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公开(公告)号：US11917280B2
公开(公告)日：2024-02-27
申请号：US18194296
申请日：2023-03-31
申请人： LG INNOTEK CO., LTD.
发明人： Jungsik Lee
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
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公开(公告)号：US09986143B2
公开(公告)日：2018-05-29
申请号：US15053340
申请日：2016-02-25
申请人： LG Innotek Co., Ltd.
发明人： Jungsik Lee
CPC分类号： H04N5/2257 , G03B3/10 , G03B13/36 , H04N5/2253 , H04N5/2254
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
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公开(公告)号：US10785396B2
公开(公告)日：2020-09-22
申请号：US16263850
申请日：2019-01-31
申请人： LG INNOTEK CO., LTD.
发明人： Jungsik Lee
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
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公开(公告)号：US20170374251A9
公开(公告)日：2017-12-28
申请号：US15053340
申请日：2016-02-25
申请人： LG Innotek Co., Ltd.
发明人： Jungsik Lee
CPC分类号： H04N5/2257 , G03B3/10 , G03B13/36 , H04N5/2253 , H04N5/2254
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
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公开(公告)号：US11647271B2
公开(公告)日：2023-05-09
申请号：US17645679
申请日：2021-12-22
申请人： LG INNOTEK CO., LTD.
发明人： Jungsik Lee
CPC分类号： H04N5/2257 , G03B3/10 , G03B13/36 , H04N5/2253 , H04N5/2254
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
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公开(公告)号：US11245828B2
公开(公告)日：2022-02-08
申请号：US16997555
申请日：2020-08-19
申请人： LG INNOTEK CO., LTD.
发明人： Jungsik Lee
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
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公开(公告)号：US10237462B2
公开(公告)日：2019-03-19
申请号：US15962741
申请日：2018-04-25
申请人： LG INNOTEK CO., LTD.
发明人： Jungsik Lee
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
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公开(公告)号：US20160173747A1
公开(公告)日：2016-06-16
申请号：US15053340
申请日：2016-02-25
申请人： LG Innotek Co., Ltd.
发明人： Jungsik Lee
IPC分类号： H04N5/225
CPC分类号： H04N5/2257 , G03B3/10 , G03B13/36 , H04N5/2253 , H04N5/2254
摘要： The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
摘要翻译： 本发明涉及一种相机模块，该模块包括：PCB; 安装在PCB上并形成有图像拾取装置的图像传感器; 安装在PCB上的基座，包括形成在下部中心的电镀部分，安装有IR滤光器的开口; 形成有导电材料的下弹簧板; 布置在下弹簧板的上表面上的间隔件，通过包围下弹簧板的周边的肋形成阶梯结构，以向下弹簧板支撑地施加压力; 包括线轴和轭的透镜致动器; 耦合到透镜致动器的上表面的上弹簧板; 以及附接到上弹簧板的上表面的盖。
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