公开(公告)号：US20160343929A1

公开(公告)日：2016-11-24

申请号：US14717159

申请日：2015-05-20

Applicant: MediaTek Inc.

Inventor： Long-Kun YU ,  Chin-Chiang CHANG ,  Chia-Wei CHI ,  Chia-Feng YEH ,  Tai-Yu CHEN

IPC: H01L35/32 ,  H01L21/66 ,  H01L25/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/00 ,  H02J7/00 ,  H01L23/04

CPC classification number: H01L35/32 ,  H01L22/34 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/38 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L25/04 ,  H01L35/28 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/18161 ,  H02J7/0052 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

Abstract translation: 本发明提供一种便携式电子系统。 便携式电子系统包括半导体封装。 半导体封装包括衬底。 半导体管芯耦合到衬底。 热电器件芯片靠近半导体管芯设置，耦合到衬底。 热电元件芯片被配置为检测从半导体管芯产生的热能并将热能转换成再循环的电能。 电力系统耦合到半导体封装，被配置为存储再循环的电能。

公开(公告)号：US20240230720A1

公开(公告)日：2024-07-11

申请号：US18150587

申请日：2023-01-05

Applicant: MEDIATEK INC.

Inventor： Long-Kun YU ,  Zi-Ren LIU ,  Ching-Wen CHENG ,  Hsun-Wei PAO ,  Wai-Ling CHENG ,  Ping CHEN ,  Jie-Fan LAI ,  Yeng-Ming TZENG ,  Hung-Chuan CHEN ,  Chia-Hua CHOU ,  Bing-Shiun WANG ,  Chia-Lung CHUANG ,  Duen-Yi HO ,  Che-Chi HUANG

IPC: G01R15/14

CPC classification number: G01R15/144

Abstract: A detection device includes a substrate and a die. The substrate provides a first voltage. The die is disposed adjacent to the substrate. The die includes a plurality of resistor paths, a selection circuit, an ADC (Analog-to-Digital Converter), and a digital circuit. The selection circuit selects one of the resistor paths as a target path. The target path provides a second voltage. The ADC generates a digital signal according to the first voltage and the second voltage. The digital circuit processes the digital signal.

公开(公告)号：US20150295360A1

公开(公告)日：2015-10-15

申请号：US14657041

申请日：2015-03-13

Applicant: MediaTek Inc.

Inventor： Long-Kun YU

IPC: H01R13/6581

CPC classification number: H01R13/6583 ,  H01R13/6584

Abstract: A high-speed-transmission connection device includes a male connector, a cable, and a metal protrusion structure. The cable is connected to the male connector. The metal protrusion structure is formed on an outer surface of the male connector. When the male connector is connected to a female connector, the metal protrusion structure is in close contact with the inner surface of the female connector. The metal protrusion structure fills a gap between the male connector and the female connector, and prevents electromagnetic waves from leaking outwardly from the gap.

Abstract translation: 高速传输连接装置包括阳连接器，电缆和金属突起结构。 电缆连接到公连接器。 金属突起结构形成在阳连接器的外表面上。 当阳连接器连接到阴连接器时，金属突出结构与阴连接器的内表面紧密接触。 金属突起结构填充阳连接器和阴连接器之间的间隙，并且防止电磁波从间隙向外泄漏。