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公开(公告)号:US11623988B2
公开(公告)日:2023-04-11
申请号:US16957969
申请日:2019-11-14
Applicant: LG CHEM, LTD.
Inventor: Hyun Jin Lee , Myong Jo Ham , Soongin Kim , Eon Seok Lee
IPC: C08L81/02 , C08K3/22 , B29C45/14 , C08G75/0204 , C08K3/40 , C08K5/53 , C08K5/5415 , C08K7/14 , C08K9/06
Abstract: A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
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公开(公告)号:US12146033B2
公开(公告)日:2024-11-19
申请号:US17270804
申请日:2019-10-25
Applicant: LG CHEM, LTD.
Inventor: Myeongjin Ha , Joong Jin Han , Eunju Park , Sung Ho Lee , Myong Jo Ham , Jeongbin Lee , Youngseok Kim
IPC: C08G75/0254 , C08G75/0204 , C08G75/0209 , C08G75/0213 , C08G75/025 , C08G75/0259 , C08G75/0281 , C08K5/098
Abstract: A method is provided for preparing a low temperature thermosetting polyarylene sulfide having significantly low crystallinity while maintaining a low melt flow rate at a high polymerization yield, so as to ensure excellent laser welding property and mechanical properties even when used in a molded product on the transmitting side of laser beam by a laser welding method.
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公开(公告)号:US20220356343A1
公开(公告)日:2022-11-10
申请号:US17630867
申请日:2021-07-08
Applicant: LG CHEM, LTD.
Inventor: Gi Dae Choi , Jinseon Kim , Myong Jo Ham , Hyun Jin Lee
Abstract: A conductive resin composition including 100 parts by weight of a base resin (A), which includes a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition. The conductive resin composition has excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; can minimize the influence of moisture and heat when exposed to external environments; and thus, can be used in exterior parts to replace metal parts used in automobiles.
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公开(公告)号:US12122892B2
公开(公告)日:2024-10-22
申请号:US17293432
申请日:2020-10-28
Applicant: LG CHEM, LTD.
Inventor: Gi Dae Choi , Young Joo Kim , Myong Jo Ham , Oh Min Kwon
CPC classification number: C08K13/04 , C08J3/203 , H05K9/009 , C08K3/04 , C08K3/041 , C08K2003/0856 , C08K7/06 , C08K2201/003 , C08K2201/006 , C08K2201/011 , C08K2201/013 , C08K2201/014
Abstract: The present disclosure relates to a thermoplastic resin composition including a thermoplastic resin, carbon fiber, carbon nanotube, plate-shaped graphite, and metal fiber, which has excellent mechanical properties and electromagnetic wave shielding performance.
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公开(公告)号:US20210221954A1
公开(公告)日:2021-07-22
申请号:US17270804
申请日:2019-10-25
Applicant: LG CHEM, LTD.
Inventor: Myeongjin Ha , Joong Jin Han , Eunju Park , Sung Ho Lee , Myong Jo Ham , Jeongbin Lee , Youngseok Kim
IPC: C08G75/0254 , C08K5/098 , C08G75/0213
Abstract: A method is provided for preparing a low temperature thermosetting polyarylene sulfide having significantly low crystallinity while maintaining a low melt flow rate at a high polymerization yield, so as to ensure excellent laser welding property and mechanical properties even when used in a molded product on the transmitting side of laser beam by a laser welding method.
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公开(公告)号:US10065860B2
公开(公告)日:2018-09-04
申请号:US15505535
申请日:2015-09-17
Applicant: LG CHEM, LTD.
Inventor: Kwon Il Choi , Myong Jo Ham , Eon Seok Lee , Cheol-Hee Park , Han Nah Jeong , Jae Hyun Kim , Shin Hee Jun , Eun Kyu Seong
IPC: C08F2/40 , C08F2/00 , C08G61/04 , C01B15/16 , C01G3/00 , C01G55/00 , C08L55/02 , C08G75/0209 , C08G65/38
Abstract: The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
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