公开(公告)号：US20230386525A1

公开(公告)日：2023-11-30

申请号：US18124576

申请日：2023-03-22

Applicant: MEDIATEK INC.

Inventor： Bo-Yun Lin ,  Fan-Wei Liao ,  Tai-Ying Jiang ,  Ko-Ching Su ,  Chun-Yueh Kuo

IPC: G11C5/14 ,  G11C5/06

CPC classification number: G11C5/147 ,  G11C5/06

Abstract: A semiconductor die includes an on-die power switch and a target device. The on-die power switch includes a plurality of power input nodes, a power output node, and a switch circuit. The power input nodes receive a plurality of operation voltages from a plurality of different power sources, respectively. The power output node outputs a target operation voltage selected from the operation voltages. The switch circuit selectively couples one of the power input nodes to the power output node. The target device operates according to the target operation voltage supplied from the on-die power switch. The on-die power switch and the target device are separate circuit blocks of the semiconductor die.