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公开(公告)号:US20240343027A1
公开(公告)日:2024-10-17
申请号:US18683123
申请日:2021-08-13
Applicant: LG ELECTRONICS INC.
Inventor: Takashi KINO , Dongjoo YOU , Jeayoul JOUNG , Junseok LEE , Seongmoon CHO , Eungmin LEE
CPC classification number: B32B27/08 , B32B7/03 , B32B7/12 , B32B27/20 , B32B27/36 , B32B33/00 , H05K1/0373 , B32B2264/0242 , B32B2264/302 , B32B2264/303 , B32B2264/40 , B32B2264/501 , B32B2307/204 , B32B2307/514 , B32B2307/734 , B32B2457/08 , H05K2201/0195 , H05K2201/0212
Abstract: The present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. The composite polyimide substrate according to the present invention may include: a substrate main body including a polyimide of which at least a portion has been substituted with a polyester group; and polytetrafluoroethylene (PTFE) particles included in the substrate main body.
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公开(公告)号:US20240347926A1
公开(公告)日:2024-10-17
申请号:US18578545
申请日:2021-07-12
Applicant: LG ELECTRONICS INC.
Inventor: Jeayoul JOUNG , Ilnam CHO , Dongjoo YOU , Seongmoon CHO , Byeongyong PARK , Uisheon KIM
CPC classification number: H01Q21/0006 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/325 , B32B27/36 , H01Q1/2283 , H01Q21/28 , B32B2255/10 , B32B2255/205 , B32B2307/41 , B32B2307/412 , B32B2307/546 , B32B2307/7376 , B32B2457/20
Abstract: An antenna apparatus and an image display apparatus including the same are disclosed. An antenna apparatus according to an embodiment of the present disclosure comprises a substrate, a metal mesh disposed on a portion of an upper portion of the substrate, and a protective layer disposed on the metal mesh, wherein the protective layer and the substrate are more transparent than the metal mesh. Accordingly, breakage of a metal mesh inside a transparent antenna apparatus may be reduced.
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公开(公告)号:US20250034365A1
公开(公告)日:2025-01-30
申请号:US18709264
申请日:2022-11-10
Inventor: Junseok LEE , Dongjoo YOU , Jeayoul JOUNG , Seongmoon CHO , Jinkyun LEE , Seungsoo CHOI , Minkyu CHOI
IPC: C08K9/08 , B29C43/22 , C08F292/00 , C08J5/18
Abstract: The present embodiment provides a composite film in which a plurality of composite inorganic particles, which are inorganic particles having a fluoropolymer coating film formed therein, are sintered to form a plane shape. Therefore, the low dielectric inorganic particle composite film may reduce signal loss by being hybridized with an interlayer insulator in a high-frequency 5G area. The low dielectric inorganic particles may minimize transmission loss by enhancing dielectric properties when applied to a 5G smartphone substrate and an IF cable, since the composite film used as an interlayer insulator for a communication substrate material comprises only the inorganic particles. In addition, application of the low dielectric inorganic particles may be expanded to vehicles, construction, and IoT products which will use 5G communication in the future.
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