公开(公告)号：US12230579B2

公开(公告)日：2025-02-18

申请号：US18472784

申请日：2023-09-22

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Ezgi Ucar ,  Janett Martinez

IPC: H01L23/538 ,  H01L23/50 ,  H01L33/62 ,  H01R12/77

Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

公开(公告)号：US11798891B2

公开(公告)日：2023-10-24

申请号：US17747780

申请日：2022-05-18

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Ezgi Uçar ,  Janett Martinez

IPC: H01L23/538 ,  H01L23/50 ,  H01R12/77 ,  H01L33/62

CPC classification number: H01L23/5387 ,  H01L23/50 ,  H01L23/5386 ,  H01L33/62 ,  H01R12/77

Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

公开(公告)号：US20190220919A1

公开(公告)日：2019-07-18

申请号：US16110385

申请日：2018-08-23

Applicant: LOOMIA Technologies, Inc.

Inventor： Janett Martinez ,  Solomon Lederer ,  Madison Thea Maxey

IPC: G06Q30/08 ,  G06K7/10 ,  G06Q20/36

CPC classification number: G06Q30/08 ,  G06K7/10366 ,  G06Q20/367

Abstract: A method for exchanging user data for compensation may comprise: receiving data from a user pertaining to usage of a soft good, wherein the data is obtained from one or more sensors coupled to the soft good; receiving bid information from a bidder, wherein the bid information pertains to an offer to purchase the data; transmitting or displaying at least a portion of the data to the bidder; and providing compensation to the user in exchange for providing the at least a portion of the data to the bidder.

公开(公告)号：US20180317597A1

公开(公告)日：2018-11-08

申请号：US15972665

申请日：2018-05-07

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea MAXEY ,  Ezgi Uçar ,  Janett Martinez

IPC: A43B7/04 ,  A43B3/00 ,  A43B19/00 ,  A43B1/14 ,  H05B1/02 ,  H05B3/34

CPC classification number: A43B7/04 ,  A43B1/14 ,  A43B3/0005 ,  A43B7/12 ,  A43B19/00 ,  H02J7/0021 ,  H02J7/025 ,  H05B1/0252 ,  H05B3/34

Abstract: A heated article comprises a circuit board; one or more batteries electrically connected to the circuit board; a flexible heating element electrically connected to the circuit board; a control switch electrically connected to the circuit board and configured to selectively adjust the heating element; and circuitry configured to charge the one or more batteries.

公开(公告)号：US12089338B2

公开(公告)日：2024-09-10

申请号：US17150696

申请日：2021-01-15

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Janett Martinez ,  Ezgi Uçar

IPC: H05K1/18 ,  G06F3/044 ,  H05K1/02 ,  H05K3/00 ,  H05K3/04 ,  H05K3/32

CPC classification number: H05K1/189 ,  G06F3/044 ,  H05K1/0213 ,  H05K3/0011 ,  H05K3/043 ,  H05K3/32 ,  G06F2203/04112

Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

公开(公告)号：US11342271B2

公开(公告)日：2022-05-24

申请号：US16657239

申请日：2019-10-18

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Ezgi Uçar ,  Janett Martinez

IPC: H01L23/538 ,  H01L23/50 ,  H01R12/77 ,  H01L33/62

Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

公开(公告)号：US20200051919A1

公开(公告)日：2020-02-13

申请号：US16657239

申请日：2019-10-18

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Ezgi Uçar ,  Janett Martinez

IPC: H01L23/538 ,  H01R12/77 ,  H01L23/50 ,  H01L33/62

Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

公开(公告)号：US20220278047A1

公开(公告)日：2022-09-01

申请号：US17747780

申请日：2022-05-18

Applicant: LOOMIA Technologies, Inc.

Inventor： MADISON THEA MAXEY ,  Ezgi UÇAR ,  Janett Martinez

IPC: H01L23/538 ,  H01L23/50 ,  H01R12/77 ,  H01L33/62

Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

公开(公告)号：US10925168B2

公开(公告)日：2021-02-16

申请号：US15994415

申请日：2018-05-31

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Janett Martinez ,  Ezgi Uçar

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/04 ,  G06F3/044 ,  H05K3/32 ,  H05K1/02

Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

公开(公告)号：US10716341B2

公开(公告)日：2020-07-21

申请号：US15920536

申请日：2018-03-14

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Ezgi Ucar ,  Janett Martinez

IPC: A41D13/005 ,  H05K1/18 ,  H05K1/02 ,  H05B3/34 ,  A41H43/04 ,  A41D1/00 ,  H05K3/00 ,  H05K1/16 ,  A41D1/04 ,  A41D1/22 ,  H05B1/02 ,  H05K1/03 ,  H05K3/06 ,  H05K3/30 ,  H05K1/11 ,  H05K1/09 ,  H05K3/12 ,  H05K3/28

Abstract: One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second mask—mirrored image of the first mask—to a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.