公开(公告)号：US10295849B2

公开(公告)日：2019-05-21

申请号：US15796170

申请日：2017-10-27

Applicant: Lumentum Operations LLC

Inventor： Karl Kissa ,  Siu Kwan Cheung ,  David M. Shemo ,  David Glassner ,  Ed L. Wooten

IPC: G02F1/035 ,  G02F1/03 ,  G02F1/225

Abstract: An optical modulator may include at least one ground electrode. The optical modulator may include at least one signal electrode parallel to the at least one ground electrode. The optical modulator may include at least one waveguide parallel to the at least one ground electrode and the at least one signal electrode. The optical modulator may include a first substrate disposed underneath the at least one ground electrode and the at least one signal electrode relative to a surface of the optical modulator. The optical modulator may include a second substrate disposed underneath at least a portion of the first substrate relative to the surface of the optical modulator. The optical modulator may include a floating conductor disposed between the first substrate and the second substrate.

公开(公告)号：US12040592B2

公开(公告)日：2024-07-16

申请号：US17445786

申请日：2021-08-24

Applicant: Lumentum Operations LLC

Inventor： Wei Shi ,  Hao Huang ,  Siu Kwan Cheung ,  Huanlin Zhu ,  Lijun Zhu

IPC: H01S5/024 ,  H01L23/373 ,  H01L23/498 ,  H01S5/02315 ,  H01S5/183

CPC classification number: H01S5/02469 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49833 ,  H01S5/02315 ,  H01S5/183

Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

公开(公告)号：US11181572B2

公开(公告)日：2021-11-23

申请号：US16917124

申请日：2020-06-30

Applicant: Lumentum Operations LLC

Inventor： Yuanzhen Zhuang ,  Lucas Morales ,  Raman Srinivasan ,  Sean Burns ,  Siu Kwan Cheung ,  Tian Shi ,  Tao Li

IPC: G01R31/28

Abstract: A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.

公开(公告)号：US12166331B2

公开(公告)日：2024-12-10

申请号：US17301261

申请日：2021-03-30

Applicant: Lumentum Operations LLC

Inventor： Wei Shi ,  Siu Kwan Cheung ,  Lijun Zhu ,  Raman Srinivasan ,  Huanlin Zhu

IPC: H01S5/024 ,  H01S5/02 ,  H01S5/02315 ,  H01S5/02355 ,  H01S5/02375 ,  H01S5/183 ,  H01S5/42

Abstract: An optical device may include a substrate including a conductive core, a first layer stack on a first surface of the conductive core, a conductor-filled trench extending through the first layer stack to the conductive core such that the conductor-filled trench is on the first surface of the conductive core, and a second layer stack on a second surface of the conductive core. The optical device may include a vertical-cavity surface-emitting laser (VCSEL) chip above the conductor-filled trench. The VCSEL chip may include an array of VCSELs. A size of the conductor-filled trench may match a size of the VCSEL chip, match a size of an emission region of the array of VCSELs, or be greater than the size of the emission region of the array of VCSELs and less than the size of the VCSEL chip.