开(公告)号：US20230056550A1

公开(公告)日：2023-02-23

申请号：US18046218

申请日：2022-10-13

Applicant: MEDIATEK INC.

Inventor： Yen-Yao CHI ,  Nai-Wei LIU ,  Tzu-Hung LIN

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/38

Abstract: An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.

公开(公告)号：US20200312732A1

公开(公告)日：2020-10-01

申请号：US16903458

申请日：2020-06-17

Applicant: MEDIATEK INC.

Inventor： Yen-Yao CHI ,  Nai-Wei LIU ,  Ta-Jen YU ,  Tzu-Hung LIN ,  Wen-Sung HSU ,  Shih-Chin LIN

IPC: H01L23/31 ,  H01L23/29 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.